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Home > Products > Integrated Circuits (ICs) > Memory - Memory > IDT71256SA15PZI8
Renesas Electronics America Inc
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IDT71256SA15PZI8

In Stock 11727 pcs Reference Price(In US Dollars)
1+
$7.8453
200+
$3.1308
500+
$3.0257
1000+
$2.9746
Manufacturer Part Number:
IDT71256SA15PZI8
Manufacturer / Brand
Renesas Electronics America Inc
Part of Description:
IC SRAM 256KBIT PARALLEL 28TSOP
Datasheets:
IDT71256SA15PZI8(1).pdfIDT71256SA15PZI8(2).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, 11727 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number IDT71256SA15PZI8
Manufacturer / Brand Renesas Electronics America Inc
Stock Quantity 11727 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC SRAM 256KBIT PARALLEL 28TSOP
Lead Free Status / RoHS Status: RoHS non-compliant
Write Cycle Time - Word, Page 15ns
Voltage - Supply 4.5V ~ 5.5V
Technology SRAM - Asynchronous
Supplier Device Package 28-TSOP
Series -
Package / Case 28-TSSOP (0.465', 11.80mm Width)
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 256Kbit
Memory Organization 32K x 8
Memory Interface Parallel
Memory Format SRAM
Base Product Number IDT71256
Access Time 15 ns

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the IDT71256SA15PZI8 SRAM be used as a drop-in replacement for the IS65C256AL-25TLA3-TR in a 5V industrial control system?
The IDT71256SA15PZI8 is electrically compatible with the IS65C256AL-25TLA3-TR in terms of voltage range (4.5V to 5.5V) and parallel interface timing, but the access time of 15 ns versus 25 ns introduces a critical performance difference. Systems relying on precise timing margins may experience read/write failures if the original design assumed slower memory. Additionally, the 28-TSOP package matches, but PCB layout must verify signal integrity at the faster edge rates. A timing analysis of the memory bus is recommended before substitution.
What are the key risks when replacing the IDT71256SA15PZI8 with the IS62LV256AL-45TLI in a legacy design?
The IS62LV256AL-45TLI operates at 2.7V to 3.6V, making it incompatible with the IDT71256SA15PZI8’s 4.5V–5.5V supply range. Direct replacement would require a full power rail redesign and level shifting on all data and address lines. Furthermore, the 45 ns access time is significantly slower, potentially violating timing constraints in high-speed applications. This substitution is only viable in systems already operating at 3.3V with relaxed memory timing.
Is the IDT71256SA15PZI8 suitable for battery-powered embedded systems requiring low standby current?
The IDT71256SA15PZI8 is an asynchronous SRAM with no explicit low-power mode, and its standby current is not optimized for battery operation. While it functions within the specified voltage range, typical quiescent current remains relatively high compared to modern low-leakage SRAMs. For battery-powered applications, consider alternatives with built-in power-down modes or lower ICC characteristics, as continuous operation of the IDT71256SA15PZI8 may lead to excessive drain.
Can the IDT71256SA15PZI8 operate reliably in an automotive under-hood environment with temperatures exceeding 85°C?
The IDT71256SA15PZI8 has a maximum operating temperature of 85°C (TA), which is below the typical 105°C or 125°C requirements for under-hood automotive applications. Prolonged exposure to higher temperatures may cause data retention issues or accelerated degradation. For such environments, a qualified automotive-grade SRAM with extended temperature rating and AEC-Q100 compliance should be selected instead.
What design considerations apply when interfacing the IDT71256SA15PZI8 with a 3.3V microcontroller?
The IDT71256SA15PZI8 requires a 4.5V to 5.5V supply and has input high-level thresholds near 2.2V (at 5V VCC). A 3.3V microcontroller may not reliably meet these thresholds, risking indeterminate logic states. Level translation on address, data, and control lines is necessary. Additionally, output high voltage from the SRAM (typically ~3.8V at 5V VCC) may exceed the absolute maximum ratings of 3.3V-tolerant MCU pins, requiring series resistors or voltage clamping.
How does moisture sensitivity level (MSL 3) of the IDT71256SA15PZI8 affect assembly and long-term reliability in humid environments?
With MSL 3 (168 hours floor life), the IDT71256SA15PZI8 must be soldered within 168 hours of exposure to ambient conditions after dry pack opening. In high-humidity environments, moisture absorption can lead to popcorning during reflow if not properly baked. For long-term field reliability, especially in outdoor or industrial settings, strict adherence to IPC/JEDEC J-STD-033 handling procedures is required to prevent internal delamination or bond wire damage.
Are there functional differences between the IDT71256SA15PZI8 and the AS7C256A-12TIN that affect timing-critical applications?
The AS7C256A-12TIN has a 12 ns access time compared to the IDT71256SA15PZI8’s 15 ns, making it faster but not directly interchangeable without re-evaluating system timing margins. While both support 5V operation and share the same 32K x 8 organization, the faster part may require tighter PCB trace length matching and impedance control. Systems designed around the 15 ns timing budget may not fully utilize the AS7C256A-12TIN’s speed, but could benefit from reduced latency if signal integrity is maintained.
Can the IDT71256SA15PZI8 be used in a daisy-chained memory configuration with other asynchronous SRAMs?
The IDT71256SA15PZI8 lacks built-in address decoding or chip select chaining support, making daisy-chaining impractical without external logic. Each device requires a dedicated chip select signal, and address space management must be handled by the host controller or a CPLD/FPGA. Attempting to share chip select lines across multiple IDT71256SA15PZI8 devices risks bus contention and data corruption due to asynchronous operation and lack of output disable features beyond standby mode.
What are the implications of using the IDT71256SA15PZI8 in a system with frequent power cycling?
Frequent power cycling of the IDT71256SA15PZI8 can lead to undefined initial states on internal nodes, potentially causing transient current spikes or data corruption during startup. The lack of power-on reset circuitry means the memory contents are not guaranteed at power-up. Systems requiring deterministic boot behavior should implement external reset sequencing or initialize memory contents via the host processor immediately after power stabilization.
Is the IDT71256SA15PZI8 RoHS-compliant, and what are the sourcing implications for new product designs?
The IDT71256SA15PZI8 is listed as RoHS non-compliant, which restricts its use in products subject to EU RoHS directives or similar environmental regulations. For new designs targeting global markets, this status may necessitate redesign with a compliant alternative such as the IS62C256AL-45TLI-TR. Sourcing the IDT71256SA15PZI8 may also become increasingly difficult due to obsolescence trends, despite its REACH unaffected status.

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IDT71256SA15PZI8

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Renesas Electronics America Inc

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