The MCIMX7D2DVM12SC is a high-performance embedded microprocessor developed by NXP Semiconductors (formerly Freescale), designed for sophisticated computing applications across multiple industries. This powerful system-on-chip (SoC) delivers robust processing capabilities with a dual-core architecture featuring an ARM Cortex-A7 and ARM Cortex-M4 processor, operating at an impressive 1.2 GHz clock speed.
The microprocessor is engineered for versatility, supporting comprehensive connectivity options including dual Ethernet (10/100/1000 Mbps), multiple USB 2.0 interfaces, and extensive peripheral controllers. Its advanced design accommodates various memory technologies like LPDDR2, LPDDR3, DDR3, and DDR3L, enabling flexible system configurations across different application requirements.
Designed with industrial-grade reliability, the processor operates within a temperature range of 0°C to 85°C and offers robust security features including ARM TrustZone, CAAM cryptographic acceleration, and secure boot capabilities. The 19x19 MAPBGA package ensures compact integration and surface-mount compatibility, making it ideal for space-constrained embedded systems.
Key advantages include its multicore architecture, comprehensive interface support, integrated multimedia co-processors, and support for display technologies like LCD and MIPI. The processor is particularly well-suited for applications in automotive electronics, industrial control systems, IoT devices, and smart consumer electronics that demand high computational performance with low power consumption.
Equivalent alternative models in the NXP i.MX series include the i.MX 6 and i.MX 8 series processors, which offer similar architectural concepts with varying performance characteristics and peripheral configurations.
The microprocessor is RoHS3 compliant, supporting environmentally conscious manufacturing practices and meeting contemporary electronics production standards.
MCIMX7D2DVM12SC Key Technical Attributes
MPN MCIMX7D2DVM12SC
Manufacturer NXP Semiconductors (Freescale)
Series i.MX7D
Category Embedded Microprocessor
Core ARM Cortex-A7 dual plus ARM Cortex-M4
Speed 1.2 GHz for Cortex-A7
Co-processor NEON MPE and Multimedia
Bus width 32-bit
RAM controllers LPDDR2, LPDDR3, DDR3, DDR3L
Graphics acceleration None
Display and interface Keypad, LCD, MIPI
Security A-HAB, ARM TrustZone, CAAM, CSU, SJC, SNVS
Ethernet 10/100/1000 Mbps x2
USB USB 2.0 + PHY x1, USB 2.0 OTG + PHY x2
Additional interfaces AC97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Voltage I/O 1.8 V and 3.3 V
Operating temperature 0°C to 85°C TJ
Base product number MCIMX7
Mounting Surface mount
Quantity available 2635
RoHS status ROHS3 compliant
MCIMX7D2DVM12SC Packing Size
Package family 541-MAPBGA 19x19
Supplier device package 541-MAPBGA 19x19
Alternate case 541-LFBGA
Body size 19 mm x 19 mm
Ball count 541
Mount type Surface mount
Package type Tray
Pin configuration Ball Grid Array with organized peripheral interfaces
Thermal characteristics TJ range 0°C to 85°C; low-power architecture reduces heat dissipation
Electrical properties I/O at 1.8 V and 3.3 V; integrated USB PHY; dual GbE MAC; PCIe support
MCIMX7D2DVM12SC Application
Industrial human–machine interfaces and control panels
IoT gateways and edge computing nodes with heterogeneous workloads
Portable medical and healthcare devices requiring low power and security
Smart-home hubs and building automation controllers
Energy metering, smart grid endpoints, and connected utilities
Retail POS, kiosks, and digital signage without 3D GPU needs
Automotive and transportation telematics and infotainment entry-level
Wearables and consumer embedded devices leveraging M4 for real-time tasks
MCIMX7D2DVM12SC Features
The MCIMX7D2DVM12SC combines a dual-core ARM Cortex-A7 application processor running up to 1.2 GHz with a dedicated ARM Cortex-M4 for deterministic real-time control, enabling heterogeneous compute where time-critical tasks are isolated from high-level OS workloads. This split architecture makes it ideal for designs that require both rich connectivity and strict latency control, such as gateways, HMIs, and smart endpoints.
Its memory subsystem supports LPDDR2, LPDDR3, DDR3, and DDR3L, providing flexibility to optimize cost, power, and performance; the 32-bit data bus and robust RAM controllers accommodate a wide range of memory densities. Although it has no 3D GPU, the device includes display and interface controllers (LCD, MIPI, keypad) sufficient for 2D user interfaces and status displays in industrial and commercial products.
Connectivity is extensive: dual 10/100/1000 Mbps Ethernet MACs enable redundant or segmented networking; one USB 2.0 host with integrated PHY plus two USB 2.0 OTG with PHY cover peripheral and device roles; PCIe offers high-speed peripheral expansion; and rich serial interfaces (CAN for automotive/industrial, eCSPI/SPI, I2C, I2S, QSPI, SAI, UART, MMC/SD/SDIO) connect to sensors, storage, radios, and custom logic. Integrated NEON MPE accelerates media and signal processing workloads, and the Multimedia co-processor assists with common audio and peripheral tasks.
Security is a centerpiece: A-HAB (High Assurance Boot) establishes a chain of trust from boot, ARM TrustZone creates secure/non-secure domains, CAAM provides hardware cryptography and true random number generation, CSU manages resource permissions, SJC enforces secure JTAG, and SNVS protects keys and tamper events. These hardware blocks help meet regulatory and corporate security requirements for connected devices.
The i.MX 7D family is engineered for low power operation, enabling efficient thermal behavior within the 0°C to 85°C junction temperature range. Designers can leverage DVFS, clock gating, and deep sleep modes to minimize consumption while maintaining responsiveness on the M4 core. The MAPBGA 19x19 package with 541 balls offers a compact footprint and high pin count for interface-rich designs, while remaining manufacturable with standard SMT flows.
MCIMX7D2DVM12SC Quality and Safety Features
ROHS3 compliant construction ensures lead-free, environmentally responsible materials and alignment with global directives. High Assurance Boot with authenticated images, TrustZone isolation, and CAAM hardware crypto enforce a secure boot chain and protect confidentiality and integrity of firmware and data. Secure JTAG (SJC) helps prevent unauthorized debug access in field deployments, and SNVS provides secure key storage and tamper support to strengthen resilience against physical attacks. The Ball Grid Array package is supplied in trays suitable for automated assembly, with careful ball layout to preserve signal integrity across high-speed interfaces such as PCIe, GbE, and SDIO. NXP’s industrial-quality design practices and extensive validation provide stable operation across the specified 0°C to 85°C TJ range, while documentation and errata tracking support safe, compliant product development.
MCIMX7D2DVM12SC Compatibility
The MCIMX7D2DVM12SC is compatible with LPDDR2/LPDDR3 and DDR3/DDR3L memory types, enabling straightforward BOM optimization. It interfaces seamlessly with standard peripherals and buses: Ethernet PHYs over RGMII/SGMII variants, USB 2.0 devices and hubs via integrated PHYs, PCIe endpoints, SD/eMMC storage, CAN transceivers, audio codecs over I2S/SAI/AC97, and SPI/I2C sensors. On the software side, it fits the mainstream embedded ecosystem, supporting Linux (including Yocto-based BSPs), Android for application-level UX, and real-time firmware on the Cortex-M4 with RTOS such as FreeRTOS or bare-metal. Many i.MX 7D variants share the 541-ball footprint, facilitating design reuse and migration within the series, subject to specific pin-function and feature differences noted in individual datasheets.
MCIMX7D2DVM12SC Datasheet PDF
Our website hosts the most authoritative and up-to-date datasheet for MCIMX7D2DVM12SC. For complete electrical characteristics, interface mapping, boot configuration, and design guidelines, we strongly recommend downloading the datasheet PDF from this page to ensure your design uses the latest verified specifications.
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