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AX500-1PQ208I

In Stock 42 pcs Reference Price(In US Dollars)
1+
$819.809
Manufacturer Part Number:
AX500-1PQ208I
Manufacturer / Brand
Microsemi
Part of Description:
MICROSEMI QFP
Datasheets:
AX500-1PQ208I.pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 42 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number AX500-1PQ208I
Manufacturer / Brand Microsemi
Stock Quantity 42 pcs Stock
Category Integrated Circuits (ICs) > Embedded - FPGAs (Field Programmable Gate Array)
Description MICROSEMI QFP
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - Supply 1.425 V ~ 1.575 V
Total RAM Bits 73728
Supplier Device Package 208-PQFP (28x28)
Standard Package 24
Series Axcelerator
Part Status Obsolete
Package / Case 208-BFQFP
Operating Temperature -40°C ~ 85°C (TA)
Number of LABs/CLBs 8064
Number of I/O 115
Number of Gates 500000
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Lead Free Status / RoHS Status Contains lead / RoHS non-compliant
Base Part Number AX500

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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AX500-1PQ208I Product Details:

The AX500-1PQ208I is a high-performance Field Programmable Gate Array (FPGA) integrated circuit manufactured by Micrel/Microchip Technology, belonging to the Axcelerator series of embedded FPGAs. This sophisticated programmable logic device addresses the critical design challenge of providing flexible, reconfigurable digital logic solutions for complex electronic systems that require custom processing capabilities without the time and cost associated with developing application-specific integrated circuits (ASICs).

The device features an impressive 500,000 gates of programmable logic capacity organized into 8,064 Logic Array Blocks (LABs) or Configurable Logic Blocks (CLBs), providing substantial computational resources for implementing complex digital designs. With 115 input/output pins available in a 208-pin Quad Flat Pack (QFP) surface-mount package measuring 28x28mm, this FPGA offers excellent connectivity options while maintaining a compact footprint suitable for space-constrained applications. The integrated 73,728 bits of RAM provide essential on-chip memory resources for data buffering, lookup tables, and temporary storage requirements.

Operating within a supply voltage range of 1.425V to 1.575V and designed to function reliably across an industrial temperature range of -40°C to 85°C, this FPGA demonstrates robust performance characteristics suitable for demanding environmental conditions. The surface-mount 208-PQFP package configuration facilitates automated assembly processes and ensures reliable mechanical and electrical connections in production environments.

The primary advantages of this FPGA include its substantial gate count enabling complex algorithm implementation, generous I/O capacity supporting extensive system interfacing, integrated RAM reducing external memory requirements, and the inherent flexibility of field-programmable architecture allowing for design modifications and updates without hardware changes. The industrial temperature rating and compact package make it particularly suitable for embedded applications where reliability and space efficiency are paramount.

This device finds extensive application in telecommunications infrastructure, industrial automation systems, digital signal processing applications, embedded computing platforms, prototyping and development systems, and custom logic implementations where standard microprocessors or microcontrollers cannot meet specific performance or functionality requirements. The combination of high gate density and substantial I/O resources makes it ideal for applications requiring complex data processing, protocol conversion, interface bridging, and real-time control functions.

Equivalent and alternative models in the FPGA market include the Xilinx Spartan-3 series (particularly XC3S500E), Altera Cyclone II series (EP2C20 and EP2C35), Lattice ECP2 series devices, Actel ProASIC3 family components, and other members of the Microsemi Axcelerator family such as AX250 and AX1000 variants. These alternatives offer similar gate densities and I/O capabilities, though specific features, power consumption, and pricing may vary. The Xilinx XC3S500E provides comparable logic capacity with different architecture optimizations, while Altera's Cyclone II EP2C20 offers similar performance characteristics with alternative development tool ecosystems. When selecting among these options, designers typically consider factors including development tool preferences, specific feature requirements, power consumption constraints, cost considerations, and long-term product availability.

AX500-1PQ208I Key Technical Attributes

Manufacturer: Micrel / Microchip Technology

Part Number: AX500-1PQ208I

IC Type: FPGA, Axcelerator Series

AX500-1PQ208I Packing Size

The AX500-1PQ208I is supplied in a standardized 208-pin PQFP (Plastic Quad Flat Pack) package with exact dimensions of 28x28 mm, making it suitable for high-density PCB assembly. The package is designed for surface mount technology, ensuring space-efficient and reliable mounting. It is delivered in trays, allowing for safe handling and storage during production. The pin configuration features 115 individual I/O pins, organized to support versatile, high-speed connections and efficient signal routing. Thermal management is optimized for an industrial operating temperature range of -40°C to 85°C, which supports stable operation under demanding environmental conditions. Electrically, it operates on a low supply voltage between 1.425V and 1.575V, ensuring energy-efficient performance in advanced embedded applications.

AX500-1PQ208I Application

AX500-1PQ208I FPGAs are widely used in complex embedded systems, including industrial automation, communication infrastructure, high-speed data acquisition systems, programmable logic controllers (PLCs), and networking equipment. Its robust features and configurability make it suitable for applications requiring rapid design updates and agile compute capabilities.

AX500-1PQ208I Features

This device belongs to the Axcelerator FPGA series from Micrel / Microchip Technology, offering up to 500,000 system gates and 115 general-purpose I/O pins, providing significant logic resources for custom hardware acceleration. Embedded memory is substantial, with 73,728 total RAM bits for data storage and processing buffers, and 8,064 logic array blocks (LABs/CLBs) provide high logic density for complex designs. The AX500-1PQ208I supports seamless design changes and prototyping, enabling rapid adaptation to shifting requirements. It is fabricated with advanced high-speed technology, facilitating efficient performance with predictable timing. The industrial-grade operating temperature extends its usability in demanding environments, while the 208-pin BFQFP/PQFP package assures broad compatibility with standard soldering and inspection techniques. While it is RoHS non-compliant, this may make it particularly relevant for legacy applications or markets with specific requirements.

AX500-1PQ208I Quality and Safety Features

Adhering to industry best practices, this FPGA is engineered for reliability over a wide thermal range and constant operational integrity. The robust tray packaging minimizes physical stress and electrostatic discharge (ESD) risks during handling, and the industrial temperature support ensures sustained performance under variable load and environment. Even though this version is RoHS non-compliant, it is manufactured to rigorous internal safety specifications, making it dependable for specialized domains where such compliance is not mandatory.

AX500-1PQ208I Compatibility

The AX500-1PQ208I is backward and forward compatible with other devices in the Axcelerator family, facilitating device interchange in scalable systems. Its PQFP footprint enables integration into platforms designed for large-pin, high-density IC solutions, and the I/O structure supports a wide variety of logic levels, ensuring flexibility with contemporary interface standards.

AX500-1PQ208I Datasheet PDF

Customers are strongly encouraged to download the official AX500-1PQ208I datasheet PDF available directly from our website. The datasheet offers the most complete, authoritative, and up-to-date technical details, reference designs, and application insights to support seamless engineering and integration—ensure you access the latest version here on the current page.

Quality Distributor

IC-Components is your premier distributor for authentic Micrel / Microchip Technology products, including the AX500-1PQ208I FPGA. Our proven track record, strict quality assurance, and rapid delivery ensure you receive reliable, original components every time. For the best prices and full support, request a quote today on our website and accelerate your project with trusted supply and exceptional customer service.

Frequently Asked Questions

What considerations should I keep in mind when integrating the AX500-1PQ208I FPGA into a low-voltage power supply system operating between 1.425V and 1.575V?
When integrating the AX500-1PQ208I FPGA, ensure the supply voltage remains within the specified range (1.425V to 1.575V) to maintain reliable operation. Proper decoupling capacitors placed close to the device pins are critical to handle transient current demands, especially during high-speed logic switching. Verify that your power supply design can provide stable voltage regulation within this narrow window and incorporate appropriate filtering to prevent voltage spikes or dips that could cause logic errors or device reset.
How suitable is the AX500-1PQ208I FPGA for long-term industrial applications with operating temperatures up to 85°C?
The AX500-1PQ208I is rated for an operating temperature range of -40°C to 85°C, making it suitable for many industrial environments. However, for applications with sustained high temperatures or harsh conditions, consider using additional cooling measures such as heatsinks or airflow management. Also, verify that your system's PCB layout accommodates these conditions and that component ratings elsewhere in the system are compatible with the device’s temperature profile to ensure long-term reliability.
When replacing an older FPGA with the AX500-1PQ208I, what are the key differences in I/O configuration and design impact?
The AX500-1PQ208I features 115 I/O pins within a 208-PQFP package, providing a moderate I/O count suitable for complex logic designs. When replacing an older FPGA, compare the I/O voltage levels, I/O standard support, and pinout configuration. Since this device supports a specific set of I/O standards and has a fixed number of I/O pins, verify that the pin configuration can be mapped to your existing PCB footprint without extensive redesign. Additionally, review the logic capacity and internal resources to ensure compatibility with your application’s requirements.
Can the AX500-1PQ208I FPGA be integrated into a system with strict RoHS compliance requirements, considering its RoHS non-compliance?
The AX500-1PQ208I is RoHS non-compliant, meaning it may contain lead or other restricted substances according to RoHS directives. If your system requires RoHS compliance, you will need to consider alternative FPGA models that are RoHS certified. Using RoHS-compliant components is essential for regulatory adherence and environmental considerations in certain regions. For critical applications, consult with suppliers about possible RoHS-compliant alternatives with similar specifications and performance characteristics.
What are the risks or considerations when migrating from an FPGA with higher I/O count or different package (e.g., BGA) to the AX500-1PQ208I 208-PQFP package?
When migrating to the AX500-1PQ208I in a 208-PQFP package, ensure your PCB layout accommodates the physical footprint and pin-pin compatibility of the 28x28mm package. The shift from a BGA or higher I/O count FPGA may introduce challenges in pin multiplexing, signal integrity, and routing density. Confirm that your design can support the I/O standard and voltage requirements, and consider the impact on signal impedance and crosstalk. Additionally, review your firmware and configuration methods since the device is configured via serial or similar methods compatible with the AX500 series, ensuring seamless reprogramming post-migration.
What factors should I consider regarding the AX500-1PQ208I’s internal RAM and logic resources for applications requiring high data throughput?
The AX500-1PQ208I offers 73,728 total RAM bits and 8,064 logic cells, suitable for moderate data processing tasks. For applications requiring high data throughput, evaluate whether the on-chip RAM and logic resources meet your buffering, FIFO, or data processing needs. Consider leveraging internal memory blocks efficiently to minimize external memory dependence, and assess timing constraints to avoid bottlenecks. Proper clock domain analysis and ensuring adequate power integrity are also critical to maximize performance without timing violations.
Is the AX500-1PQ208I FPGA suitable for designs that require high-frequency clock operation, considering its specifications?
The AX500 series is optimized for embedded FPGA applications with moderate to high performance. However, confirm the maximum achievable clock frequency based on your design’s timing constraints and the FPGA’s internal structure. Proper PCB layout, signal integrity management, and careful placement of critical clocks can help reach higher frequencies. Always consult the device’s user guides for recommended design practices to optimize clock distribution and minimize skew.
How does the AX500-1PQ208I perform in radiation-sensitive or high-reliability environments, given its specifications?
The AX500-1PQ208I is not specifically designed for radiation-hardened or high-reliability applications; it is a general-purpose embedded FPGA. For radiation-sensitive environments, consider using radiation-tolerant or radiation-hardened FPGA alternatives. Ensure that operating conditions do not exceed the specified temperature range and that adequate measures are in place for ESD protection and system robustness. Long-term reliability in such scenarios may require additional external components or shielding.
What should be considered when designing power sequencing and reset circuitry for the AX500-1PQ208I FPGA?
Proper power-up sequencing is essential to initialize the device correctly. Ensure that the supply voltage (1.425V to 1.575V) is stable before releasing the reset signal. Incorporate a reset circuit that ensures the FPGA is held in reset during power ramp-up and that the reset is released only after the voltage has stabilized within the specified operating range. Also, verify that the reset method aligns with your programming interface and consider using power-on reset ICs for consistent startup behavior.
Are there any specific environmental or handling considerations for the AX500-1PQ208I due to its package or RoHS status?
Although the AX500-1PQ208I is packaged in a 208-PQFP surface-mount package, proper ESD precautions are essential during handling and assembly. Since it is RoHS non-compliant, be aware of potential lead content and follow appropriate disposal procedures. Ensure your manufacturing environment includes adequate static control measures and that the device is stored in anti-static packaging to prevent damage. For high-reliability systems, consider cleaning and storage protocols to avoid contamination or corrosion.

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