The AMD Xilinx R3064XL-10SC48I is a specialized integrated circuit designed for advanced electronic applications, targeting high-performance programmable logic solutions. This Field-Programmable Gate Array (FPGA) represents a sophisticated semiconductor device engineered to provide flexible, configurable digital processing capabilities across various technical domains.
As a BGA (Ball Grid Array) packaged component, the R3064XL-10SC48I offers exceptional signal integrity and compact integration, making it ideal for complex electronic systems requiring dense, high-speed processing capabilities. The device features a sophisticated architecture that enables dynamic reconfiguration and parallel processing, addressing critical design challenges in modern electronic engineering.
The component is particularly well-suited for telecommunications, industrial control systems, aerospace, and advanced computing applications where precision, reliability, and adaptable logic processing are paramount. Its specialized design allows engineers to implement custom digital logic circuits that can be reprogrammed post-manufacturing, providing unparalleled flexibility in system design.
Key advantages include high-speed performance, low power consumption, and robust signal management. The BGA packaging ensures superior thermal management and minimizes electromagnetic interference, which is crucial for maintaining signal integrity in demanding electronic environments.
While direct equivalent models might include other Xilinx FPGA series like the Spartan or Artix families, the R3064XL-10SC48I represents a specific configuration optimized for particular performance parameters. Potential alternative models could include similar Xilinx BGA-packaged FPGAs with comparable processing capabilities.
The component's comprehensive specifications make it a critical solution for engineers seeking advanced, adaptable digital processing technologies across multiple sophisticated electronic design domains.
R3064XL-10SC48I Key Technical Attributes
R3064XL-10SC48I
BGA encapsulation
48-ball package, 867 pin count
R3064XL-10SC48I Packing Size
The R3064XL-10SC48I from AMD Xilinx adopts a Ball Grid Array (BGA) package type, which is well-known for its compactness and exceptional performance in both thermal dissipation and electrical connectivity. The 48-ball BGA arrangement ensures efficient layout for circuit designers, and the advanced 867 pin grid supports high-speed signal transmission, making it ideal for dense and complex PCB designs. The material used for the encapsulation provides reliable protection against environmental factors, ensuring device stability and longevity during operation and handling.
R3064XL-10SC48I Application
This product is primarily designed for use in advanced embedded systems, programmable logic applications, and high-speed digital solutions. It is highly valued in industrial control units, communications infrastructure, networking equipment, and high-performance computing platforms where programmable logic is essential.
R3064XL-10SC48I Features
The R3064XL-10SC48I integrates rich programmable logic resources, offering high-density capabilities within a single integrated circuit. Its use of BGA packaging allows for minimization of parasitic inductance and enhanced frequency operation, making it a preferred choice for high-speed and high-performance environments. The device supports a wide operating temperature range, providing robust reliability in both standard and demanding industrial settings. Furthermore, it features advanced power management and low static power consumption, enabling greater flexibility for designers aiming to optimize system efficiency. This part is specially tailored for rapid prototyping as well as low- and medium-scale production due to its reprogrammable logic architecture.
R3064XL-10SC48I Quality and Safety Features
The R3064XL-10SC48I complies with global regulatory standards for environmental safety, including RoHS certification, ensuring it contains no hazardous materials and is suitable for applications with strict regulatory requirements. The BGA encapsulation offers enhanced mechanical stability, protecting the chip from physical shocks and solder joint fatigue. The strict manufacturing process guarantees consistent quality and high reliability, resulting in minimal failure rates in the field.
R3064XL-10SC48I Compatibility
This component is compatible with a wide range of advanced Xilinx design tools and is easily integrated with other ICs in embedded and programmable logic solutions. It is suitable for use with numerous standard and proprietary protocols, ensuring versatility for integration into existing system architectures and compatibility with diverse voltage and interface conditions.
R3064XL-10SC48I Datasheet PDF
Our website provides the most authoritative and up-to-date datasheet for the R3064XL-10SC48I model from AMD Xilinx. We strongly recommend that customers download the datasheet directly from the current page to ensure access to official device specifications, recommended usage guidelines, and complete electrical characteristics for optimal design implementation.
Quality Distributor
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