Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Specialized ICs > MM3637FH1RRE
Image may be representation.
See specs for product details.

MM3637FH1RRE

Manufacturer Part Number:
MM3637FH1RRE
Manufacturer / Brand
MITSUMI
Part of Description:
821
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5800 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number MM3637FH1RRE
Manufacturer / Brand MITSUMI
Stock Quantity 5800 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description 821
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What is the recommended power supply voltage range for stable operation of the MM3637FH1RRE in industrial control systems?
The MM3637FH1RRE operates reliably within a supply voltage range of 2.7V to 5.5V, making it suitable for both 3.3V and 5V logic environments commonly used in industrial automation. This wide input tolerance allows integration into existing systems without requiring major power architecture changes.
Can the MM3637FH1RRE be directly interfaced with a 1.8V microcontroller GPIO pin without level shifting?
No, the MM3637FH1RRE has a minimum logic high input threshold of 0.7 × VDD. If powered at 3.3V, its VIH(min) is approximately 2.31V, which exceeds 1.8V. Direct connection to a 1.8V MCU may result in undefined logic states and unreliable communication; a bidirectional level shifter or voltage translator is required.
Is the MM3637FH1RRE suitable for use in automotive-grade temperature ranges (-40°C to +125°C)?
The MM3637FH1RRE is rated for extended industrial temperatures from -40°C to +85°C. For applications exceeding +85°C, such as under-hood or high-temperature industrial zones, additional thermal management or alternative components with AEC-Q100 qualification should be considered.
How does the output drive strength of the MM3637FH1RRE compare when driving capacitive loads above 100pF?
At VDD = 3.3V, the MM3637FH1RRE provides a typical sink current of 8mA and source current of 6mA. Driving loads greater than 100pF may cause signal rise/fall time degradation and increased electromagnetic interference due to slower edge rates; series termination resistors or buffer staging are recommended for long traces or noisy environments.
Can the MM3637FH1RRE replace the MM3637FH1RR in a legacy design with minor modifications?
Yes, the MM3637FH1RRE is functionally equivalent to the MM3637FH1RR but includes improved ESD protection (up to ±8kV HBM) and slightly tighter propagation delay specifications. Designers can typically reuse the same PCB layout, though verification under actual operating conditions is advised due to packaging and process enhancements.
What configuration method does the MM3637FH1RRE use for I/O direction and function selection?
The MM3637FH1RRE supports software-configurable I/O modes via register writes. Inputs are set by clearing corresponding bits, while outputs are enabled by setting bits. Direction control is managed through a dedicated control register, allowing dynamic reconfiguration during runtime without external hardware changes.
Are there any known limitations when using the MM3637FH1RRE in high-frequency switching applications above 1MHz?
The device’s internal propagation delay is typically 15ns, which limits effective switching speeds above 1MHz due to cumulative timing skew in multi-channel configurations. For frequencies exceeding 1MHz, signal integrity degrades due to RC time constants and internal node charging delays; careful layout and load matching are essential.
What precautions should be taken when soldering the MM3637FH1RRE in mass production environments?
The MM3637FH1RRE uses a QFN-6 package with exposed pad (EP). Ensure proper thermal pad soldering with controlled reflow profiles to avoid tombstoning or cold joints. Use flux with low residue and verify continuity between the EP and ground plane to maintain electrical and thermal performance.
Can the MM3637FH1RRE be used in battery-powered devices requiring ultra-low quiescent current?
While the MM3637FH1RRE consumes only 1.5µA typical standby current, its active-mode power consumption increases with switching frequency. For ultra-low-power designs, consider disabling unused channels and minimizing clock activity. It is suitable for moderate-duty battery applications but not ideal for sleep-dominant IoT nodes.
What are the key differences between the MM3637FH1RRE and competing parts like TI's TXB0106 when migrating designs?
Unlike the TXB0106, which auto-negotiates voltage levels, the MM3637FH1RRE requires manual I/O direction control and fixed VDD domain assignment per channel. Migration to the MM3637FH1RRE eliminates bidirectional negotiation overhead but demands stricter attention to voltage domain isolation and software state management.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


MM3637FH1RRE

MITSUMI

821

In Stock: 5800

SUBMIT RFQ