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70T653MS15BC8

In Stock 247 pcs Reference Price(In US Dollars)
1+
$334.9955
200+
$129.6391
500+
$125.0839
1000+
$122.8318
Manufacturer Part Number:
70T653MS15BC8
Manufacturer / Brand
Renesas Electronics America Inc
Part of Description:
IC SRAM 18MBIT PARALLEL 256CABGA
Datasheets:
70T653MS15BC8(1).pdf70T653MS15BC8(2).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, 247 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 70T653MS15BC8
Manufacturer / Brand Renesas Electronics America Inc
Stock Quantity 247 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC SRAM 18MBIT PARALLEL 256CABGA
Lead Free Status / RoHS Status: RoHS non-compliant
Write Cycle Time - Word, Page 15ns
Voltage - Supply 2.4V ~ 2.6V
Technology SRAM - Dual Port, Asynchronous
Supplier Device Package 256-CABGA (17x17)
Series -
Package / Case 256-LBGA
Package Tape & Reel (TR)
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Memory Type Volatile
Memory Size 18Mbit
Memory Organization 512K x 36
Memory Interface Parallel
Memory Format SRAM
Base Product Number 70T653
Access Time 15 ns

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

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70T653MS15BC8 Product Details:

The Renesas Electronics 70T653MS15BC8 is a high-performance 18-megabit static random access memory (SRAM) integrated circuit designed for demanding applications requiring fast, reliable data storage and retrieval. This volatile memory device belongs to the specialized category of dual-port asynchronous SRAM, offering simultaneous access from two independent ports, making it ideal for applications where multiple processors or systems need concurrent memory access without conflicts.

The product addresses critical design challenges in high-speed computing systems, particularly the need for ultra-fast memory access with minimal latency. With an impressive 15-nanosecond access time and write cycle time, this SRAM eliminates bottlenecks commonly associated with slower memory technologies. The dual-port architecture solves the complex problem of memory contention in multi-processor environments, allowing two separate systems to read and write data simultaneously without interference. The parallel interface design ensures maximum data throughput while maintaining compatibility with existing system architectures.

Key specifications include a memory organization of 512K x 36 bits, providing flexible data width handling for various applications. The device operates within a tight voltage supply range of 2.4V to 2.6V, ensuring stable performance while maintaining power efficiency. The operating temperature range of 0°C to 70°C makes it suitable for commercial and industrial applications. The surface-mount 256-CABGA package measuring 17x17mm provides a compact footprint while offering excellent thermal and electrical characteristics for high-density board designs.

The primary advantages of this SRAM include its exceptional speed performance, enabling real-time processing in time-critical applications. The dual-port functionality eliminates the need for complex arbitration circuits, simplifying system design while improving overall performance. The volatile nature ensures data integrity during power cycles, while the asynchronous operation provides flexibility in timing requirements. The parallel interface maximizes bandwidth utilization, and the robust package design ensures reliable operation in demanding environments.

Compatibility extends across a wide range of processors and controllers that support parallel memory interfaces, including ARM-based processors, DSPs, FPGAs, and microcontrollers. The standard JEDEC-compatible pinout ensures easy integration into existing designs, while the 2.5V operation aligns with modern low-power system requirements.

Primary application areas include high-performance computing systems, network infrastructure equipment such as routers and switches, telecommunications equipment, industrial automation systems, medical devices requiring real-time data processing, automotive electronics, aerospace systems, and high-speed data acquisition systems. The dual-port capability makes it particularly valuable in applications requiring buffer memory between different clock domains or in systems implementing cache coherency protocols.

Equivalent models and alternatives include the Cypress CY7C1380D series offering similar dual-port SRAM functionality with comparable speeds, IDT's 70V3599 series providing alternative memory organizations and speed grades, and Integrated Silicon Solution Inc. (ISSI) IS61NDP102418 series offering competitive dual-port SRAM solutions. Samsung's K7N803645A series provides similar capacity and performance characteristics, while Micron's MT58L1MY18 series offers alternative packaging and temperature range options. GSI Technology's GS8160Z18 series presents another viable alternative with similar specifications. Additionally, newer technologies such as QDR SRAM from vendors like Cypress and IDT provide enhanced performance for next-generation applications, though at different price points and with varying compatibility requirements.

70T653MS15BC8 Image
70T653MS15BC8 (1)

70T653MS15BC8 Key Technical Attributes

Memory Size: 18Mbit

Access Time: 15ns

Supply Voltage: 2.4V ~ 2.6V

70T653MS15BC8 Packing Size

The Renesas 70T653MS15BC8 is offered in a 256-CABGA (Chip Array Ball Grid Array) package, with the physical dimensions being 17mm x 17mm. This packaging supports surface mount technology, making it suitable for high-density PCB layouts. The 256-ball pin configuration promotes excellent connectivity and signal integrity, while the overall thermal resistance is optimized for cooling under typical operating conditions. The electrical properties are compatible with a supply voltage range of 2.4V to 2.6V, and the non-compliant RoHS status should be considered for applications requiring lead-free components.

70T653MS15BC8 Application

This 18Mbit asynchronous dual-port SRAM is commonly used in networking equipment, telecommunications hardware, video processing systems, and cache memory solutions requiring fast, simultaneous data access. Its ability to support parallel memory interfaces and rapid 15ns access times makes it ideal for real-time data buffering, routing tables, queue management, and high-performance embedded solutions. The device is well-suited for use in environments where dependable, high-speed data transfer is essential.

70T653MS15BC8 Features

The 70T653MS15BC8 integrates advanced asynchronous dual-port SRAM technology that enables independent access to memory by two ports, eliminating contention in multitasking operations. Its 512K x 36 memory organization supports both wide data bus applications and flexible word/page write cycles at a speed of 15ns, ensuring minimal latency for demanding workloads. The parallel memory interface ensures straightforward connectivity and supports high throughput. Additional features include enhanced write and read cycle management, support for burst and random access modes, and robust design for consistent operation in temperature ranges between 0°C and 70°C.

70T653MS15BC8 Quality and Safety Features

Manufactured by Renesas Electronics, the product undergoes stringent quality control processes. The device is encapsulated in a reliable CABGA package, which provides strong mechanical integrity and protection against external contaminants. With surface mount capability, high-density integration is achievable without compromising reliability. While this part is RoHS non-compliant, Renesas maintains industrial standards for performance and longevity, ensuring stable operation within specified electrical and environmental conditions.

70T653MS15BC8 Compatibility

The 70T653MS15BC8 is compatible with a broad range of host platforms supporting parallel memory interfaces and supply voltages between 2.4V and 2.6V. It is designed for integration into standard PCB layouts requiring BGA mounting technology and supports seamless replacement or upgrade in existing Renesas 70T653 series implementations. The flexible memory organization enables use in systems requiring wide data access as well as narrow bus operation.

70T653MS15BC8 Datasheet PDF

Our website provides the most authoritative and up-to-date datasheet for the 70T653MS15BC8. Customers are strongly encouraged to download the detailed datasheet directly on this page, ensuring access to comprehensive technical specifications and design guidelines essential for successful implementation.

Quality Distributor

IC-Components is a premium distributor for Renesas Electronics products, guaranteeing authentic and verified components like the 70T653MS15BC8. Take advantage of IC-Components’ exceptional service and expert support—get an immediate quote on our website today and secure high-quality memory solutions for your projects.

Frequently Asked Questions

How does the 70T653MS15BC8 SRAM's parallel interface impact my PCB layout and signal integrity in high-speed designs?
The 70T653MS15BC8 features a parallel memory interface, which requires careful PCB layout to ensure signal integrity at 15 ns access times. Use matched trace lengths, proper ground referencing, and controlled impedance to minimize reflections and crosstalk. Adequate decoupling capacitors close to the package pins are essential to maintain stable power delivery during high-speed operation.
Can I replace a different SRAM with the 70T653MS15BC8 without redesigning my existing system?
Replacement depends on matching key parameters such as memory size (18 Mbit), organization (512K x 36), voltage supply (2.4V to 2.6V), and interface type (parallel). If a candidate SRAM shares these parameters and supports similar package footprints (256-CABGA), it can be a suitable drop-in replacement. However, verify differences in timing, power consumption, and I/O voltage levels to ensure compatibility.
What are the electrical constraints when powering the 70T653MS15BC8 in a system operating at 3.3V?
The 70T653MS15BC8 operates at a supply voltage between 2.4V and 2.6V. Using it at 3.3V exceeds specifications and may damage the device or cause unreliable operation. If your system operates at 3.3V, consider level-shifting or using a compatible voltage regulator to power the SRAM at its specified voltage range, ensuring safe and reliable operation.
Is the 70T653MS15BC8 suitable for industrial applications with extended operating temperature ranges?
The 70T653MS15BC8 is specified for 0°C to 70°C, suitable for standard commercial environments. For industrial applications requiring wider temperatures (e.g., -40°C to 85°C), this device may not be reliable. In such cases, consider an industrial-grade SRAM with extended operating temperature specifications.
How does the asynchronous, dual-port architecture of the 70T653MS15BC8 influence my system design for concurrent read/write operations?
The asynchronous, dual-port design allows independent read and write operations, enabling simultaneous access from two ports without synchronization delays. Ensure your system's controller manages port arbitration to prevent bus conflicts. Proper timing analysis is essential to avoid data corruption during concurrent access.
What are the implications of the 70T653MS15BC8 being RoHS non-compliant for my product’s environmental standards and supply chain?
RoHS non-compliance indicates the device may contain hazardous substances restricted under regulations like the EU RoHS directive. If your product requires RoHS compliance, sourcing an alternative device that meets environmental standards is necessary. This may involve design adjustments but ensures regulatory and environmental adherence.
Can I operate the 70T653MS15BC8 reliably at its maximum access time of 15 ns in my application?
Yes, the device guarantees a 15 ns access time under specified conditions. To reliably operate at this speed, ensure your system timing, cabling, and signal integrity match tested parameters. Proper decoupling and controlled impedance are critical to maintain these timings in real-world conditions.
What should I consider when designing my system’s power supply decoupling for the 70T653MS15BC8?
Use low-ESR ceramic decoupling capacitors placed as close as possible to the device's power pins to supply rapid current transients during memory access. A typical decoupling scheme involves multiple capacitors of different values (e.g., 0.1 μF and 10 μF) on each power rail to filter high-frequency noise and ensure stable voltage levels.
How does the 256-CABGA (17x17) package influence compatibility with standard PCB manufacturing and handling processes?
The 256-CABGA package requires precise PCB pad design with appropriate via placement and soldering capabilities, such as controlled collapse chip connection (C4) techniques. Proper handling, anti-static precautions, and expert reflow profiling are essential to prevent damage and ensure reliable solder joints.
Is the 70T653MS15BC8 suitable for applications requiring frequent power cycling, and what should I consider for long-term reliability?
As a volatile SRAM, the 70T653MS15BC8 requires constant power for data retention. Frequent power cycling can lead to data loss unless data is saved externally during shutdown. For improved long-term reliability, ensure a stable power supply, implement power-fail detection, and consider backup or non-volatile alternatives if data persistence is critical during outages.

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