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Home > Products > Integrated Circuits (ICs) > Embedded - Microcontrollers > PIC16C58BT-20/SO
Microchip Technology
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PIC16C58BT-20/SO

Manufacturer Part Number:
PIC16C58BT-20/SO
Manufacturer / Brand
Microchip Technology
Part of Description:
IC MCU 8BIT 3KB OTP 18SOIC
Datasheets:
PIC16C58BT-20/SO(1).pdfPIC16C58BT-20/SO(2).pdfPIC16C58BT-20/SO(3).pdfPIC16C58BT-20/SO(4).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 13113 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number PIC16C58BT-20/SO
Manufacturer / Brand Microchip Technology
Stock Quantity 13113 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers
Description IC MCU 8BIT 3KB OTP 18SOIC
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V
Supplier Device Package 18-SOIC
Speed 20MHz
Series PIC® 16C
RAM Size 73 x 8
Program Memory Type OTP
Program Memory Size 3KB (2K x 12)
Peripherals POR, WDT
Package / Case 18-SOIC (0.295", 7.50mm Width)
Package Tape & Reel (TR)
Oscillator Type External
Operating Temperature 0°C ~ 70°C (TA)
Number of I/O 12
Mounting Type Surface Mount
EEPROM Size -
Data Converters -
Core Size 8-Bit
Core Processor PIC
Connectivity -
Base Product Number PIC16C58

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the PIC16C58BT-20/SO be used as a drop-in replacement for the PIC16C58B-20/SO in an existing 18-SOIC footprint design?
Yes, the PIC16C58BT-20/SO is functionally compatible with the PIC16C58B-20/SO and shares the same 18-SOIC package, pinout, and electrical characteristics. Both operate at 20 MHz with identical voltage ranges (3V to 5.5V) and I/O counts. However, verify firmware compatibility, as minor timing or instruction cycle differences may exist between revisions. Ensure the OTP memory content is validated for the specific application before final deployment.
What are the critical power supply design considerations when integrating the PIC16C58BT-20/SO into a battery-powered industrial sensor node?
The PIC16C58BT-20/SO operates within 3V to 5.5V, making it suitable for 3.3V or 5V battery systems. However, transient voltage spikes during switching loads can exceed the absolute maximum ratings. Use a low-ESR decoupling capacitor (100nF ceramic) placed within 5mm of Vdd and Vss pins. Additionally, the lack of internal brown-out reset (only POR is available) necessitates an external voltage supervisor if brown-out protection is required for reliable operation in fluctuating supply environments.
Is the PIC16C58BT-20/SO suitable for use in automotive under-hood applications with ambient temperatures up to 85°C?
No, the PIC16C58BT-20/SO has an operating temperature range of 0°C to 70°C (TA), which does not meet the thermal requirements for most under-hood automotive environments. Prolonged exposure beyond 70°C may lead to timing drift, increased leakage current, or functional failure. For such applications, consider automotive-grade MCUs with extended temperature ratings (e.g., -40°C to 125°C), such as the PIC16F series with AEC-Q100 qualification.
How does the absence of EEPROM in the PIC16C58BT-20/SO affect long-term data retention in a field-deployed meter logging application?
The PIC16C58BT-20/SO lacks integrated EEPROM, so any runtime data logging must rely on external non-volatile memory (e.g., I²C or SPI EEPROM) or simulate storage in OTP program memory—though the latter is not rewritable. This increases BOM complexity and board space. For applications requiring frequent data writes, consider migrating to a PIC16F variant with built-in EEPROM, such as the PIC16F887, to reduce system complexity and improve reliability.
Can an external 32.768 kHz crystal be used with the PIC16C58BT-20/SO for real-time clock functionality in a low-power design?
The PIC16C58BT-20/SO supports external oscillators but does not include a dedicated low-frequency oscillator module or SLEEP mode with RTC wake-up. While a 32.768 kHz crystal can be connected to the OSC1/OSC2 pins, the MCU lacks internal load capacitance tuning and precise timing control required for accurate timekeeping. Software-based timekeeping will consume excessive CPU cycles, making it inefficient. For RTC applications, select a microcontroller with integrated RTC and low-power modes.
What are the risks of replacing a legacy 4 MHz ceramic resonator with a 20 MHz crystal when upgrading to the PIC16C58BT-20/SO in an existing design?
Increasing the clock frequency from 4 MHz to 20 MHz significantly raises power consumption and electromagnetic emissions. The PIC16C58BT-20/SO can operate at 20 MHz with a properly designed external crystal circuit, but the PCB layout must minimize trace length between OSC1/OSC2 and the crystal, include appropriate load capacitors (typically 15–22 pF), and avoid routing high-speed digital lines nearby. Inadequate layout may cause oscillator instability or failure to start, especially in noisy industrial environments.
Is the PIC16C58BT-20/SO appropriate for safety-critical control systems requiring functional safety certification (e.g., IEC 61508)?
The PIC16C58BT-20/SO is not recommended for safety-critical applications. It lacks hardware features such as dual-core lockstep, ECC memory protection, or built-in self-test (BIST) required for functional safety compliance. Additionally, Microchip does not provide safety manuals or FMEDA data for this legacy OTP-based device. For SIL-rated systems, use newer PIC16F or PIC18F devices with documented safety support packages and diagnostic peripherals.
How does the 73-byte RAM limit of the PIC16C58BT-20/SO constrain firmware development for a multi-sensor data fusion application?
With only 73 bytes of RAM, the PIC16C58BT-20/SO severely limits stack depth, variable storage, and buffer allocation. Complex data fusion algorithms requiring arrays, queues, or floating-point operations will exhaust memory quickly. Interrupt service routines must be minimal to avoid stack overflow. Consider code optimization techniques such as bit-packing and static allocation, or migrate to a device with more RAM, such as the PIC16F18313 (384 bytes), if dynamic data handling is required.
What precautions are necessary when designing a PCB for the 18-SOIC package of the PIC16C58BT-20/SO in high-vibration industrial environments?
The 18-SOIC (0.295", 7.50mm width) package is surface-mount and susceptible to mechanical stress under vibration. Use a solder stencil with proper aperture ratio, ensure adequate pad geometry, and apply conformal coating to prevent microcracks. Avoid placing the device near board edges or high-stress areas. For extreme environments, consider conformal potting or select a more robust package option such as a 20-pin DIP if available, though this may require a different MCU variant.
Can the PIC16C58BT-20/SO be programmed in-circuit using ICSP, and what are the interface requirements?
Yes, the PIC16C58BT-20/SO supports In-Circuit Serial Programming (ICSP) via the PGC (clock) and PGD (data) pins. A 5V-tolerant programmer (e.g., PICkit 3/4) is required, and the target board must provide Vdd, Vss, MCLR (with pull-up), and the ICSP signals. Ensure no other devices drive the PGC/PGD lines during programming. Note that OTP memory cannot be erased; reprogramming requires replacing the device.

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