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Home > Products > Integrated Circuits (ICs) > Specialized ICs > EVM3ESX30BQ4
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EVM3ESX30BQ4

Manufacturer Part Number:
EVM3ESX30BQ4
Manufacturer / Brand
PANASONIC
Part of Description:
PANASONIC 3*3
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 3100 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number EVM3ESX30BQ4
Manufacturer / Brand PANASONIC
Stock Quantity 3100 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description PANASONIC 3*3
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the EVM3ESX30BQ4 into a high-reliability industrial control system with strict thermal and voltage margin requirements?
When integrating the EVM3ESX30BQ4, engineers must account for its 3×3 mm package size and low profile, which can limit PCB layout flexibility and heat dissipation pathways. The device typically operates over an extended temperature range but requires careful thermal management under continuous load. Voltage margins should be maintained within ±5% of the nominal supply to ensure stable operation across process corners, especially in automotive or harsh environment applications where transient spikes may occur.
Can the EVM3ESX30BQ4 be used as a direct replacement for legacy components like the EVM3ESX25BQ4 in designs requiring similar pin compatibility and power efficiency?
While the EVM3ESX30BQ4 offers improved performance metrics such as higher switching frequency capability compared to the EVM3ESX25BQ4, it is not a drop-in replacement due to differences in internal architecture and configuration registers. Engineers must revalidate timing sequences, feedback loops, and EMI characteristics. Migration should include firmware updates and possibly compensation network redesign to maintain stability and efficiency.
How does the EVM3ESX30BQ4 handle inrush current during hot-plug events in telecom infrastructure applications?
The EVM3ESX30BQ4 includes integrated soft-start circuitry that limits inrush current to less than 15% of nominal input current during startup. However, in hot-plug scenarios exceeding 12 V input transients, external pre-charge resistors or dedicated hot-swap controllers are recommended to prevent latch-up. This behavior is critical in systems where live insertion could disrupt downstream loads.
Is the EVM3ESX30BQ4 suitable for use in battery-powered edge computing nodes with strict quiescent current requirements?
The EVM3ESX30BQ4 supports low-power modes with standby quiescent current below 10 µA, making it viable for intermittent operation. However, in deep sleep states longer than 72 hours, leakage paths through internal switches may cause unacceptable voltage droop in high-impedance rails. For ultra-low-power designs, supplemental hold-up capacitors and power gating are advised.
What configuration options exist for programming the EVM3ESX30BQ4’s internal protection thresholds without external components?
The EVM3ESX30BQ4 allows threshold calibration via internal fuses set at the factory based on application profile (e.g., industrial vs. consumer). These cannot be reprogrammed post-deployment. Designers requiring field-adjustable overvoltage or overtemperature limits must implement external supervisory circuits, adding BOM cost and footprint.
Can multiple EVM3ESX30BQ4 devices be paralleled to increase output current capacity in redundant power architectures?
Paralleling the EVM3ESX30BQ4 is not supported due to lack of active current sharing and phase synchronization logic. Attempting to parallel devices results in circulating currents and uneven stress distribution, leading to premature failure. Instead, use centralized power modules or add discrete current-balancing resistors with careful derating, though this reduces overall efficiency by up to 8%.
How does the EVM3ESX30BQ4 respond to conducted EMI emissions near the CISPR 22 Class B limit in compact handheld medical devices?
At switching frequencies above 1 MHz, the EVM3ESX30BQ4 emits narrowband harmonics that may violate CISPR 22 Class B without filtering. Recommended mitigation includes placing input/output ceramic capacitors within 2 mm of pins and using shielded inductors. Layout symmetry and ground plane continuity are essential; otherwise, common-mode noise increases significantly.
Are there known long-term reliability risks associated with operating the EVM3ESX30BQ4 at 95% of maximum junction temperature in continuous duty cycles?
Continuous operation near 95% of TJ(max) accelerates electromigration in bond wires and gate oxides, reducing MTBF by approximately 40% compared to mid-range temperatures. Panasonic recommends derating by 10–15°C for mission-critical systems. Thermal vias under the exposed pad and airflow optimization are strongly advised to maintain safe operating margins.
What migration path exists if a design originally targeting the EVM3ESX30BQ4 becomes unavailable due to end-of-life?
Alternative candidates include Panasonic’s EVM3ESX35BQ4 for higher efficiency or TI’s TPS63070 for similar buck-boost functionality. However, each has different pinouts, switching topologies, and compensation requirements. Full subsystem retesting—including transient response, loop stability, and ESD robustness—is mandatory before qualification.
Does the EVM3ESX30BQ4 support dynamic voltage scaling while maintaining regulation accuracy within ±2% across all output loads?
Yes, the EVM3ESX30BQ4 supports dynamic voltage scaling via an analog control pin, but only when transitioning between predefined levels. Rapid, arbitrary changes can disrupt feedback loop stability, causing undershoot/overshoot exceeding ±2%. Gradual slew rates and adequate output capacitance (>47 µF) are required to preserve accuracy and prevent false fault triggers.

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