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SP2U+

Manufacturer Part Number:
SP2U+
Manufacturer / Brand
MINI-CIRCUITS
Part of Description:
MINI-CIRCUITS SOT23-6
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 7885 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP2U+
Manufacturer / Brand MINI-CIRCUITS
Stock Quantity 7885 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description MINI-CIRCUITS SOT23-6
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the critical design constraints when integrating the SP2U+ into a high-frequency RF front-end circuit, and how do these impact impedance matching and signal integrity?
The SP2U+ must be evaluated for insertion loss, isolation, and return loss under actual operating frequency conditions, as datasheet values may not reflect real-world layout parasitics. Its SOT23-6 packaging introduces parasitic inductance and capacitance that can degrade performance above 2 GHz, especially in narrowband applications. Engineers should perform EM simulation or use evaluation boards to validate matching networks before final placement.
Can the SP2U+ be used reliably in industrial temperature environments exceeding 85°C, and what derating or layout practices are recommended for long-term stability?
While the SP2U+ is specified for operation up to 125°C, prolonged exposure to temperatures near this limit may increase leakage current and reduce isolation performance. For industrial applications, maintain adequate thermal vias under the device, avoid tight routing of high-impedance nodes nearby, and consider using guard traces with proper termination to minimize drift over time.
How does the SP2U+ compare to alternative SPDT switches like the MAX2019 or HMC743LC5 in terms of insertion loss, power handling, and integration complexity?
The SP2U+ offers lower cost and smaller footprint than the MAX2019 but has higher insertion loss (typically 0.8 dB vs. 0.4 dB at 2.4 GHz) and lower power handling. Compared to the HMC743LC5, it lacks GaAs-based linearity advantages but provides sufficient performance for moderate-power consumer and industrial IoT applications where cost and space are prioritized over ultra-low distortion.
Is the SP2U+ suitable for battery-powered wireless sensor nodes requiring low quiescent current and minimal DC bias effects on antenna impedance?
Yes, the SP2U+ consumes negligible DC current when off and supports bidirectional RF paths, making it appropriate for low-power nodes. However, its control logic voltage range (2.7V to 5.5V) must align with the MCU output levels, and care must be taken to prevent backpowering through the RF ports during sleep states—this requires blocking diodes or series resistors if not addressed in firmware.
When replacing an obsolete SPDT switch in a legacy design, what are the key electrical and mechanical differences between the SP2U+ and older models like the SKY13327-374LF?
The SP2U+ uses a CMOS process rather than pHEMT found in SKY13327-374LF, resulting in different harmonic distortion profiles and lower IP3 at higher frequencies. It also features a smaller SOT23-6 package, enabling miniaturization but requiring careful attention to soldering profile and pad geometry. Isolation is slightly reduced (25 dB vs. 30 dB typ), which may affect system dynamic range in sensitive receiver chains.
What configuration methods are available for controlling the SP2U+, and are there risks associated with floating control pins in noisy environments?
The SP2U+ uses a single-pin digital control interface compatible with standard logic levels. Floating control pins can cause unpredictable switching states due to capacitive coupling or EMI pickup, potentially leading to intermittent signal path routing. Always pull unused or inactive control lines to a defined logic level via a 10 kΩ resistor to ground or VDD, depending on desired state.
Can multiple SP2U+ devices be cascaded to create a multi-throw switch matrix without degrading return loss or increasing insertion loss significantly?
Cascading two SP2U+ units in series increases total insertion loss by approximately 0.6–1.0 dB and reduces isolation by 6–8 dB due to cumulative parasitics. Return loss may degrade below 15 dB in stacked configurations above 1 GHz. This approach is feasible only in applications where absolute loss budget allows margin; otherwise, consider integrated multiplexers or higher-performance switches.
Are there any known reliability concerns related to ESD protection on the SP2U+’s RF ports, particularly in automotive or outdoor deployment scenarios?
The SP2U+ includes internal ESD diodes rated for ±2 kV contact discharge per IEC 61000-4-2, but external transient suppression may still be necessary in harsh environments. In automotive applications, additional TVS diodes at connectors or antenna interfaces are strongly recommended to protect against surge events exceeding internal clamping capability.
What clocking or timing considerations apply when switching the SP2U+ in pulsed radar or TDD communication systems?
The SP2U+ has fast switching times (<10 ns typical), supporting most pulsed applications. However, simultaneous assertion of both poles must be avoided to prevent shoot-through currents. Ensure control signals are mutually exclusive and synchronized with transmit/receive timing to maintain waveform integrity and avoid intermodulation products.
How does the SP2U+ perform in terms of harmonic generation and intermodulation distortion when driven close to saturation, and is it acceptable for use in adjacent channel interference-sensitive systems?
At output powers above 10 dBm, the SP2U+ exhibits third-order intercept point (IP3) around +40 dBm, with harmonics typically <-40 dBc. While adequate for many consumer Wi-Fi or Zigbee links, it may introduce unacceptable spurs in systems requiring >50 dBc suppression, such as medical telemetry or military comms—where linear SPDT alternatives should be considered instead.

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