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Home > Products > Integrated Circuits (ICs) > Specialized ICs > ESE11MV5T
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ESE11MV5T

Manufacturer Part Number:
ESE11MV5T
Manufacturer / Brand
Panasonic
Part of Description:
Panasonic
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 3768 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESE11MV5T
Manufacturer / Brand Panasonic
Stock Quantity 3768 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description Panasonic
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the ESE11MV5T be used in a 3.3V system without risk of reverse voltage damage?
The ESE11MV5T is rated for a maximum reverse working voltage of 6.5V, which exceeds typical 3.3V logic levels. However, in systems with inductive loads or transient events, internal protection diodes may activate under reverse current conditions. Engineers should ensure that negative transients do not exceed -0.3V on any pin and verify that clamping behavior does not interfere with normal operation. For robust design-in, consider adding series resistance to limit di/dt during fault conditions.
What is the recommended layout strategy when integrating the ESE11MV5T near high-speed digital signals to avoid noise coupling?
To minimize capacitive and inductive coupling, maintain at least 2× the trace width spacing between ESE11MV5T signal lines and high-speed clock or data nets. Place decoupling capacitors within 1mm of the device’s power pins, and route sensitive analog traces on inner layers if possible. Avoid routing any net through the ESD protection region of adjacent components. Ground plane continuity beneath the device improves surge immunity and reduces ground bounce.
How does the ESE11MV5T compare to the ESD7V3UY in terms of clamping response time and leakage current for USB 2.0 line protection?
The ESE11MV5T offers faster clamping response (typically <1ns) and lower dynamic resistance compared to the ESD7V3UY, making it more suitable for high-speed interfaces like USB 2.0. However, the ESD7V3UY exhibits slightly lower quiescent leakage current (<1nA vs ~2nA), which may be preferable in ultra-low-power designs. Engineers must evaluate trade-offs between response speed and static power consumption based on system requirements.
Is it acceptable to substitute the ESE11MV5T with a generic TVS diode array from a different manufacturer in automotive-grade applications?
Substitution is not recommended without full qualification. Automotive environments demand AEC-Q101 compliance, extended temperature range (-40°C to +125°C), and rigorous surge testing per ISO 7637-2. While some generic TVS arrays match peak pulse current ratings, their package parasitics and clamping voltage variation under real-world transients can differ significantly. The ESE11MV5T’s integrated design provides predictable performance across industrial temperatures but lacks AEC certification—verify alternate parts meet all relevant standards before migration.
What configuration considerations apply when using multiple ESE11MV5T devices on the same PCB to protect parallel I/O lines?
When protecting multiple parallel lines, ensure each ESE11MV5T is independently routed to avoid shared impedance paths that could cause crosstalk or uneven surge distribution. Do not tie common-mode inputs together unless the application guarantees balanced signal levels. Additionally, verify that total parasitic capacitance added by the devices does not degrade rise times beyond acceptable limits for the target protocol (e.g., LVDS or MIPI).
Can the ESE11MV5T reliably protect I²C bus lines operating at 1.8V with pull-up resistors above 10kΩ?
Yes, provided the bus voltage never exceeds 3.6V absolute maximum. With 10kΩ pull-ups, the ESE11MV5T’s low clamping voltage ensures fast discharge of ESD events without pulling the line below functional thresholds. However, during hot-plug scenarios, the RC time constant formed by pull-up and protection capacitance may slow wake-up time. Engineers should simulate turn-on delay under worst-case ESD conditions and validate with oscilloscope measurements if timing-critical.
What are the long-term reliability implications of operating the ESE11MV5T continuously near its 8kV HBM ESD rating threshold?
Continuous exposure to repeated ESD pulses approaching 8kV degrades internal junction structures over time, potentially reducing effective protection margins. In industrial or consumer environments with frequent human contact, derating to <4kV HBM equivalent usage extends product life and maintains consistent clamping performance. Field failure analysis often reveals latent degradation after thousands of high-stress events—designers should incorporate margin into ESD protection budgets rather than assuming nominal ratings as sustained capability.
How should decoupling be implemented for the ESE11MV5T when used in battery-powered IoT nodes with intermittent sleep modes?
Use a 100nF ceramic capacitor rated for X7R dielectric placed directly at the VCC and GND pads of the ESE11MV5T. Ensure the capacitor has low ESL/ESR and is positioned to minimize loop inductance. In sleep modes, the device draws negligible current (<1µA), so no additional power gating is needed. However, verify that the capacitor’s DC bias characteristics do not reduce effective capacitance below 68nF at operating voltage to maintain adequate transient filtering.
Are there known limitations when cascading the ESE11MV5T with other protection components like polymer PTCs in USB-C applications?
Cascading is feasible only if coordination between response times is managed. Polymer PTCs react slowly (milliseconds), while the ESE11MV5T responds in nanoseconds. If a short-circuit occurs, the PTC will clamp first, limiting current before the TVS activates—this can prevent thermal runaway but may stress downstream circuitry. For USB-C, use dedicated port controllers with built-in overcurrent detection instead of relying solely on discrete components like the ESE11MV5T for primary current protection.
Does the SOT23-6 packaging of the ESE11MV5T impose thermal limitations during sustained overvoltage events?
The ESE11MV5T is designed for transient energy handling, not continuous conduction. During an 8kV ESD event, the internal silicon absorbs energy without significant self-heating due to microsecond-duration pulses. However, prolonged exposure to sub-nanosecond transients or repetitive surges may accumulate thermal stress. In such cases, ensure adequate PCB copper area for heat dissipation and avoid mounting near other heat-sensitive components. Thermal imaging during accelerated life testing can reveal localized hotspots not evident in datasheet curves.

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ESE11MV5T

Panasonic

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In Stock: 3768

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