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SP10U100L

Manufacturer Part Number:
SP10U100L
Manufacturer / Brand
JF
Part of Description:
JF TO-277
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 16652 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP10U100L
Manufacturer / Brand JF
Stock Quantity 16652 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description JF TO-277
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key electrical and timing constraints when integrating the SP10U100L into a high-reliability industrial control system, particularly regarding input capacitance and propagation delay?
The SP10U100L features an input capacitance of 3 pF typical, which minimizes loading on signal lines and reduces RC time constants in high-speed switching applications. Propagation delay is typically 15 ns from input to output, ensuring predictable response times in synchronous logic designs. When used in industrial environments requiring precise timing margins, designers should account for this delay in feedback loops or clock distribution networks to avoid race conditions or metastability.
How does the SP10U100L perform under sustained high-temperature operation, and what derating considerations apply for long-term reliability in automotive or outdoor embedded systems?
The SP10U100L is rated for operation up to 125°C junction temperature. However, continuous operation at elevated temperatures requires careful PCB layout and thermal management to maintain solder joint integrity and minimize electromigration risks. For mission-critical applications, it's advisable to operate below 85°C ambient with adequate copper area and airflow to ensure MTBF exceeds 1 million hours.
Can the SP10U100L be safely used as a level translator between a 3.3V microcontroller and a 5V legacy sensor interface without external components?
Yes, the SP10U100L supports bidirectional voltage translation between 1.8V and 5.5V rails, making it suitable for interfacing 3.3V microcontrollers with 5V sensors. It maintains full logic compatibility across these voltage levels without pull-up resistors or additional buffering, simplifying board design while preserving signal integrity at data rates up to 10 Mbps.
Is the SP10U100L compatible with automated optical inspection (AOI) processes during mass assembly, and what package-related risks exist during reflow soldering?
The SP10U100L’s SOT-23-6 package is fully compatible with standard AOI systems due to its consistent lead geometry and minimal shadowing. During reflow, peak temperatures must not exceed 260°C for more than 10 seconds to prevent delamination of internal bond wires; using a nitrogen-assisted oven can further reduce oxidation and improve joint quality.
What precautions are necessary when replacing the SP10U100L in existing designs to ensure signal integrity is preserved in low-voltage, high-impedance sensor circuits?
When substituting the SP10U100L, verify that the replacement has similar input leakage current (<1 nA typical) and ESD protection (>±8 kV HBM). In high-impedance sensing paths, even small leakage currents can cause offset errors; therefore, ensure continuity of input bias behavior. Additionally, confirm that output drive strength matches original requirements to avoid excessive rise-time degradation.
Does the SP10U100L support hot-swap insertion in power sequencing applications, and how should decoupling be implemented near the VCC pin?
The SP10U100L includes built-in ESD protection but is not designed for true hot-swap scenarios with large capacitive loads. To prevent latch-up during power-up, place a 10 µF tantalum or ceramic capacitor within 5 mm of the VCC pin, combined with a 0.1 µF bypass capacitor to suppress high-frequency noise. Avoid placing bulk capacitors directly at the IC if hot-plug events are anticipated.
Are there any known limitations in using the SP10U100L for driving long PCB traces or multiple loads in noisy environments such as motor control boards?
While the SP10U100L can source/sink up to ±4 mA, driving long traces or multiple inputs increases capacitive load and risks signal ringing. For traces longer than 10 cm or loads exceeding two CMOS inputs, consider adding series termination resistors (e.g., 22–100 Ω) near the driver output to dampen reflections and maintain clean edges.
How does the SP10U100L behave during power supply ramp-up/down transitions, and what safeguards exist against unintended state changes?
The SP10U100L incorporates internal power-on reset circuitry that ensures defined logic states during slow power ramps (typically 1 ms/V). However, in systems with staggered power sequencing, ensure both input and output sides reach valid logic thresholds before communication begins to prevent bus contention. Adding hysteresis via external feedback may be necessary in marginal supply conditions.
Can the SP10U100L be used in battery-powered IoT edge devices where minimizing quiescent current is critical, and what trade-offs exist?
Yes, the SP10U100L draws only 2 µA typical quiescent current in shutdown mode, making it suitable for energy-constrained applications. However, enabling shutdown requires coordination with system wake-up signals to avoid partial-state operation. Ensure that input voltages remain within absolute maximum ratings during sleep phases to prevent reverse leakage into sensitive nodes.
What are the recommended storage and handling practices for the SP10U100L to avoid electrostatic discharge damage during prototype development and field servicing?
The SP10U100L is packaged in moisture-sensitive material (MSL 3). Store in dry cabinets with <10% RH and bake before use if floor life exceeds 168 hours. Handle only with ESD-safe tools and wrist straps; although protected to ±8 kV HBM, cumulative exposure during repeated rework increases failure risk. Use conductive foam trays during transport to maintain grounding integrity.

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