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Home > Products > Integrated Circuits (ICs) > Specialized ICs > 1206C
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1206C

Manufacturer Part Number:
1206C
Manufacturer / Brand
Original Factory
Part of Description:
583
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 12585 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 1206C
Manufacturer / Brand Original Factory
Stock Quantity 12585 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 583
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the 1206C capacitor be used in a high-reliability industrial application requiring extended temperature cycling between -40°C and +125°C, and what derating considerations should be applied for long-term stability?
The 1206C capacitor is rated for operation up to 125°C, making it suitable for many industrial environments. However, for applications involving repeated thermal cycling, mechanical stress from coefficient of thermal expansion (CTE) mismatch with PCB materials must be evaluated. Derate voltage by at least 30% when operating near maximum temperature to mitigate dielectric aging and reduce failure rate under stress.
What are the implications of using the 1206C ceramic capacitor in a high-humidity environment without conformal coating, and how does moisture ingress affect its electrical performance over time?
In high-humidity conditions, even hermetic packaging like SMD ceramic capacitors can experience surface leakage current increases due to adsorbed water layers. While the 1206C itself is not sealed against environmental ingress, prolonged exposure may lead to microcracking or electrode corrosion in extreme cases. Use of conformal coating or enclosure protection is recommended for long-term reliability in such environments.
When replacing the 1206C with an alternative multilayer ceramic capacitor (MLCC), what capacitance tolerance and voltage rating mismatches could cause circuit instability in a power supply bypass configuration?
Substituting the 1206C in a bypass network requires matching both nominal capacitance and voltage rating. A lower voltage rating than original increases DC bias effects, reducing effective capacitance significantly—especially in X7R dielectrics. Additionally, tight tolerance versions (e.g., ±5%) improve noise filtering accuracy compared to looser tolerances (±20%), which may degrade PSRR in sensitive analog sections.
Is it acceptable to reflow solder the 1206C capacitor using standard lead-free assembly profiles, and what peak temperature limits apply to prevent dielectric degradation?
Yes, the 1206C can be processed via standard reflow soldering per IPC-J-STD-020. However, peak temperatures exceeding 260°C for more than 30 seconds risk delamination due to internal stresses. Ensure profile compliance with JEDEC JESD22-A104; use nitrogen atmosphere if possible to minimize oxidation and promote wetting.
Can the 1206C serve as a drop-in replacement for tantalum capacitors in decoupling applications, and what design trade-offs exist regarding ESR, ESL, and surge current handling?
While physically interchangeable in size, substituting 1206C MLCCs for tantalums introduces lower equivalent series resistance (ESR) and inductance (ESL), improving high-frequency response but increasing inrush current during power-up due to lack of built-in surge limiting. Tantalums offer higher capacitance density and better bulk energy storage, so migration must include evaluation of transient response and potential need for pre-charge circuits.
What configuration methods exist to increase effective capacitance beyond the rated value when using the 1206C in parallel, and how does DC bias impact total capacitance in multi-capacitor arrays?
Connecting multiple 1206C capacitors in parallel increases total capacitance linearly, provided layout minimizes loop inductance. However, each unit experiences DC bias effects that reduce individual capacitance; this reduction compounds in practice. For stable performance, select dielectrics with minimal bias sensitivity (e.g., C0G/NP0) or oversize total capacitance by 2–3× to compensate for bias loss.
How does the self-resonant frequency (SRF) of the 1206C compare across different capacitance values, and what impact does parasitic inductance have on decoupling effectiveness above 10 MHz?
The SRF of a 1206C varies inversely with capacitance: lower-value parts (e.g., 100 nF) resonate at higher frequencies (~50–100 MHz), while larger values (e.g., 10 µF) peak below 10 MHz. Above their SRF, capacitors behave inductively, losing decoupling capability. Designers must pair capacitance value with intended frequency range and consider adding smaller, higher-SRF capacitors in parallel for broadband suppression.
Are there any known compatibility issues when integrating the 1206C into legacy designs originally specified for through-hole electrolytics, particularly regarding board layout and thermal management?
Legacy through-hole designs often assume higher thermal mass and mechanical support from radial leads. Replacing them with 1206C requires careful attention to pad design and solder fillet geometry to ensure mechanical robustness. Additionally, MLCCs do not tolerate reverse polarity, unlike polarized electrolytics, so circuit polarity must be verified before migration.
What precautions should be taken when hand-soldering the 1206C capacitor on a populated PCB, and how does localized heating affect adjacent components?
Hand-soldering requires fine-tip irons (<35 W) and brief contact times (<3 seconds) to avoid thermal shock. Excessive heat can crack the ceramic body or damage nearby SMT devices. Use a grounded tip and thermal relief pads where possible. Preheating the board to 100–150°C reduces thermal gradients and improves joint quality.
Can the 1206C be used in automotive-grade applications meeting AEC-Q200 standards, and what qualification data supports its suitability for under-the-hood environments?
Standard 1206C parts are not inherently AEC-Q200 qualified. For automotive use, select grade-0 components specifically tested to IEC 60068-2-6 (vibration) and 60068-2-2 (thermal shock). Verify with supplier documentation; otherwise, failure rates may exceed mission-critical thresholds during prolonged vibration or thermal exposure.

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1206C

Original Factory

583

In Stock: 12585

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