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M2S025-1FGG484

In Stock 687 pcs Reference Price(In US Dollars)
1+
$118.7612
200+
$45.9596
500+
$44.3443
1000+
$43.546
Manufacturer Part Number:
M2S025-1FGG484
Manufacturer / Brand
Microchip Technology
Part of Description:
IC SOC CORTEX-M3 166MHZ 484FBGA
Datasheets:
M2S025-1FGG484(1).pdfM2S025-1FGG484(2).pdfM2S025-1FGG484(3).pdfM2S025-1FGG484(4).pdfM2S025-1FGG484(5).pdfM2S025-1FGG484(6).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 687 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number M2S025-1FGG484
Manufacturer / Brand Microchip Technology
Stock Quantity 687 pcs Stock
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description IC SOC CORTEX-M3 166MHZ 484FBGA
Lead Free Status / RoHS Status: ROHS3 Compliant
Supplier Device Package 484-FPBGA (23x23)
Speed 166MHz
Series SmartFusion®2
RAM Size 64KB
Primary Attributes FPGA - 25K Logic Modules
Peripherals DDR, PCIe, SERDES
Package / Case 484-BGA
Package Tray
Operating Temperature 0°C ~ 85°C (TJ)
Number of I/O 267
Flash Size 256KB
Core Processor ARM® Cortex®-M3
Connectivity CANbus, Ethernet, I²C, SPI, UART/USART, USB
Base Product Number M2S025
Architecture MCU, FPGA

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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M2S025-1FGG484 Product Details:

The M2S025-1FGG484 from Microchip Technology (formerly Micrel) is a sophisticated System on Chip (SoC) integrated circuit that combines the flexibility of FPGA technology with the processing power of an ARM Cortex-M3 microcontroller core operating at 166MHz. This device belongs to the SmartFusion2 series and represents an advanced solution for embedded systems requiring both programmable logic and microcontroller functionality in a single package.

This SoC addresses critical design challenges in modern embedded applications by integrating 25K logic modules of FPGA fabric alongside a dedicated ARM Cortex-M3 processor, eliminating the need for separate FPGA and microcontroller components and thereby reducing board space, power consumption, and system complexity. The dual-architecture approach enables designers to implement custom hardware acceleration in the FPGA fabric while running control software on the processor core, offering unprecedented flexibility for applications requiring real-time processing, custom interfaces, or hardware-based security features.

The device features 256KB of Flash memory for program storage and 64KB of RAM for data processing, providing substantial resources for complex embedded applications. With an impressive 267 I/O pins available in the 484-FPBGA package measuring 23x23mm, the chip offers extensive connectivity options for interfacing with external components. The comprehensive peripheral set includes DDR memory controllers, PCIe interfaces, and SERDES for high-speed serial communications, while connectivity options encompass CANbus for automotive and industrial networks, Ethernet for networking applications, I²C and SPI for sensor and peripheral communication, UART/USART for serial data transfer, and USB for host or device connectivity.

Operating across an industrial temperature range of 0°C to 85°C, this SoC is well-suited for demanding environmental conditions found in industrial automation, automotive systems, medical devices, communications infrastructure, and aerospace applications. The RoHS3 compliant device comes in a tray packaging format with quantities available in 2500-unit lots, making it suitable for volume production environments.

Primary advantages include the seamless integration of FPGA programmability with microcontroller processing, reduced component count and PCB complexity, enhanced security through hardware-based implementations, flexible I/O configuration, and the ability to implement custom protocols or interfaces in hardware while maintaining software control. Equivalent or alternative models within the SmartFusion2 family include the M2S010, M2S050, M2S090, M2S150, and higher-density variants, each offering different logic module counts and feature sets to match specific application requirements, while competitive alternatives from other manufacturers include Xilinx Zynq-7000 series SoCs and Intel (Altera) Cyclone V SoC devices that similarly combine ARM processors with FPGA fabric.

M2S025-1FGG484 Key Technical Attributes

ARM Cortex-M3 Core Processor

166MHz Operating Speed

484-FPBGA (23x23) Package

M2S025-1FGG484 Packing Size

This product comes in a tray packaging format, which is ideal for bulk handling and automated assembly. The package type is a 484-FPBGA (Fine-Pitch Ball Grid Array) with a dimension of 23mm x 23mm. The material used in the package provides excellent thermal performance and ensures durability during soldering and regular operation. The pin configuration features 484 balls, supporting a robust interconnection network, while the device offers superior resistance to thermal stress with an operating junction temperature range of 0°C to 85°C. The electrical properties are reinforced by the integration of 25K logic modules and wide input/output capabilities, supporting up to 267 I/O pins.

M2S025-1FGG484 Application

The M2S025-1FGG484 is engineered for advanced embedded applications, including industrial automation, communications infrastructure, automotive control systems, and secure networking devices. Its integration of MCU and FPGA architecture makes it particularly well suited for applications that require real-time processing, flexible hardware customization, and rigorous data security.

M2S025-1FGG484 Features

This System-on-Chip leverages a powerful ARM Cortex-M3 processor core operating at 166MHz, offering 256KB of flash memory and 64KB of RAM for robust program and data management. The embedded FPGA features 25,000 logic modules, enabling customizable hardware logic and allowing the user to tailor functionality for specific project needs. Peripherals are comprehensive, with on-chip support for DDR memory, PCI Express (PCIe), and SERDES. Connectivity options are extensive, including CANbus for industrial networks, Ethernet for high-speed data transmission, Inter-IC Communication (I²C), Serial Peripheral Interface (SPI), Universal Asynchronous Receiver-Transmitter/Universal Synchronous-Asynchronous Receiver-Transmitter (UART/USART), and USB for plug-and-play extensibility. The device operates within a safe temperature window and is fully compliant with ROHS3 environmental standards.

M2S025-1FGG484 Quality and Safety Features

Strict adherence to ROHS3 compliance ensures that the M2S025-1FGG484 meets the highest standards of environmental safety and material quality. The packaging and build are designed to sustain typical industrial and commercial environmental stresses, while the thermal characteristics guarantee reliable operation over extended temperature ranges. The SmartFusion2 series offers advanced security, power management, and error-checking mechanisms, providing an extra layer of safety for mission-critical applications.

M2S025-1FGG484 Compatibility

The M2S025-1FGG484 is part of the SmartFusion2 series and is compatible with a wide range of development tools and boards provided by Microchip Technology. It supports seamless integration into existing embedded systems that utilize ARM Cortex-M3 architecture, FPGA logic, and networked communication interfaces. Its pin-out and package dimensions align with industry standards, ensuring straightforward replacement and upgrading in compatible designs.

M2S025-1FGG484 Datasheet PDF

For comprehensive technical details—including electrical characteristics, pin descriptions, interface specifications, and application guidelines—please download the latest and most authoritative datasheet directly from our website. Our datasheet repository is regularly updated for accuracy and completeness. We highly recommend visiting the product page and downloading the datasheet PDF for the M2S025-1FGG484 to ensure you are working with official, reliable documentation.

Quality Distributor

IC-Components is your trusted, premium distributor for Microchip Technology products, including the SmartFusion2 series. As an authorized source, we guarantee genuine components, superior customer support, and competitive pricing. We invite you to experience our excellent services—request a quote for the M2S025-1FGG484 on our website and join thousands of satisfied customers who rely on IC-Components for dependable delivery and professional expertise.

Frequently Asked Questions

What are the key considerations for integrating the M2S025-1FGG484 in a low-power embedded design?
When integrating the M2S025-1FGG484 in a low-power embedded system, ensure your power supply provides a stable 1.8V/3.3V rail compatible with the device's I/O levels, and implement power management techniques such as clock gating and power-down modes. Pay attention to the operational temperature range (0°C to 85°C) and verify that your application stays within these limits to prevent reliability issues. Proper decoupling and PCB layout are crucial to minimize noise affecting the ARM Cortex-M3 core and FPGA logic.
How does the 484-FPBGA package size influence PCB design and thermal management for the M2S025-1FGG484?
The 484-FPBGA (23x23 mm) package requires careful PCB footprint planning with appropriate via-in-pad and thermal via arrangements to ensure proper heat dissipation. Use thermal pads and heatsinks if operating near the upper temperature limit (85°C) in high-speed or high-density applications. Ensure your PCB design follows recommended land patterns and has sufficient copper area for power and ground planes to maintain signal integrity and temperature stability.
Can the M2S025-1FGG484 replace a similar FPGA or SoC from another manufacturer, and what are the key differences to consider?
Replacement requires evaluating differences in connectivity, I/O count (267 I/Os), logic density (25K logic modules), and peripheral support. The M2S025 offers integrated ARM Cortex-M3 and FPGA fabric, which may differ in architecture, vendor-specific tools, and IO standards from other parts. Assess the compatibility of your existing design, including package pitch, voltage levels, and software ecosystem, to ensure seamless migration. Differences in power consumption and thermal profile must also be considered.
Are there specific considerations for using the M2S025-1FGG484 in industrial environments with long-term operation?
Yes, when deploying the M2S025-1FGG484 in industrial applications, verify that operating conditions remain within the specified temperature range (0°C to 85°C). Consider potential effects of temperature cycling and humidity; ensure conformal coating or appropriate sealing. Power supply regulation and filtering are imperative to mitigate voltage dips or noise. Use of industrial-grade power supplies and robust PCB design can enhance long-term reliability.
What are the critical power supply requirements for the M2S025-1FGG484 during system design?
The M2S025-1FGG484 requires a stable, low-noise power supply capable of delivering the necessary current for active FPGA logic, Cortex-M3 core, and peripherals. It typically operates at core voltage levels around 1.2V to 1.8V for the FPGA and 3.3V or 1.8V for I/O signals. Implement proper voltage regulation, filtering, and decoupling capacitors close to the device pins to prevent transient voltage dips, which could affect data integrity and device stability.
How should I approach clocking and synchronization in a design using the M2S025-1FGG484?
The M2S025-1FGG484 operates at 166MHz with the ARM Cortex-M3 core and FPGA fabric potentially requiring different clock domains. Use dedicated clock sources and phase-locked loops (PLLs) to minimize jitter. Proper clock tree design and synchronization strategies are essential to prevent metastability or data corruption across clock domains. Consult the device's data sheet and reference design guidelines for optimal clock distribution methods.
What are the best practices for configuring, programming, or initializing the M2S025-1FGG484 in your embedded system?
Configure the device via SPI, JTAG, or dedicated configuration interfaces, depending on your application. Use the provided Microchip or third-party development tools to generate configuration bitstreams for the FPGA fabric and firmware for the Cortex-M3 core. Ensure that configuration sequences are performed reliably, including power-on reset and integrity checks. Incorporate fallback modes or recovery procedures in case of configuration failure.
Is the M2S025-1FGG484 suitable for applications requiring high-speed data transfer via PCIe or SERDES? What constraints should I be aware of?
Yes, the M2S025 supports PCIe and SERDES interfaces, making it suitable for high-speed data transfer applications. Ensure that your PCB layout carefully considers impedance matching, differential pair routing, and proper termination to uphold signal integrity. Use differential PCB routing and maintain controlled impedance to minimize reflections. Be aware of the maximum supported data rates and the need for appropriate clocking and synchronization circuits when handling high-speed signals.
When considering replacing the M2S025-1FGG484 with alternative components, what trade-offs regarding logic density and peripheral support should I evaluate?
Replacing the M2S025-1FGG484 with other parts involves balancing logic capacity, peripheral features, package size, and power consumption. While alternatives may offer higher logic density or different peripherals, they may lack integrated ARM cores or specific interfaces like PCIe or SERDES. Consider the impact on firmware and PCB redesign, ensure compatibility with existing I/O standards, and evaluate long-term availability and supplier support before migrating.
What matching, filtering, or shielding considerations are necessary when designing with the M2S025-1FGG484 to ensure signal integrity in noisy environments?
To preserve signal integrity, implement proper impedance-controlled differential pair routing for high-speed interfaces such as PCIe and SERDES. Use shielding techniques like ground guard traces or metal panels for sensitive signals. Incorporate filtering capacitors and ferrite beads on power lines to suppress noise. Maintain a solid ground plane and minimize cross-talk by strategic component placement. Allocate sufficient PCB area for decoupling and consider using controlled impedance traces aligned to the device manufacturer's guidelines.

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