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MPFS025TL-FCVG484I

In Stock 375 pcs Reference Price(In US Dollars)
1+
$96.454
Manufacturer Part Number:
MPFS025TL-FCVG484I
Manufacturer / Brand
Microchip Technology
Part of Description:
MPFS025TL-FCVG484I
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 375 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number MPFS025TL-FCVG484I
Manufacturer / Brand Microchip Technology
Stock Quantity 375 pcs Stock
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description MPFS025TL-FCVG484I
Lead Free Status / RoHS Status: RoHS Compliant
Supplier Device Package 484-FBGA (19x19)
Speed -
Series -
RAM Size 230.4KB
Primary Attributes FPGA - 23K Logic Modules
Peripherals DMA, PCI, PWM
Package / Case 484-BFBGA
Package Tray
Operating Temperature -40°C ~ 100°C
Number of I/O MCU - 136, FPGA - 108
Flash Size 128KB
Core Processor RISC-V
Connectivity CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
Architecture MPU, FPGA

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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MPFS025TL-FCVG484I Product Details:

The MPFS025TL-FCVG484I from Microchip Technology (formerly Micrel) is a sophisticated System On Chip (SoC) integrated circuit that combines a microprocessor unit with FPGA capabilities, addressing the growing demand for flexible, high-performance embedded computing solutions in modern electronic systems. This device tackles the design challenge of integrating programmable logic with processing power, eliminating the need for separate MCU and FPGA components while reducing board space, power consumption, and system complexity.

At its core, this SoC features a RISC-V processor architecture, representing the latest generation of open-standard instruction set computing that offers excellent performance-per-watt characteristics. The device incorporates 23,000 logic modules in its FPGA fabric, providing substantial programmable logic resources for custom hardware acceleration, signal processing, or interface implementation. Memory resources include 128KB of flash storage for program code and 230.4KB of RAM for runtime operations, offering adequate capacity for embedded applications requiring both code storage and data manipulation.

The product delivers exceptional I/O flexibility with 136 MCU I/Os and 108 FPGA I/Os, totaling 244 configurable pins that enable complex interfacing requirements. Comprehensive peripheral support includes DMA controllers for efficient data transfers, PCI for system interconnection, and PWM modules for motor control or power management applications. Connectivity options are extensive, featuring CAN for automotive and industrial networks, Ethernet for networked applications, I²C for sensor integration, MMC for memory card interfaces, QSPI and SPI for high-speed serial communications, UART/USART for standard serial protocols, and USB OTG for flexible host/device USB connectivity.

Housed in a 484-pin FBGA package measuring 19x19mm, this compact form factor maximizes functionality while maintaining a manageable footprint for space-constrained designs. The device operates reliably across an industrial temperature range of -40°C to 100°C, making it suitable for harsh environmental conditions. Components are supplied in tray packaging for manufacturing convenience.

Primary advantages include the unified architecture that simplifies system design, reduces component count, and improves reliability by eliminating inter-chip communication bottlenecks. The RISC-V processor offers software flexibility while the FPGA fabric enables hardware customization, creating an ideal platform for applications requiring both deterministic processing and adaptable logic. This hybrid approach is particularly valuable in industrial automation, automotive systems, communications infrastructure, medical devices, aerospace applications, and IoT edge computing where real-time processing, custom protocols, and field upgradeability are essential.

Equivalent or alternative models include other members of the Microchip PolarFire SoC family such as MPFS095T, MPFS160T, MPFS250T, and MPFS460T variants offering different logic densities and I/O counts. Competitive alternatives include Intel (formerly Altera) SoC FPGAs like the Cyclone V and Arria series, Xilinx Zynq-7000 and Zynq UltraScale+ MPSoC families, and Lattice CrossLink-NX devices, though these typically use ARM rather than RISC-V processor cores.

MPFS025TL-FCVG484I Key Technical Attributes

Architecture: MPU, FPGA

Core Processor: RISC-V

MPFS025TL-FCVG484I Packing Size

The MPFS025TL-FCVG484I comes in a 484-FBGA (19x19 mm) package, offering a compact ball grid array solution ideal for high-density designs. The package material is robust, supporting industrial-grade performance with excellent thermal dissipation suitable for extended temperature operations from -40°C to 100°C. The pin configuration supports a high number of I/O—136 for the MCU and 108 for the FPGA—facilitating versatile interconnectivity. Its Tray packaging ensures safe handling and efficient logistics, minimizing risks during manufacturing and assembly.

MPFS025TL-FCVG484I Application

This device is an integrated System on Chip (SoC) designed for use in advanced embedded applications. Its various connectivity protocols (CAN, Ethernet, I2C, MMC, QSPI, SPI, UART/USART, USB OTG), and significant FPGA logic resources make it well-suited for industrial automation, IoT applications, network infrastructure, communications, motor control, and other high-performance embedded systems requiring both microprocessor and programmable logic functionalities.

MPFS025TL-FCVG484I Features

The MPFS025TL-FCVG484I delivers comprehensive features including a RISC-V core processor, providing adaptable and power-efficient computation. The embedded FPGA delivers 23,000 logic modules, enabling custom hardware acceleration and advanced digital signal processing. The device offers an integrated 128 KB Flash memory and 230.4 KB RAM, which together enable flexible code and data storage for demanding real-time processing. On-board peripherals such as DMA, PCI, PWM enhance its capabilities in managing data throughput, communications, and control tasks. Comprehensive connectivity options ensure compatibility with standard and emerging protocols for seamless integration with a wide variety of subsystems. The balanced distribution of I/O lines offers flexibility for complex designs, enabling designers to build sophisticated custom interfaces and data pathways.

MPFS025TL-FCVG484I Quality and Safety Features

Built for reliability, this SoC operates across a broad industrial temperature range (-40°C to 100°C), supporting robust function in mission-critical and harsh operational environments. The product features advanced ESD and EMI resilience safeguards, ensuring operation safety and device longevity in factory, automotive, or network installations. The manufacturer, Microchip Technology, adheres to stringent quality control and certification standards, ensuring dependable performance throughout the lifecycle of your application.

MPFS025TL-FCVG484I Compatibility

Compatible with a broad range of embedded design tools, development kits, and protocols, the MPFS025TL-FCVG484I supports rapid design iterations and future scalability. Its connectivity matrix supports direct interfacing with industry-standard buses and communication protocols, facilitating straightforward integration into existing platforms and ecosystems.

MPFS025TL-FCVG484I Datasheet PDF

For in-depth information on pinouts, electrical characteristics, application guidelines, and performance data, our website provides the most authoritative and updated datasheet for the MPFS025TL-FCVG484I. We strongly recommend downloading the datasheet directly from this page to ensure you have access to the most reliable design and application resources available.

Quality Distributor

IC-Components is a premium and trusted distributor for Microchip Technology products. We offer authentic, quality-assured components with professional customer support. For the best pricing, prompt service, and real-time stock status, we encourage you to request a quote for the MPFS025TL-FCVG484I on our website today. Partner with us for all your design and sourcing needs!

Frequently Asked Questions

How can I ensure proper power supply design when integrating the MPFS025TL-FCVG484I into my system to prevent instability or damage?
The MPFS025TL-FCVG484I operates over a wide temperature range (-40°C to 100°C) and requires a stable power supply within the specified voltage ranges. Use well-regulated, low-noise power sources with appropriate decoupling capacitors close to the power pins. Consult the device's power requirements in the datasheet and consider adding spread spectrum or filtering circuitry if operating in electrically noisy environments to ensure stable operation.
Is the 484-FBGA (19x19) package suitable for high-density PCB layouts, and what are best practices for PCB design to ensure reliable connectivity for the MPFS025TL-FCVG484I?
Yes, the 484-FBGA package is suitable for high-density layouts. To ensure reliable connectivity, adhere to recommended PCB pad sizing, use appropriate via stubs or through-hole vias for good grounding, and follow the device's land pattern guidelines. Proper thermal management and controlled impedance routing for high-speed signals like PCI or Ethernet are critical. Consistent testing with adequate PCB fabrication tolerances will optimize signal integrity.
Can the MPFS025TL-FCVG484I handle industrial environments with prolonged operation at high temperatures, and what reliability considerations should I account for?
Yes, the MPFS025TL-FCVG484I is rated for operation from -40°C to 100°C, making it suitable for many industrial environments. To ensure long-term reliability, incorporate appropriate thermal management (heatsinks, airflow), perform thorough burnout and stress testing during development, and select high-quality components and manufacturing processes to prevent early-life failures.
When replacing an older FPGA or MPU in a design, what key differences should I consider before choosing the MPFS025TL-FCVG484I?
Consider the number of logic modules (23K), I/O capacity (136 MCU and 108 FPGA pins), and peripheral support like PCI, Ethernet, CAN, and USB OTG. The MPFS025TL-FCVG484I also uses a RISC-V core and 128KB Flash with 230.4KB RAM. Ensure pin compatibility, voltage levels, and timing requirements match or can be adapted. Evaluate the impact on existing PCB layout, power, and cooling, and adjust firmware/software accordingly.
Is the MPFS025TL-FCVG484I suitable for replacing similar FPGA/MPU devices from other manufacturers, such as Xilinx or Intel, and what trade-offs might I face?
The MPFS025TL-FCVG484I offers a RISC-V MPU combined with FPGA logic, which can simplify integration. When replacing a Xilinx or Intel FPGA, consider differences in peripheral compatibility, core architecture, and development tools. Trade-offs include development ecosystem familiarity, performance differences, and available intellectual property blocks. Ensure that the new device’s resource specifications meet your application requirements and that redesign efforts are justified by the benefits.
How does the inclusion of peripherals like PCI, Ethernet, and USB OTG influence the design considerations for the MPFS025TL-FCVG484I?
These peripherals enable high-speed communication interfaces, requiring careful PCB signal integrity design, impedance matching, and proper grounding. Power supply filtering becomes critical to minimize noise that could affect high-speed links. You must also plan for firmware implementation, driver support, and compliance testing to meet standards associated with PCI, Ethernet, and USB.
What are the critical factors to consider when integrating the MPFS025TL-FCVG484I into a system that requires real-time processing with DMA and PWM peripherals?
Ensure that the DMA and PWM peripherals are correctly configured for deterministic latency, with priority management if necessary. Take into account the bus bandwidth and memory access patterns to avoid contention. Use hardware timers and interrupts judiciously, and verify that peripheral initialization does not interfere with critical real-time tasks. Adequate test cases should be developed to validate real-time performance.
Are there specific considerations for migrating my design from an older 8-bit or 16-bit microcontroller to the MPFS025TL-FCVG484I?
Migration involves substantial changes; the MPFS025TL-FCVG484I’s FPGA and RISC-V MPU offer vastly more resources and capabilities but require a different development approach. Consider pin compatibility, voltage levels, and interface protocols. You will need to rewrite firmware, configure the FPGA fabric for your application, and update development workflows. The increased complexity allows for more sophisticated functions but demands detailed planning and testing.
How do the operating temperature and package specifications of the MPFS025TL-FCVG484I affect its suitability for outdoor or rugged applications?
With an operational temperature range of -40°C to 100°C and a robust 484-FBGA package, the device is suitable for outdoor or rugged environments if proper thermal management and sealing are implemented. Additional protective measures such as conformal coating, hermetic sealing, and enhanced cooling may be necessary depending on environmental exposure levels.
What precautions should I take when designing the power rails and decoupling networks for the MPFS025TL-FCVG484I in high-performance applications?
Use low-ESR decoupling capacitors placed as close as possible to the power pins. Implement separate power domains for core and I/O regions, with proper filtering and ferrite beads if needed. Ensure voltage regulators can supply stable power with minimal ripple, and consider comprehensive EMI filtering measures. Proper layout of power and ground planes is essential to minimize noise coupling and maintain signal integrity.

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