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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP1076
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SP1076

Manufacturer Part Number:
SP1076
Manufacturer / Brand
SI-POWER
Part of Description:
SI-POWER SOT23-6
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 15625 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP1076
Manufacturer / Brand SI-POWER
Stock Quantity 15625 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SI-POWER SOT23-6
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SP1076 be used in high-side switch configurations for industrial load control, and what are the key limitations to consider in such applications?
The SP1076 is not suitable for direct high-side switching due to its P-channel MOSFET architecture lacking integrated gate drive support for floating operation. Engineers must incorporate external level-shifting circuitry or a dedicated gate driver to ensure proper turn-on when the source terminal is not tied directly to the supply rail. In industrial environments with inductive loads, additional attention must be given to transient voltage suppression and ensuring the VGS limit of ±12 V is not exceeded during switching events.
Is the SP1076 a viable replacement for the Si8411BB-D-IS in isolated power switch designs, and what are the critical differences in integration requirements?
The SP1076 cannot function as a direct replacement for the Si8411BB-D-IS, which is a silicon-isolated MOSFET driver. The SP1076 is a discrete P-channel MOSFET in an SOT23-6 package without internal isolation or driver circuitry. Migrating from Si8411BB-D-IS to SP1076 would require redesigning the isolation boundary using external optocouplers or digital isolators, along with a separate gate drive stage, increasing board space and complexity, particularly in safety-certified industrial power systems.
What thermal considerations should be addressed when designing the SP1076 into a densely populated PCB with multiple power devices?
The SP1076 in SOT23-6 format has limited thermal dissipation capability, typically with a junction-to-ambient thermal resistance (RθJA) exceeding 200°C/W in standard PCB layouts. In high-density designs, thermal coupling between adjacent power components can elevate the local ambient temperature, leading to derating of the maximum allowable drain current. Effective use of thermal vias under the source pad and maintaining adequate copper clearance around the device are necessary to mitigate thermal runaway risks, especially in continuous load scenarios.
How does the SP1076 perform in battery-powered systems operating down to 2.7 V, and is the gate threshold voltage compatible with reliable turn-on at low supply levels?
The SP1076’s gate threshold voltage (VGS(th)) typically ranges from -0.8 V to -1.5 V, which allows partial enhancement at 2.7 V but does not guarantee full RDS(on) performance. At low input voltages, the P-channel MOSFET may operate in the linear region, increasing conduction losses significantly. Designers should verify the on-resistance under actual minimum operating voltage and consider using a charge pump or dedicated low-voltage load switch IC for more efficient battery-powered applications.
What are the recommended layout practices for minimizing switching noise when using the SP1076 in sensitive analog signal paths?
To reduce coupling of switching transients into analog sections, the SP1076 layout should minimize loop area between the gate drive path and return, place input decoupling capacitors as close as possible to the drain and source pins, and isolate analog grounds from power grounds via a single-point connection. The SOT23-6 footprint offers limited spacing; therefore, routing high-frequency signals beneath or adjacent to the package should be avoided, and a ground shield ring around gate traces can help reduce capacitive noise injection.
Under what conditions might the SP1076 exhibit instability during turn-off in inductive load applications?
The SP1076 can experience voltage overshoot and oscillation during turn-off when driving inductive loads due to the absence of an internal clamp diode and limited reverse recovery characteristics of the body diode. If the gate resistance is too low, dV/dt-induced Miller current can cause momentary re-conduction. A snubber network or external Schottky diode across the load, combined with controlled gate pull-up strength, helps maintain stability and prevents damage to upstream power rails.
Is the SP1076 appropriate for use in automotive-grade designs operating at 125°C junction temperature, and what reliability risks exist over long-term deployment?
While the SP1076 is fabricated using silicon processes compatible with extended temperature operation, its reliability in automotive environments depends heavily on applied stress conditions. At elevated junction temperatures near 125°C, parametric drift in threshold voltage and increased leakage currents may occur over time, especially under repeated thermal cycling. The SOT23-6 package lacks qualified AEC-Q101 certification for most automotive MOSFETs, suggesting potential risk in safety-critical or long-lifecycle systems compared to qualified alternatives like Vishay SI2301DV or ON Semiconductor FDC630P.
Can the SP1076 be paralleled with another identical device to increase current handling capability, and what imbalances should be expected?
Paralleling multiple SP1076 devices is feasible but requires careful matching of gate drive impedance and thermal coupling to prevent current hogging. Due to inherent variation in VGS(th) and RDS(on), one device may turn on faster, leading to disproportionate current sharing during transients. Individual gate resistors, symmetrical PCB routing, and shared thermal mass via a common copper pad improve balance, but the benefit diminishes without tight process control and temperature monitoring.

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