Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Embedded - Microcontrollers > S9S12DG25F0MPVER
MFG MC9S12DG256VPVE.jpg ImageView larger image
Image may be representation.
See specs for product details.

S9S12DG25F0MPVER

In Stock 5748 pcs Reference Price(In US Dollars)
1+
$17.3371
200+
$6.7091
500+
$6.4734
1000+
$6.3577
Manufacturer Part Number:
S9S12DG25F0MPVER
Manufacturer / Brand
NXP Semiconductors
Part of Description:
16-BIT MCU, S12 CORE, 256KB FLAS
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5748 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number S9S12DG25F0MPVER
Manufacturer / Brand NXP Semiconductors
Stock Quantity 5748 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers
Description 16-BIT MCU, S12 CORE, 256KB FLAS
Lead Free Status / RoHS Status: RoHS Compliant
Series *
Package Bulk
Base Product Number S9S12

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What is the recommended power supply sequencing requirement for the S9S12DG25F0MPVER microcontroller to ensure reliable operation during startup?
The S9S12DG25F0MPVER requires strict power supply sequencing where VDD and VDDA must be applied simultaneously within a 1ms window to prevent latch-up or internal bus contention. Any significant delay between analog and digital core voltage rise can lead to undefined I/O states and potential functional failure during reset release.
Can the S9S12DG25F0MPVER be safely used in automotive-grade temperature applications beyond its industrial rating without additional qualification?
The S9S12DG25F0MPVER is rated for -40°C to +85°C, which covers most industrial environments but not full automotive AEC-Q100 Grade 2 (-40°C to +105°C). Operating outside this range without formal qualification risks parametric drift, timing errors, and accelerated electromigration in bond wires and interconnects.
Is it possible to reprogram the S9S12DG25F0MPVER using an external clock source instead of its internal oscillator?
Yes, the S9S12DG25F0MPVER supports external clock input on pin EXTAL via its Phase-Locked Loop (PLL) circuitry. However, the PLL must be configured through software before enabling, and stability depends on clean signal integrity and proper load capacitance matching to maintain lock across temperature and supply variations.
How does the flash memory endurance compare when using the S9S12DG25F0MPVER in field-programmable firmware update applications?
The S9S12DG25F0MPVER flash block has a typical endurance of 10,000 erase/write cycles at 25°C. In continuous OTA update scenarios, wear leveling logic must be implemented in software to distribute writes evenly across sectors, otherwise localized degradation may cause premature failure before reaching cycle limit.
What are the key differences when migrating from the S9S12DG25F0MPVER to a newer S12X series part regarding interrupt vector handling?
Unlike the S9S12DG25F0MPVER, S12X variants use a centralized interrupt vector table with hardware-adjusted return addresses and enhanced context saving. Direct code porting without modifying ISR entry points will result in incorrect stack behavior and corrupted register states upon interrupt exit.
Does the S9S12DG25F0MPVER support dynamic clock switching while executing code from flash without causing pipeline stalls?
Clock switching in the S9S12DG25F0MPVER requires disabling the PLL, waiting for stable reference, then reconfiguring the PLL—all while ensuring no instruction fetch occurs during transition. Without careful NOP insertion and cache invalidation, partial instruction execution may occur, leading to erratic program flow.
Are there known issues with using high-impedance pull-up resistors on unused ports connected to the S9S12DG25F0MPVER’s GPIO pins?
Excessive pull-up resistance (>10kΩ) on GPIO inputs tied to noisy or capacitive loads can cause slow rise times and susceptibility to electromagnetic interference. This may trigger unintended edge detection or false interrupts in the S9S12DG25F0MPVER, especially during rapid supply transients or ESD events.
What precautions should be taken when replacing the S9S12DG25F0MPVER in legacy motor control designs using PWM modules?
The S9S12DG25F0MPVER PWM modules lack advanced dead-time compensation compared to later S12X derivatives. Replacing it without verifying phase alignment and adjusting dead-time registers could result in shoot-through currents in half-bridge configurations due to insufficient gate drive isolation during commutation.
Can the S9S12DG25F0MPVER operate reliably in environments with frequent brownout conditions without brownout detection circuitry?
While the S9S12DG25F0MPVER includes internal BDM interface and basic reset generation, it lacks dedicated brownout detection (BOD) comparators. Sudden voltage drops below 2.7V may cause unpredictable resets or data corruption unless an external supervisor IC like the NXP PCA9306 is added to monitor VDD.
What impact does using long trace lengths on PCB routing near the S9S12DG25F0MPVER’s clock and reset lines have on system reliability?
Long unterminated traces on EXTAL/XTAL, RESET#, and VREFH/VREFL introduce ringing, overshoot, and crosstalk that degrade timing margins in the S9S12DG25F0MPVER. This increases susceptibility to noise-induced resets and PLL unlock events, particularly at higher frequencies or under transient EMI conditions.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


S9S12DG25F0MPVER

S9S12DG25F0MPVER

NXP Semiconductors

16-BIT MCU, S12 CORE, 256KB FLAS

In Stock: 5748

SUBMIT RFQ