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Home > Products > Integrated Circuits (ICs) > Specialized ICs > ESDA6V8V5-5
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ESDA6V8V5-5

Manufacturer Part Number:
ESDA6V8V5-5
Manufacturer / Brand
Original Factory
Part of Description:
ESDA6V8V5-5 韦尔 SOT553
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 4200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESDA6V8V5-5
Manufacturer / Brand Original Factory
Stock Quantity 4200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description ESDA6V8V5-5 韦尔 SOT553
Lead Free Status / RoHS Status: RoHS Compliant
RFQ ESDA6V8V5-5 Datasheets ESDA6V8V5-5 Details PDF
ESDA6V8V5-5 Details PDF for KR.pdf
ESDA6V8V5-5 Details PDF for ES.pdf
ESDA6V8V5-5 Details PDF for DE.pdf
ESDA6V8V5-5 Details PDF for FR.pdf
ESDA6V8V5-5 Details PDF for IT.pdf
Package SOT553
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the ESDA6V8V5-5 into a PCB layout to ensure effective electrostatic discharge protection in industrial environments?
When integrating the ESDA6V8V5-5 in industrial applications, place it as close as possible to the I/O connector or cable entry point to minimize parasitic inductance and maximize transient suppression effectiveness. Ensure Kelvin connections for ground and signal paths, and avoid routing sensitive traces near high-noise areas. The SOT553 package’s small footprint requires careful thermal relief and solder mask clearance to maintain reliability under repeated ESD events.
Can the ESDA6V8V5-5 be used in automotive-grade systems requiring AEC-Q101 qualification, and what are the implications for long-term field deployment?
The ESDA6V8V5-5 is not inherently qualified to AEC-Q101 standards. While it may function temporarily in automotive environments, its long-term reliability under thermal cycling, humidity, and vibration—common in automotive systems—cannot be guaranteed without formal qualification testing. Engineers should verify with the manufacturer whether a qualified variant exists or consider alternative components explicitly rated for automotive use.
How does the clamping voltage of the ESDA6V8V5-5 compare to other common ESD protection diodes like the PESD3V3L4U, and what design trade-offs should be considered?
The ESDA6V8V5-5 features a low clamping voltage (~9.2V at 8kV contact discharge), making it suitable for protecting 5V-tolerant interfaces. In contrast, the PESD3V3L4U clamps closer to 3.3V but has lower surge current capability. Designers must balance clamping level against system tolerance; using a device with too low a clamping voltage may risk overstressing downstream ICs during sustained transients, while one that clamps too high may leave insufficient margin in noisy environments.
What configuration methods are available for the ESDA6V8V5-5 in multi-line protection scenarios, and how does this affect board real estate and signal integrity?
The ESDA6V8V5-5 is designed for single-line protection and cannot be paralleled internally to protect multiple lines. For multi-channel applications, discrete devices must be placed per line, increasing component count and routing complexity. This can degrade signal integrity if not carefully managed, especially on high-speed interfaces. Alternative solutions such as multi-line ESD arrays should be evaluated for scalability and space efficiency.
Is it feasible to replace the ESDA6V8V5-5 with surface-mount TVS diodes from other manufacturers, and what compatibility factors must be validated?
Replacement with equivalent TVS diodes is possible only if matching electrical characteristics—peak pulse power (typically 150W), peak pulse current (8A), and clamping voltage—are verified. However, differences in response time, package parasitics, and surge durability can impact performance in real-world ESD events. Mechanical fit must also be confirmed, as the SOT553 form factor limits interchangeability with larger packages like SOD-323.
What are the operating temperature constraints for the ESDA6V8V5-5 in continuous industrial operation, and how might thermal derating affect long-term reliability?
The ESDA6V8V5-5 typically operates from -40°C to +125°C, but continuous exposure near the upper limit reduces junction lifetime due to increased leakage current and degradation rates. Engineers should implement thermal management strategies such as adequate copper pour and spacing to prevent localized heating, especially during high-energy ESD events where transient power dissipation occurs.
Can the ESDA6V8V5-5 be used to protect USB 2.0 data lines, and what additional components are required for full compliance with interface specifications?
Yes, the ESDA6V8V5-5 can protect individual D+/D- lines from ESD up to ±15kV air discharge, which meets USB 2.0 immunity requirements. However, full compliance also demands series termination resistors, ferrite beads for EMI filtering, and proper impedance control on the PCB. Omitting these elements may result in non-compliance with USB-IF certification despite adequate ESD protection.
What are the limitations of using the ESDA6V8V5-5 in high-frequency signal paths above 100MHz, and how does capacitance impact signal integrity?
The ESDA6V8V5-5 exhibits a typical junction capacitance of ~0.5pF, which is generally acceptable for signals below 1GHz. However, on high-speed differential lines or RF interfaces exceeding 100MHz, even low capacitance can cause impedance mismatches, attenuation, or jitter. In such cases, lower-capacitance alternatives like zero-ohm resistor configurations or specialized RF ESD suppressors should be considered.
How should the ESDA6V8V5-5 be handled during reflow soldering, and what precautions are necessary to preserve its ESD protection performance?
The ESDA6V8V5-5 must be soldered within standard lead-free reflow profiles (e.g., peak temperature ≤260°C, dwell <60 seconds) to avoid damage to internal structures. Excessive thermal stress can degrade the silicon die and reduce clamping performance. Use anti-static handling procedures and grounded workstations, as static buildup during manufacturing can compromise the device before installation.
Are there any known interoperability issues between the ESDA6V8V5-5 and specific microcontroller families, particularly those with integrated ESD circuits?
Some MCUs with built-in ESD protection may exhibit reduced sensitivity to external ESD diodes if the external device clamps voltages below the internal protection threshold. With the ESDA6V8V5-5 clamping at ~9.2V, compatibility depends on the MCU’s absolute maximum rating for input pins. Always consult the target IC’s datasheet to ensure no conflict arises, and consider omitting the external diode if redundancy is present.

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ESDA6V8V5-5

Original Factory

ESDA6V8V5-5 韦尔 SOT553

In Stock: 4200

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