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XLH535026.400000I

Manufacturer Part Number:
XLH535026.400000I
Manufacturer / Brand
Renesas Electronics America Inc
Part of Description:
XTAL OSC XO 26.4000MHZ HCMOS SMD
Datasheets:
XLH535026.400000I.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 404949 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number XLH535026.400000I
Manufacturer / Brand Renesas Electronics America Inc
Stock Quantity 404949 pcs Stock
Category Crystals, Oscillators, Resonators > Oscillators
Description XTAL OSC XO 26.4000MHZ HCMOS SMD
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 3.3V
Type XO (Standard)
Size / Dimension 0.203' L x 0.132' W (5.15mm x 3.35mm)
Series XPRESSO™ FXO-HC53
Ratings -
Package / Case 6-SMD, No Lead
Package Strip
Output HCMOS
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Height - Seated (Max) 0.055' (1.40mm)
Function Enable/Disable
Frequency Stability ±50ppm
Frequency 26.4 MHz
Current - Supply (Max) 35mA
Current - Supply (Disable) (Max) -
Base Resonator Crystal
Base Product Number XLH535
Absolute Pull Range (APR) -

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

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Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can XLH535026.400000I be used directly with a 3.3 V FPGA or SoC clock input, or do I need level shifting?
XLH535026.400000I provides an HCMOS output at 3.3 V, so it can usually drive a 3.3 V logic-clock input directly if the receiving device accepts single-ended CMOS levels. In a design-in review, check the input VIH/VIL thresholds, maximum input capacitance, and whether the target clock pin expects a clock with fast edges or a specific duty cycle. If the FPGA or SoC has a 1.8 V or differential-only clock input, XLH535026.400000I would not be a direct fit without additional interface circuitry.
Is XLH535026.400000I suitable for replacing a 26.4 MHz crystal in an existing oscillator footprint?
XLH535026.400000I is an XO, not a bare crystal, so it is typically used as a replacement for an oscillator module rather than a two-pin resonator. If the original design uses a crystal-connected amplifier inside the IC, the PCB will usually need a different footprint and different routing, because XLH535026.400000I has an active output stage and requires a 3.3 V supply. The replacement is most practical when the system already expects a clock oscillator output rather than a passive crystal network.
What should I check before using XLH535026.400000I as the reference clock for a PHY, codec, or radio device?
With XLH535026.400000I, the main checks are frequency tolerance, startup behavior, jitter sensitivity, and input format compatibility. A 26.4 MHz clock is commonly used as a reference for timing-sensitive devices, but the receiving IC may require a tighter accuracy budget or a specific phase-noise profile. It is also useful to confirm whether the device expects a continuous clock during reset or can tolerate the oscillator’s enable/disable behavior.
Can XLH535026.400000I be power-cycled or gated for low-power designs?
XLH535026.400000I includes an enable/disable function, so it can support low-power modes where the clock is stopped when the system is inactive. In practice, designers should verify the oscillator start-up time after re-enable and the downstream IC’s lock or reset sequencing, because some devices need a stable clock before releasing reset or reinitializing peripherals. It is also sensible to confirm whether the enable pin is active-high or active-low from the full orderable specification before wiring it into a power-management state machine.
Is XLH535026.400000I a good choice for industrial equipment operating from -40°C to 85°C?
XLH535026.400000I is specified for -40°C to 85°C, which aligns with many industrial environments. For long-term deployment, engineers usually also evaluate vibration, thermal cycling, PCB strain, and supply noise, since oscillator performance can shift if the local power rail is unstable or the board experiences significant mechanical stress. If the application has a wider ambient range or severe temperature gradients near heat sources, a timing budget review is recommended.
What design issues can appear if XLH535026.400000I is placed too far from the clocked IC?
Because XLH535026.400000I uses an HCMOS output, trace length and load matter more than with a low-swing differential clock. A long route can add ringing, overshoot, and additional capacitive loading, which may degrade edge quality or create EMI issues. In practice, the oscillator should be placed close to the target clock input, with a short, direct trace and a solid return path to minimize distortion.
Can XLH535026.400000I be used in a design that requires very low jitter clocking?
XLH535026.400000I may be appropriate for many digital and mixed-signal systems, but the suitability depends on the downstream jitter tolerance. If the load is a high-speed serializer, RF synthesizer, or precision sampling system, it is common to compare the oscillator’s phase-noise and jitter performance against the device’s clocking budget rather than relying on frequency alone. For very sensitive applications, engineers sometimes choose a lower-jitter oscillator class or a clock-cleaning architecture.
How do I compare XLH535026.400000I with Epson SG-8002 series or other 26.4 MHz oscillators during replacement?
When comparing XLH535026.400000I with Epson SG-8002 or similar 26.4 MHz oscillators, check package footprint, supply voltage, output type, enable pin polarity, and tolerance over temperature. Even when the nominal frequency matches, the mechanical dimensions and pad layout often differ, and some alternatives have different start-up or current characteristics that can affect power sequencing. The practical replacement choice usually comes down to PCB compatibility and the receiving IC’s input requirements, not just frequency matching.
Is XLH535026.400000I appropriate for battery-powered or always-on systems?
XLH535026.400000I draws up to 35 mA, so it may be acceptable in systems where the clock is active only part of the time, but it is less attractive for ultra-low-power always-on designs. For battery-powered equipment, designers usually compare the oscillator’s active current with the sleep-state budget and consider whether the enable/disable function can reduce average consumption enough to meet runtime targets. If the clock must run continuously, a lower-power oscillator option may fit the power budget better.
What electrical checks are needed when using XLH535026.400000I with a noisy 3.3 V rail?
XLH535026.400000I depends on a stable 3.3 V supply, so rail noise, ripple, and brownouts can affect startup and output integrity. In a real design, it is common to add local decoupling close to the device and verify that the supply remains within the oscillator’s allowed range during load transients. If the rail is shared with switching loads, measuring clock stability during worst-case activity helps confirm that the clock does not introduce system-level timing faults.
Can XLH535026.400000I replace a 26.4 MHz crystal plus load capacitors on the same PCB?
XLH535026.400000I can replace a crystal-based clock source only if the circuit is redesigned to accept an active oscillator output. The load capacitors and inverter bias network used with a passive crystal are not needed for XLH535026.400000I, and leaving them in place can cause loading or routing conflicts. When migrating from a crystal to XLH535026.400000I, the input pin of the target IC should be checked for direct CMOS clock acceptance and proper biasing.
What are the main risks when using XLH535026.400000I in legacy equipment upgrades?
With XLH535026.400000I, the most common migration issues are footprint mismatch, enable pin behavior, start-up timing, and clock-level compatibility. Legacy boards may have been designed around a crystal or a different oscillator family, so the new part can alter the clock amplitude, EMI profile, or sequencing requirements. A bench validation with the final PCB layout usually reveals whether the migration is electrically clean or whether minor routing and reset changes are needed.

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