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EZADT11AAAJ

Manufacturer Part Number:
EZADT11AAAJ
Manufacturer / Brand
PANASONIC
Part of Description:
PANASONIC NA
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 14900 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number EZADT11AAAJ
Manufacturer / Brand PANASONIC
Stock Quantity 14900 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description PANASONIC NA
Lead Free Status / RoHS Status: RoHS Compliant
RFQ EZADT11AAAJ Datasheets EZADT11AAAJ Details PDF
EZADT11AAAJ Details PDF for FR.pdf
EZADT11AAAJ Details PDF for KR.pdf
EZADT11AAAJ Details PDF for DE.pdf
EZADT11AAAJ Details PDF for IT.pdf
EZADT11AAAJ Details PDF for ES.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the EZADT11AAAJ be used in a high-temperature industrial environment where ambient temperatures regularly exceed 85°C without derating its specifications?
The EZADT11AAAJ is rated for operation up to 125°C, making it suitable for most high-temperature industrial applications without requiring performance derating. However, long-term reliability under sustained thermal stress should be validated through accelerated life testing or historical field data from similar conditions.
What is the impact of using the EZADT11AAAJ with supply voltages below its nominal range, such as at 3.0V when operating near minimum input thresholds?
Operating the EZADT11AAAJ at or near its minimum supply voltage may reduce noise immunity and increase susceptibility to transient disturbances. While basic functionality can persist, signal integrity and protection features may degrade significantly, particularly in noisy environments.
How does the EZADT11AAAJ perform when subjected to rapid temperature cycling between -40°C and +125°C, and is this within its mechanical design limits?
The EZADT11AAAJ is designed for automotive-grade operation, which includes exposure to thermal cycling. It undergoes rigorous environmental testing including thermal shock and cyclic endurance. However, repeated extreme cycling can accelerate solder joint fatigue over time; layout and PCB pad design must account for CTE mismatch.
Can the EZADT11AAAJ be safely replaced with alternative TVS diode arrays from other manufacturers in existing designs without modifying surrounding circuitry?
Direct replacement depends on key electrical parameters: breakdown voltage, clamping voltage, peak pulse current, and capacitance. For example, substituting the EZADT11AAAJ with an NXP PESD5V0S1BA requires matching both I/O protection thresholds and ESD discharge models (HBM/CDM). Mismatched capacitance could affect signal rise times in high-speed interfaces.
What precautions should be taken when integrating the EZADT11AAAJ into a mixed-signal system with analog and digital sections sharing a common ground plane?
A solid, low-impedance ground plane is essential. Place the EZADT11AAAJ as close as possible to the protected connector or port to minimize loop inductance. Avoid splitting the ground plane under the device; instead, use a single-point star ground if necessary to prevent ground bounce during surge events.
Does the EZADT11AAAJ support bidirectional protection on all pins simultaneously, and what happens if one pin is driven higher than another by more than the supply rails?
Yes, the EZADT11AAAJ provides bidirectional clamping on each I/O pin relative to its associated power rail. If a differential voltage exceeds the absolute maximum rating (typically ±25V), internal parasitic structures may conduct unexpectedly, potentially damaging the device regardless of polarity.
Is it acceptable to omit external filtering capacitors when using the EZADT11AAAJ in a battery-powered device with frequent micro-USB hot-plug events?
No. Without decoupling capacitance near the EZADT11AAAJ, energy from hot-plugging transients can couple directly into sensitive loads. A small ceramic capacitor (e.g., 100nF) placed within 1mm of the device helps absorb high-frequency components and stabilize the local supply during surges.
How does the ESD protection level of the EZADT11AAAJ compare to newer alternatives like the ON Semiconductor RCLAMP0524P, especially in terms of IEC 61000-4-2 compliance?
Both devices meet Class 2 HBM (4kV) and CDM (>500V) requirements, but the RCLAMP0524P offers lower capacitance (0.3pF vs. ~0.8pF) and better performance in high-speed USB 3.0+ applications. When migrating from EZADT11AAAJ, verify that signal integrity margins remain adequate across all intended data rates.
Can multiple EZADT11AAAJ devices share a common ground trace in a multi-protocol interface board without causing crosstalk or ground loops during surge events?
Shared ground traces are generally acceptable if the return paths for surge currents are kept short and localized. However, placing multiple TVS arrays too close together increases coupling risk during fast transients. Use separate return vias or a ground island for each group if surge energies are expected to be high.
What layout considerations are critical when routing signals past the EZADT11AAAJ to maintain impedance control in a 100Ω differential pair?
Minimize stubs and avoid right-angle bends in the transmission line path through the EZADT11AAAJ. The device adds minor capacitance (~0.8pF typical), so route the differential pairs symmetrically around it and ensure the reference plane remains continuous beneath the traces. Termination resistors should still match the characteristic impedance of the full path.

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EZADT11AAAJ

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In Stock: 14900

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