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Renesas Electronics America Inc
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8N3SV76AC-0050CDI

Manufacturer Part Number:
8N3SV76AC-0050CDI
Manufacturer / Brand
Renesas Electronics America Inc
Part of Description:
IC OSC VCXO 622.08MHZ 6-CLCC
Datasheets:
8N3SV76AC-0050CDI(1).pdf8N3SV76AC-0050CDI(2).pdf8N3SV76AC-0050CDI(3).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 7750 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 8N3SV76AC-0050CDI
Manufacturer / Brand Renesas Electronics America Inc
Stock Quantity 7750 pcs Stock
Category Integrated Circuits (ICs) > Clock/Timing - Programmable Timers and Oscillators
Description IC OSC VCXO 622.08MHZ 6-CLCC
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 3.135V ~ 3.465V
Type VCXO
Supplier Device Package 6-CLCC (7x5)
Series FemtoClock® NG
Package / Case 6-CLCC
Package Tray
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Frequency 622.08MHz
Current - Supply 130 mA
Count -
Base Product Number 8N3SV76

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the 8N3SV76AC-0050CDI VCXO into a high-speed serial interface system, and how does its frequency stability impact signal integrity?
The 8N3SV76AC-0050CDI operates at 622.08MHz with a supply voltage range of 3.135V to 3.465V and draws up to 130 mA, making it suitable for high-performance applications such as SONET/SDH or Ethernet PHY clocking. Engineers must ensure that the power delivery network (PDN) can support transient current demands without inducing jitter. Its phase noise performance and low aging characteristics help maintain signal integrity over time, but layout parasitics and reference clock path matching are critical to achieving optimal jitter performance in synchronous systems.
How should the 8N3SV76AC-0050CDI be configured for frequency tuning in industrial environments where temperature fluctuations exceed ±10°C, and what control interface is required?
The 8N3SV76AC-0050CDI supports analog voltage control via an external tuning input, enabling fine frequency adjustment across its specified operating temperature range (-40°C to 85°C). To stabilize output frequency under thermal stress, designers must implement a buffered control voltage source with low noise and drift. A typical configuration involves connecting the VCONT pin to a precision DAC or filtered op-amp output, ensuring that the control voltage remains within 0–3.3V to avoid overdriving the tuning circuit.
Can the 8N3SV76AC-0050CDI replace legacy 8N3SV76-based oscillators in existing telecom designs, and what modifications are necessary to maintain backward compatibility?
While the 8N3SV76AC-0050CDI shares the same base product number (8N3SV76) and pinout as earlier variants, differences in packaging (CLCC vs. SOIC) and electrical tolerances may require PCB layout adjustments. Designers should verify that the CLCC (7x5mm) footprint matches the board’s mechanical constraints and that decoupling capacitors are placed within 2mm of the VDD pin. Additionally, supply sequencing and enable timing must be revalidated due to potential changes in startup behavior between generations.
What are the reliability implications of long-term operation for the 8N3SV76AC-0050CDI in industrial automation systems exposed to high ambient temperatures near 85°C?
Operating the 8N3SV76AC-0050CDI near its maximum junction temperature (TJmax) accelerates aging and increases frequency drift. Although the device meets industrial grade specifications (-40°C to +85°C), prolonged exposure above 70°C reduces MTBF by approximately 30% compared to cooler operation. Engineers should incorporate thermal management—such as copper pours or airflow—and monitor control voltage stability, as temperature-induced drift can indirectly affect frequency accuracy through the tuning loop.
Is it feasible to use the 8N3SV76AC-0050CDI as a replacement for crystal oscillator modules in space-constrained FPGA-based designs requiring precise 622.08MHz reference clocks?
Yes, the 8N3SV76AC-0050CDI is well-suited for space-limited applications due to its compact CLCC package (7x5mm) and surface-mount capability. However, unlike discrete crystal+buffer solutions, this VCXO integrates the oscillator core and tuning circuitry on-chip, which simplifies BOM count but requires careful attention to load capacitance and output drive strength. Designers must ensure the LVCMOS output can meet the FPGA’s clock input requirements without excessive loading or skew.
What precautions should be taken during PCB layout to minimize phase noise and jitter when routing the output from the 8N3SV76AC-0050CDI in a multi-board system?
To preserve signal integrity, route the output trace as a controlled-impedance line (typically 50Ω single-ended) with minimal vias and stubs. Keep analog control lines (VCONT) separate from digital signals and power rails, using guard traces grounded at one point only. Place bypass capacitors (100nF ceramic + 10µF tantalum) directly at the VDD and GND pins of the 8N3SV76AC-0050CDI, and ensure return paths do not cross noisy digital return currents. Terminate the output appropriately based on receiver input characteristics.
Can the 8N3SV76AC-0050CDI be used in redundant clock architectures requiring holdover functionality during brief power interruptions?
No, the 8N3SV76AC-0050CDI does not include internal holdover memory or holdover mode; it requires continuous power and stable reference conditions. In redundant or failover clock systems, additional circuitry such as a disciplined oscillator or GPS-disciplined reference is needed to maintain timing during outages. Using this device alone would result in clock loss upon power interruption, violating requirements for high-availability networks.
Are there any known trade-offs between using the 8N3SV76AC-0050CDI versus alternative 622MHz VCXOs from other manufacturers like SiTime or Microchip, particularly regarding power consumption and phase noise?
Compared to newer MEMS-based alternatives like the SiT9004, the 8N3SV76AC-0050CDI consumes more power (130mA vs. ~50mA) but offers superior phase noise performance in the 1kHz–100kHz offset band, making it preferable for legacy telecom standards. However, MEMS devices provide better shock/vibration tolerance and longer lifetime under mechanical stress. Designers must evaluate whether reduced power or enhanced ruggedness outweighs tighter phase noise margins when selecting between technologies.
What configuration steps are required to disable the 8N3SV76AC-0050CDI safely before soldering in reflow processes exceeding 260°C?
The 8N3SV76AC-0050CDI has an MSL rating of 1, allowing unlimited storage before use, but active operation during reflow can cause damage. To prevent latch-up or thermal stress, disable the device by holding the OE (Output Enable) pin low during pre-heating. Alternatively, remove all supply voltage prior to soldering. After placement, restore power only after the board has cooled below 100°C to avoid cold solder joint failures.
How does the Moisture Sensitivity Level (MSL) classification of the 8N3SV76AC-0050CDI affect handling procedures in high-volume manufacturing environments?
With an MSL rating of 1, the 8N3SV76AC-0050CDI is considered moisture-insensitive and can be stored indefinitely without baking before reflow soldering. This simplifies inventory management and eliminates the need for humidity-controlled storage, reducing operational overhead in assembly lines processing large batches of PCBs containing this component.

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