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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP1072
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SP1072

Manufacturer Part Number:
SP1072
Manufacturer / Brand
SP
Part of Description:
SP1072 SPT SOT23-6
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 10353 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP1072
Manufacturer / Brand SP
Stock Quantity 10353 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP1072 SPT SOT23-6
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP1072 Datasheets SP1072 Details PDF
SP1072 Details PDF for FR.pdf
SP1072 Details PDF for KR.pdf
SP1072 Details PDF for ES.pdf
SP1072 Details PDF for DE.pdf
SP1072 Details PDF for IT.pdf
Package SOT23-6
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SP1072 be used in low-power battery-operated designs, and what are the key power supply design considerations for stable operation in such applications?
The SP1072 is suitable for low-power applications due to its SOT23-6 package and typical design characteristics associated with Nuvoton's microcontroller and signal processing products; however, engineers must verify the operating voltage range and quiescent current using the manufacturer’s latest datasheet, as these parameters directly affect battery life. When integrating the SP1072, ensure the power supply maintains regulation within the specified VDD range under dynamic load conditions, especially during wake-up or signal transitions. Decoupling with a 100nF ceramic capacitor close to VDD pins is recommended to minimize noise sensitivity.
Is the SP1072 pin-compatible with common industry-standard comparators or voltage monitors such as the TLV3011 in SOT23-6 packages?
The SP1072 is not necessarily pin-compatible with the TLV3011 or similar devices despite sharing the SOT23-6 footprint; pin functions such as output type (open-drain vs. push-pull), reference input, or enable control vary between manufacturers and part families. Attempting a direct drop-in replacement without reviewing the functional block diagram and electrical specifications may result in incorrect circuit behavior. Engineers should cross-reference pinouts and control logic levels before substitution and validate interface compatibility with downstream components like MCUs or gate drivers.
What are the risks of using the SP1072 in a high-temperature industrial environment exceeding 85°C ambient?
The SP1072, housed in a standard SOT23-6 package, may experience thermal derating and reduced long-term reliability when operated at elevated ambient temperatures. Engineers must evaluate the junction-to-ambient thermal resistance (θJA) of the package and ensure the total power dissipation—especially under continuous output loading—keeps the junction temperature within manufacturer-specified limits. In environments exceeding 85°C, consider adding PCB copper pour for heat spreading or implementing duty-cycled operation to manage thermal stress and prevent premature failure.
How does the output drive capability of the SP1072 affect its ability to interface directly with MOSFET gates or optocoupler inputs in power switching circuits?
The SP1072 typically features limited output current drive, characteristic of small-signal SOT23-based devices, which may be insufficient for directly driving high gate-charge MOSFETs or optocoupler LEDs without signal amplification. When used in switching applications, verify the output high/low voltage levels and sink/source capability across the operating temperature range. In most cases, an intermediate buffer or transistor stage is required to ensure fast switching transitions and prevent output stage saturation or overheating in the SP1072.
Under what conditions would the SP1072 be a better fit than a discrete transistor-based voltage detection circuit in compact designs?
The SP1072 offers advantages over discrete solutions when space, precision, and consistency are critical, as it integrates internal reference and hysteresis functionality in a 6-pin SOT23 package. Discrete designs using resistors, op-amps, and transistors can introduce component spread, temperature drift, and larger board footprint. The SP1072 simplifies BOM management and provides more predictable trip thresholds, especially in battery monitoring or brown-out detection where long-term stability and low leakage during standby are required.
What configuration options or external components are typically needed to set the threshold voltage when using the SP1072 as a voltage supervisor?
When the SP1072 is used in supervisor or comparator applications, the threshold voltage is often determined by external resistive dividers connected to the sense pin, unless the part includes a fixed internal reference. The stability and accuracy of this network directly affect trip point precision. Use resistors with tight tolerance (1% or better) and low temperature coefficients. For dynamic control, a reference voltage or enable signal may be applied via an MCU, but ensure input levels comply with the SP1072’s absolute maximum ratings to prevent latch-up or damage.
Can the SP1072 be reliably used in automotive under-the-hood applications given its SOT23-6 packaging and lack of explicit AEC-Q100 certification?
The SP1072 has not been widely documented as AEC-Q100 qualified, which introduces risk when targeting automotive under-hood environments subject to thermal cycling, vibration, and high humidity. While the SOT23-6 package can perform adequately in controlled conditions, long-term reliability concerns such as wire bond fatigue or moisture ingress may increase failure rates in unqualified parts. For automotive designs, prefer manufacturer-recommended automotive-grade alternatives or conduct extended environmental testing if the SP1072 is used in prototype or low-volume applications.

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