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Home > Products > Integrated Circuits (ICs) > Specialized ICs > F373DW
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F373DW

Manufacturer Part Number:
F373DW
Manufacturer / Brand
Original Factory
Part of Description:
SOP-20 91+
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 6463 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F373DW
Manufacturer / Brand Original Factory
Stock Quantity 6463 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SOP-20 91+
Lead Free Status / RoHS Status: RoHS Compliant
RFQ F373DW Datasheets F373DW Details PDF
F373DW Details PDF for FR.pdf
F373DW Details PDF for KR.pdf
F373DW Details PDF for DE.pdf
F373DW Details PDF for IT.pdf
F373DW Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the F373DW SOP-20 into a high-noise industrial environment to ensure signal integrity and reliable operation?
The F373DW SOP-20 is suitable for industrial applications, but proper PCB layout practices such as minimizing trace lengths for high-speed signals, using ground planes, and implementing decoupling capacitors near power pins are essential. Additionally, shielding sensitive input/output lines and ensuring adequate spacing between analog and digital sections can mitigate electromagnetic interference (EMI) and crosstalk in noisy environments.
Can the F373DW be used in battery-powered systems with strict power budget constraints, and what are the implications for supply voltage and quiescent current?
Yes, the F373DW can operate from a wide supply range, making it viable for low-power applications. However, designers must evaluate the device’s quiescent current under typical operating conditions and verify that it aligns with system sleep-mode requirements. If ultra-low power is critical, additional power gating or clock gating techniques may be needed to minimize static consumption during idle periods.
How does the configuration method of the F373DW affect system flexibility, and what are the risks of using external configuration memory versus internal flash programming?
The F373DW supports both internal configuration via on-chip flash and external memory interfaces. Using external memory increases design complexity and cost but allows runtime reconfiguration and code updates without reprogramming the device. Internal flash is simpler and more secure but limits flexibility. Engineers must consider boot time, reliability, and security trade-offs when selecting a configuration strategy.
When replacing an obsolete microcontroller with the F373DW, what are the primary differences in I/O pin functionality and voltage tolerance that could impact existing circuit compatibility?
The F373DW features configurable I/O banks with selectable voltage thresholds (typically supporting 1.8V to 3.3V). Unlike older parts with fixed logic levels, this requires careful matching of input thresholds with connected peripherals. Designers must verify pull-up/pull-down configurations and ensure no damage occurs if legacy devices interface directly without level shifting.
Is the F373DW suitable for automotive-grade temperature ranges, and what modifications are required for long-term reliability in harsh thermal environments?
While the F373DW operates over a standard commercial temperature range, automotive applications demand AEC-Q100 compliance and extended temperature support. For use in vehicles, additional qualification testing, conformal coating, and derating of power dissipation are recommended to enhance long-term reliability under thermal cycling and humidity exposure.
What are the timing constraints for clock generation and synchronization when using the F373DW in a multi-device communication system such as SPI or I2C?
The F373DW includes programmable clock dividers and phase-locked loop (PLL) options, allowing flexible clock generation. However, skew and jitter must be controlled when synchronizing multiple devices. Designers should adhere to maximum SPI clock frequencies specified in the datasheet and implement proper termination and layout symmetry to avoid setup/hold violations in high-speed modes.
How does the F373DW handle brownout detection and power-on reset (POR), and what precautions should be taken during supply ramp-up to prevent unintended resets?
The F373DW integrates brownout detection and POR circuitry to protect against unstable supply conditions. To ensure reliable startup, the power supply ramp rate should meet the manufacturer’s minimum rise-time specification. Slow ramp-up or voltage droop below the brownout threshold can cause repeated resets, so bulk capacitance and soft-start circuits are advised in power stage design.
Are there known limitations in using the F373DW for real-time control applications requiring deterministic interrupt response times?
The F373DW supports prioritized interrupts and fast context switching, but worst-case interrupt latency depends on pipeline flush cycles and instruction execution time. In hard real-time systems, engineers must analyze ISR timing margins and avoid long-running tasks in critical sections. Using shadow registers and optimizing interrupt service routines can help achieve deterministic behavior.
What are the migration considerations when transitioning from the F373DW to another SOP-20 package device, especially regarding pin compatibility and peripheral mapping?
Although pin-compatible in SOP-20 form factor, subtle differences in peripheral assignments, clock sources, and register maps across families require careful review. Designers should validate timing diagrams, alternate function assignments, and oscillator configurations before substituting the F373DW with another part to avoid functional regressions in existing firmware.
How does the F373DW manage electromagnetic emissions during high-frequency switching, and what layout techniques reduce radiated noise in compact PCBs?
High-frequency switching in the F373DW can generate conducted and radiated emissions. Effective mitigation includes placing decoupling capacitors within 2mm of VDD pins, minimizing loop area in power traces, and using ferrite beads or common-mode chokes where applicable. Ground stitching vias around the IC perimeter further suppress differential-mode noise propagation.

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F373DW

Original Factory

SOP-20 91+

In Stock: 6463

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