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PS15-24-5

In Stock 3030 pcs Reference Price(In US Dollars)
1+
$29.1742
Manufacturer Part Number:
PS15-24-5
Manufacturer / Brand
POWERPLAZA
Part of Description:
IGBT Modules
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 3030 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number PS15-24-5
Manufacturer / Brand POWERPLAZA
Stock Quantity 3030 pcs Stock
Category Discrete Semiconductor Products > Transistors - IGBTs - Modules
Description IGBT Modules
Lead Free Status / RoHS Status: RoHS Compliant
RFQ PS15-24-5 Datasheets PS15-24-5 Details PDF
PS15-24-5 Details PDF for FR.pdf
PS15-24-5 Details PDF for KR.pdf
PS15-24-5 Details PDF for IT.pdf
PS15-24-5 Details PDF for ES.pdf
PS15-24-5 Details PDF for DE.pdf
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


PS15-24-5 Product Details:

The POWERPLAZA PS15-24-5 is a high-performance Insulated Gate Bipolar Transistor (IGBT) module designed for advanced power electronics applications. As a discrete semiconductor component, this lead-free and RoHS-compliant device offers robust performance in various power conversion and control systems.

Engineered to meet stringent electronic design requirements, the PS15-24-5 IGBT module provides efficient power management solutions across multiple industrial and commercial domains. Its specialized module design addresses critical challenges in power semiconductor applications, including high-current switching, thermal management, and compact integration.

The device is particularly well-suited for demanding electrical systems such as motor drives, renewable energy inverters, industrial power supplies, and electric vehicle power electronics. Its advanced packaging ensures reliable performance under challenging environmental conditions while maintaining excellent electrical characteristics.

Key advantages of this IGBT module include its compact form factor, superior thermal performance, and compatibility with a wide range of power electronic design architectures. The RoHS compliance ensures environmental responsibility and meets modern electronic manufacturing standards.

While specific equivalent models would require additional cross-referencing, similar IGBT modules from manufacturers like Infineon, STMicroelectronics, and Mitsubishi Electric might offer comparable performance characteristics. However, the POWERPLAZA PS15-24-5 distinguishes itself through its unique design and optimized electrical parameters.

Professionals in power electronics, electrical engineering, and industrial automation will find this IGBT module an excellent solution for high-performance power conversion and control applications that demand reliability, efficiency, and compact design.

PS15-24-5 Key Technical Attributes

- Manufacturer Part Number: PS15-24-5

- Manufacturer: POWERPLAZA

- Main Category: Discrete Semiconductor Products

- Small Classification: Transistors - IGBTs - Modules

PS15-24-5 Packing Size

- Encapsulation: 2014+RoHS

- Type: IGBT Module

- Material: Semiconductor

- Pin Configuration: Standardized for IGBTs

- Thermal Characteristics: Optimal heat dissipation

- Electrical Properties: High efficiency and power handling

PS15-24-5 Application

The PS15-24-5 transistor module from POWERPLAZA is primarily utilized in high-power applications which require efficient switching and high-frequency operation such as in inverters, power converters, motor drives, and renewable energy solutions.

PS15-24-5 Features

This POWERPLAZA IGBT module, PS15-24-5, offers superior performance in high-voltage and high-current applications. It features a unique design for reduced power loss and increased reliability. It supports fast switching speeds and low conduction losses which make it suitable for high efficiency systems. Enhanced thermal management ensures high performance even under strenuous conditions.

PS15-24-5 Quality and Safety Features

The PS15-24-5 adheres to stringent quality controls and is RoHS compliant, ensuring that it is lead-free and environmentally friendly. The device boasts a robust construction which enhances its longevity and reliability in various applications.

PS15-24-5 Compatibility

Designed to be versatile, the PS15-24-5 is compatible with a wide range of standard IGBT drivers and circuits, making it easy to integrate into existing designs as well as new developments.

PS15-24-5 Datasheet PDF

Customers are encouraged to access the most authoritative and up-to-date datasheet for the POWERPLAZA PS15-24-5 on our website. For comprehensive specifications and performance details, please download the datasheet directly from the product page.

Quality Distributor

As a premium distributor, IC-Components takes pride in offering authentic and high-quality products from POWERPLAZA. We guarantee competitive pricing and the highest level of customer service. For precise quotations and availability, visit our website and get in touch with our sales team. Secure your supply of the PS15-24-5 transistor module through IC-Components today and experience a partnership that enhances your business.

Frequently Asked Questions

What are the key thermal design constraints when integrating the PS15-24-5 IGBT module into a high-density power converter, and how does its package influence heatsink selection?
The PS15-24-5 features a compact 2014+RoHS-compliant package optimized for low-profile mounting, but its power dissipation density requires careful thermal management. Due to the limited surface area for heat transfer, engineers must use a heatsink with forced airflow or liquid cooling when operating near the 15 A continuous current rating. The module’s baseplate is designed for direct mounting with thermal interface material (TIM), and uneven pressure or poor flatness can increase junction-to-case thermal resistance by over 20%. Always validate thermal performance under worst-case ambient conditions using transient thermal impedance curves from the datasheet.
Can the PS15-24-5 be used in a 48 VDC bus application with inductive switching loads, and what snubber design considerations apply?
Yes, the PS15-24-5 can handle 48 VDC bus applications, but inductive switching introduces voltage spikes that may exceed the module’s VCES rating if not properly managed. A properly designed RC snubber across the collector-emitter terminals is essential—typical values range from 10–100 nF in series with 10–100 Ω, tuned to dampen ringing without excessive power loss. Additionally, ensure gate drive voltage is maintained at +15 V/–5 V to minimize turn-off overshoot. Failure to implement snubbing can lead to premature failure due to dynamic avalanche stress.
Is the PS15-24-5 suitable for replacing older TO-247 discrete IGBTs in legacy motor drive designs, and what layout modifications are typically required?
The PS15-24-5 can replace certain TO-247 IGBTs in motor drives, but its module form factor demands significant PCB and mechanical redesign. Unlike discrete packages, the PS15-24-5 uses bolt-down terminals and requires a stiffener or metal-core PCB to prevent mechanical stress. Gate drive traces must be kept short and shielded to avoid parasitic coupling, and the absence of through-hole leads eliminates compatibility with existing footprints. Verify gate threshold voltage (VGE(th)) matching to ensure turn-on timing aligns with previous designs—mismatches can cause shoot-through in half-bridge configurations.
What are the reliability implications of operating the PS15-24-5 in an industrial environment with frequent thermal cycling between –25°C and +85°C?
The PS15-24-5 is RoHS-compliant and built for industrial use, but repeated thermal cycling induces mechanical stress at the solder joints and bond wires due to CTE mismatches. Over time, this can lead to increased on-state voltage (VCE(sat)) drift or open-circuit failure. To mitigate risk, implement underfill encapsulation if the application exceeds 1,000 cycles, and avoid rapid temperature transitions (>10°C/min). Monitor VCE(sat) during burn-in testing as an early indicator of bond wire degradation.
How does the PS15-24-5 compare to Infineon’s FP15R12KT3 IGBT module in terms of switching performance and gate drive requirements?
The PS15-24-5 offers comparable current handling to the FP15R12KT3 but has a slightly higher internal gate resistance, resulting in slower turn-off times and reduced switching losses at lower frequencies (<10 kHz). However, it requires a stronger gate driver (≥2 A peak) to achieve optimal switching speed due to higher total gate charge (Qg). Unlike the FP15R12KT3, the PS15-24-5 lacks an integrated NTC thermistor, so external temperature sensing must be added for overtemperature protection. Choose the PS15-24-5 for cost-sensitive, low-frequency applications; opt for the Infineon part when switching speed or built-in diagnostics are critical.
What input voltage and control interface limitations should be considered when designing a gate driver circuit for the PS15-24-5?
The PS15-24-5 requires a gate drive voltage of +15 V ±10% for full enhancement and –5 V to –15 V for reliable turn-off, especially under high dV/dt conditions. The input capacitance (Cies) is nonlinear and increases significantly near threshold, demanding a driver capable of sourcing/sinking at least 1.5 A during switching transitions. Isolated gate drivers are recommended for bridge topologies to prevent ground loops. Avoid using 3.3 V or 5 V logic directly—level shifting or dedicated IGBT driver ICs (e.g., UCC5350) are necessary to meet voltage and current requirements.
Can the PS15-24-5 be paralleled with another unit to increase current capacity, and what matching criteria are essential for stable operation?
Paralleling two PS15-24-5 modules is possible but not recommended without strict parameter matching and symmetric layout. Critical matching includes VCE(sat) at nominal current (ΔVCE < 50 mV), gate threshold voltage (ΔVGE(th) < 0.5 V), and thermal coupling to ensure equal current sharing. Even minor asymmetries in gate trace length or heatsink contact can cause one module to carry >60% of the total current, leading to thermal runaway. If paralleling is unavoidable, use individual gate resistors (1–5 Ω) per module and implement current-balancing inductors or active gate control.
Under what conditions might the PS15-24-5 be inappropriate for use in a solar inverter application despite its voltage and current ratings?
The PS15-24-5 may be unsuitable for high-efficiency solar inverters operating above 15 kHz due to its relatively high switching losses and lack of soft-switching optimization. Its internal diode is not rated for continuous freewheeling in boost or inverter legs, increasing conduction losses compared to modules with co-packaged SiC or fast recovery diodes. Additionally, the absence of avalanche energy rating (EAS) limits robustness in fault conditions like grid short-circuits. For MPPT-stage inverters requiring high-frequency operation or fault tolerance, consider modules with integrated anti-parallel diodes or wider SOA.
What derating guidelines apply to the PS15-24-5 when used in high-altitude installations above 2,000 meters?
At altitudes above 2,000 meters, air density decreases, reducing convective cooling efficiency. For the PS15-24-5, derate maximum power dissipation by approximately 1.5% per 1,000 meters above sea level. Additionally, creepage and clearance distances must be increased by 1% per 100 meters beyond 2,000 m to prevent arcing—verify compliance with IEC 60664-1. In sealed enclosures, internal pressure differentials may affect TIM performance; use vented designs or conformal coating to maintain reliability.
How should the PS15-24-5 be stored and handled prior to assembly to prevent electrostatic or moisture-related damage?
The PS15-24-5 must be stored in its original conductive packaging at temperatures between –40°C and +125°C, with relative humidity below 60% (non-condensing). Prolonged exposure to ambient air can cause oxidation of terminal surfaces, increasing contact resistance. If the moisture sensitivity level (MSL) indicator shows exposure beyond MSL 3, bake the module at 125°C for 24 hours before reflow. Always handle with ESD-safe tools and grounding straps—the gate oxide is vulnerable to voltages above ±20 V, which can cause latent failures.

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