Choose your country or region.

100-LQFP.jpg ImageView larger image
Image may be representation.
See specs for product details.

DSP56F826BU80

Manufacturer Part Number:
DSP56F826BU80
Manufacturer / Brand
NXP USA Inc.
Part of Description:
IC MCU 16BIT 64KB FLASH 100LQFP
Datasheets:
DSP56F826BU80(1).pdfDSP56F826BU80(2).pdfDSP56F826BU80(3).pdfDSP56F826BU80(4).pdf
Lead Free Status / RoHS Status:
RoHS non-compliant
Stock Condition:
New original, 4133 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number DSP56F826BU80
Manufacturer / Brand NXP USA Inc.
Stock Quantity 4133 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers
Description IC MCU 16BIT 64KB FLASH 100LQFP
Lead Free Status / RoHS Status: RoHS non-compliant
RFQ DSP56F826BU80 Datasheets DSP56F826BU80 Details PDF
DSP56F826BU80 Details PDF for KR.pdf
DSP56F826BU80 Details PDF for IT.pdf
DSP56F826BU80 Details PDF for ES.pdf
DSP56F826BU80 Details PDF for DE.pdf
DSP56F826BU80 Details PDF for FR.pdf
Voltage - Supply (Vcc/Vdd) 2.25V ~ 2.75V
Supplier Device Package 100-LQFP (14x14)
Speed 80MHz
Series 56F8xx
RAM Size 4K x 16
Program Memory Type FLASH
Program Memory Size 64KB (32K x 16)
Peripherals POR, WDT
Package / Case 100-LQFP
Package Tray
Oscillator Type External
Operating Temperature -40°C ~ 85°C (TA)
Number of I/O 46
Mounting Type Surface Mount
EEPROM Size -
Data Converters -
Core Size 16-Bit
Core Processor 56800
Connectivity EBI/EMI, SCI, SPI, SSI
Base Product Number DSP56F826

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


DSP56F826BU80 Product Details:

The NXP Semiconductors/Freescale DSP56F826BU80 is a high-performance 16-bit embedded microcontroller IC designed for a wide range of applications. As part of the 56F8xx series, this device offers a powerful 56800 core running at 80MHz, providing ample processing power for demanding control and signal processing tasks.

One of the key features of the DSP56F826BU80 is its extensive set of on-chip peripherals, including External Bus Interface (EBI/EMI), Serial Communication Interface (SCI), Serial Peripheral Interface (SPI), and Synchronous Serial Interface (SSI). These communication interfaces enable seamless integration with various external devices and systems, making the microcontroller suitable for a diverse range of application areas.

The microcontroller is housed in a 100-LQFP (14x14) package, which provides a compact and space-efficient solution for embedded systems. The device operates within a wide temperature range of -40°C to 85°C, ensuring reliable performance in a variety of environmental conditions.

The DSP56F826BU80 features 64KB of FLASH program memory and 4K x 16 bytes of RAM, providing ample storage and memory resources for complex firmware and data processing requirements. The microcontroller also includes essential peripherals such as Power-On Reset (POR) and Watchdog Timer (WDT) to enhance system reliability and safety.

The primary advantages of the DSP56F826BU80 include its high-performance 56800 core, extensive on-chip peripherals, and wide operating temperature range, making it a versatile choice for applications such as industrial automation, motor control, power management, and general-purpose embedded systems.

In terms of compatibility, the DSP56F826BU80 is part of the 56F8xx series from NXP Semiconductors/Freescale. While there may be equivalent or alternative models within the same series, it is essential to consult the manufacturer's documentation or work closely with a sales representative to identify the most suitable options for your specific application requirements.

DSP56F826BU80 Key Technical Attributes

Core Processor: 56800

Core Size: 16-Bit

Speed: 80MHz

DSP56F826BU80 Packing Size

Package Type: 100-LQFP

Dimensions: 14x14

Material: Moulded Plastic

Pin Configuration: 100 pins

Thermal Characteristics: Operating Temperature -40°C ~ 85°C

Electrical Properties: Voltage Supply 2.25 V ~ 2.75 V

DSP56F826BU80 Application

Designed for advanced motor control applications and digital signal processing tasks such as in industrial, automotive, and appliance sectors where high computation performance is required.

DSP56F826BU80 Features

- The DSP56F826BU80 microcontroller is part of the 56800 56F8xx series and operates at a high frequency of up to 80MHz, enhancing its computational speed.

- It features an advanced 16-bit core processor providing a balanced approach between speed and power consumption.

- Offers substantial program memory size of 64KB allowing more complex programs and algorithms.

- Provides multiple connectivity options including Enhanced Bit Interface (EBI/EMI), Serial Communications Interface (SCI), Serial Peripheral Interface (SPI), and Synchronous Serial Interface (SSI) facilitating better peripheral integration.

- Employs an external oscillator for system clock generation, which affords design flexibility and accuracy in timing.

- It includes essential peripherals such as Power-on Reset (POR) and Watchdog Timer (WDT), which aid in system reliability and recovery.

DSP56F826BU80 Quality and Safety Features

- Operating within an industrial temperature range of -40°C to 85°C.

- Embedded with moisture sensitivity level (MSL) 3, which ensures a survival period of up to 168 hours at standard ambient conditions without moisture-related degradation.

- Not compliant with RoHS which indicates the presence of lead. It should be considered in applications where environmental compliance is critical.

DSP56F826BU80 Compatibility

This device ensures integration with various high-performance peripherals and systems due to its versatile connectivity capabilities and standard QFP-100 packaging, making it suitable for diverse applications in harsh environments.

DSP56F826BU80 Datasheet PDF

Access the most authoritative and detailed datasheet for DSP56F826BU80 on our website. This datasheet will provide comprehensive insights on installation, setup, and technical specifications. We highly recommend downloading it from the current page to maximize the usage of this microcontroller.

Quality Distributor

IC-Components is a premium distributor of NXP Semiconductors / Freescale products, delivering reliability and quality in every order. To access the best prices and service for the DSP56F826BU80, ensure to get a quote directly on our website. Trust IC-Components for the most efficient procurement and exceptional support.

Frequently Asked Questions

When integrating the DSP56F826BU80 into a design with an existing power supply system, what steps should be taken to ensure the power supply voltage stays within the 2.25 V - 2.75 V range specified for this microcontroller?
For the DSP56F826BU80, first, use a voltage regulator with a stable output in the 2.25 V - 2.75 V range. Select a regulator with low output ripple and high - load regulation. Place appropriate decoupling capacitors close to the power pins of the DSP56F826BU80. A combination of ceramic capacitors (e.g., 0.1 μF and 0.01 μF) can be used to filter out high - frequency and low - frequency noise respectively. Additionally, perform power integrity simulations during the design phase to predict and address any potential voltage fluctuations.
In what industrial applications might the DSP56F826BU80 not be suitable due to its operating temperature range of - 40°C to 85°C?
The DSP56F826BU80 may not be suitable for applications in extremely high - temperature industrial environments such as steel manufacturing plants where temperatures can exceed 85°C for long periods. It is also not ideal for deep - sea exploration equipment that may encounter temperatures well below - 40°C during operation. In these cases, a microcontroller with a wider operating temperature range should be selected.
If I need to replace the DSP56F826BU80 in an existing design, what are the key factors to consider when choosing an alternative part number? And can you recommend a specific alternative brand model?
When replacing the DSP56F826BU80, key factors include core processor compatibility, memory size, speed, I/O count, and power requirements. The core processor should be similar to ensure software portability. Memory size (both RAM and program memory) should match or exceed the original to avoid code and data storage issues. Speed is crucial for maintaining system performance. I/O count should be sufficient for existing peripheral connections. Power supply requirements need to be compatible with the existing power system. A possible alternative is the Microchip PIC24FJ64GA002. It has a 16 - bit core, similar memory capabilities, and can operate at a comparable clock speed. However, the PIC24FJ64GA002 has different peripheral configurations, so the software will need to be re - written to interface with these new peripherals.
How can I ensure reliable long - term operation of the DSP56F826BU80 in an industrial environment considering its moisture sensitivity level (MSL) of 3 (168 Hours)?
To ensure reliable long - term operation of the DSP56F826BU80, follow strict handling procedures. Once the package is opened, use the parts within 168 hours. If this is not possible, store the parts in a dry cabinet with a relative humidity of less than 10%. Before soldering, bake the parts according to the manufacturer's recommended baking profile. This will remove any absorbed moisture and prevent damage during the soldering process. Additionally, use conformal coating on the assembled PCB to protect the DSP56F826BU80 from environmental moisture during long - term use.
What are the design constraints when using the external oscillator type of the DSP56F826BU80 for clocking the microcontroller?
When using the external oscillator for the DSP56F826BU80, the oscillator frequency must be carefully selected to match the 80MHz speed requirement of the microcontroller. The oscillator should have a low phase noise to ensure stable clocking. Place the oscillator close to the clock input pins of the DSP56F826BU80 to minimize signal loss and interference. Use proper isolation techniques, such as ground planes and guard traces, to protect the clock signal from other high - speed signals on the PCB. Also, ensure that the oscillator's output impedance is compatible with the input impedance of the microcontroller's clock input.
Can the DSP56F826BU80 be used in a battery - powered application? If so, what are the power - saving design considerations?
The DSP56F826BU80 can be used in battery - powered applications. Since its power supply voltage ranges from 2.25 V to 2.75 V, it can be powered by appropriate battery chemistries. For power - saving design, use the microcontroller's low - power modes when the system is idle. Disable any unused peripherals such as EBI/EMI, SCI, SPI, or SSI when not in use. Optimize the code to reduce the processing load and minimize the time the microcontroller spends in active mode. Also, select low - power external components for the overall system design.
When integrating the DSP56F826BU80 with other components in a system, what are the potential risks associated with its 46 I/O pins in terms of signal integrity?
With the 46 I/O pins of the DSP56F826BU80, signal integrity risks include crosstalk between adjacent pins, impedance mismatches, and signal reflections. Crosstalk can occur when high - speed signals on neighboring pins interfere with each other. To mitigate this, increase the spacing between high - speed signal traces on the PCB and use proper shielding techniques. Impedance mismatches can lead to signal reflections, which can distort the signal. Ensure that the impedance of the traces connected to the I/O pins matches the output impedance of the DSP56F826BU80 and the input impedance of the connected components. Use termination resistors if necessary.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


DSP56F826BU80

DSP56F826BU80

NXP USA Inc.

IC MCU 16BIT 64KB FLASH 100LQFP

In Stock: 4133

SUBMIT RFQ