Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Memory - Memory > MT29F16G08CBACBWP-12:C TR
Micron Technology Inc.
557~48TSOPI-18,4~WP~48.jpg ImageView larger image
Image may be representation.
See specs for product details.

MT29F16G08CBACBWP-12:C TR

Manufacturer Part Number:
MT29F16G08CBACBWP-12:C TR
Manufacturer / Brand
Micron Technology Inc.
Part of Description:
IC FLASH 16GBIT PAR 48TSOP I
Datasheets:
MT29F16G08CBACBWP-12:C TR(1).pdfMT29F16G08CBACBWP-12:C TR(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 17157 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number MT29F16G08CBACBWP-12:C TR
Manufacturer / Brand Micron Technology Inc.
Stock Quantity 17157 pcs Stock
Category Integrated Circuits (ICs) > Memory - Memory
Description IC FLASH 16GBIT PAR 48TSOP I
Lead Free Status / RoHS Status: ROHS3 Compliant
Write Cycle Time - Word, Page -
Voltage - Supply 2.7V ~ 3.6V
Technology FLASH - NAND
Supplier Device Package 48-TSOP I
Series -
Package / Case 48-TFSOP (0.724', 18.40mm Width)
Package Tape & Reel (TR)
Operating Temperature 0°C ~ 70°C (TA)
Mounting Type Surface Mount
Memory Type Non-Volatile
Memory Size 16Gbit
Memory Organization 2G x 8
Memory Interface Parallel
Memory Format FLASH
Clock Frequency 83 MHz
Base Product Number MT29F16G08

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design constraints when integrating the MT29F16G08CBACBWP-12:C TR NAND flash memory into a system with a 3.3V I/O interface?
The MT29F16G08CBACBWP-12:C TR operates within a supply voltage range of 2.7V to 3.6V, making it compatible with standard 3.3V digital systems. However, designers must ensure that the VCC and VSS pins are decoupled with appropriate bypass capacitors close to the package to maintain signal integrity at the 83 MHz clock frequency. Additionally, the parallel interface requires careful attention to timing margins and PCB layout due to the high-speed data bus; trace lengths should be matched within ±50 mils to prevent skew-induced read errors.
Can the MT29F16G08CBACBWP-12:C TR be used in industrial temperature environments exceeding 70°C?
No. This device is rated for commercial operation only, with an operating temperature range of 0°C to 70°C. For industrial or automotive applications requiring extended thermal performance, alternative Micron parts such as those in the MT29FxxG08CAB series with industrial-grade variants (e.g., -IT suffix) must be selected to ensure reliability under elevated ambient conditions.
What are the implications of using the MT29F16G08CBACBWP-12:C TR in long-term data retention applications?
While the MT29F16G08CBACBWP-12:C TR supports typical SLC-like endurance characteristics, its data retention is dependent on erase/write cycles and environmental stress. In continuous operation beyond factory-specified limits—especially near maximum rated temperature—the risk of bit errors increases significantly. Designers implementing archival storage should incorporate ECC logic and periodic data refresh routines to mitigate latent error accumulation over time.
How does the MT29F16G08CBACBWP-12:C TR compare to modern QLC-based alternatives in terms of write endurance and system-level trade-offs?
Unlike QLC NAND devices which offer higher density per die but suffer from lower write endurance and longer program/erase times, the MT29F16G08CBACBWP-12:C TR uses TLC technology optimized for cost-performance balance rather than extreme capacity. It delivers approximately 1000 P/E cycles per block compared to QLC’s ~100–300 cycles, making it more suitable for write-intensive workloads. However, it consumes more power and area than newer QLC solutions, so system architects must evaluate total cost of ownership versus raw storage density requirements.
Is it feasible to replace the MT29F16G08CBACBWP-12:C TR with a different Micron part without redesigning the PCB footprint?
Only if the replacement candidate shares identical pinout, package dimensions (48-TSOP I), and electrical timing parameters. Candidates like the MT29F16G08CBACAWP-12:C TR may differ in configuration options or command set support and could require firmware changes. Always verify full compatibility against the target system’s controller interface and boot sequence before substituting any part in production designs.
What precautions should be taken during configuration or initialization when using the MT29F16G08CBACBWP-12:C TR with a microcontroller lacking dedicated NAND flash controller hardware?
Software-driven access introduces strict timing requirements due to the 83 MHz synchronous interface. The MT29F16G08CBACBWP-12:C TR expects precise setup and hold times on all address/data lines; failure to meet these can result in corrupted reads. Designers must implement tight loop delays calibrated to the MCU’s clock speed and use GPIO toggling with minimal jitter. Alternatively, consider using a memory-mapped interface via an FPGA or CPLD to offload timing-critical tasks.
Does the MT29F16G08CBACBWP-12:C TR support hardware-based bad block management, and how does this affect system reliability?
Yes, the MT29F16G08CBACBWP-12:C TR includes built-in bad block marking in the factory-provided initial blocks. These blocks are identified via reserved status bits in the spare area and cannot be rewritten after manufacturing. System firmware must detect and skip these blocks during wear leveling and logical-to-physical mapping, otherwise data corruption or write failures may occur during runtime updates.
Are there known issues with the MT29F16G08CBACBWP-12:C TR when operated near its minimum supply voltage of 2.7V?
Operating near 2.7V reduces noise margin and increases susceptibility to transient disturbances, particularly during high-frequency operations such as page programming or block erasure. While functional within spec, marginal power delivery—such as from long PCB traces or unregulated regulators—can lead to intermittent data errors. Designers should ensure stable VCC with <±5% ripple and adequate decoupling to guarantee reliable operation across process-voltage-temperature corners.
What migration considerations arise when upgrading from older Micron NAND parts to the MT29F16G08CBACBWP-12:C TR?
Although form-factor and pin-compatible, newer generations like the MT29F16G08CBACBWP-12:C TR may implement updated command sequences or enhanced features such as improved error correction capabilities. Existing firmware relying on legacy behaviors (e.g., specific reset procedures or timing delays) might require modification. Additionally, block size alignment and erase granularity remain consistent, but verification of all low-level flash commands through regression testing is essential prior to deployment.
How does moisture sensitivity affect handling and storage of the MT29F16G08CBACBWP-12:C TR, and what steps mitigate risk?
As an MSL 3 device, the MT29F16G08CBACBWP-12:C TR absorbs moisture slowly but becomes vulnerable to popcorning during reflow soldering if exposed beyond 168 hours. To avoid delamination or bond wire damage, components must be stored in dry cabinets (<10% RH) and baked before assembly if shelf life exceeds 168 hours. Proper handling per J-STD-033 standards ensures long-term reliability in automated SMT lines.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


MT29F16G08CBACBWP-12:C TR

MT29F16G08CBACBWP-12:C TR

Micron Technology Inc.

IC FLASH 16GBIT PAR 48TSOP I

In Stock: 17157

SUBMIT RFQ