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DSPIC33EP128MC506-E/MR

In Stock 8459 pcs Reference Price(In US Dollars)
1+
$11.3863
200+
$4.4067
500+
$4.2522
1000+
$4.1757
Manufacturer Part Number:
DSPIC33EP128MC506-E/MR
Manufacturer / Brand
Microchip Technology
Part of Description:
IC MCU 16BIT 128KB FLASH 64VQFN
Datasheets:
DSPIC33EP128MC506-E/MR(1).pdfDSPIC33EP128MC506-E/MR(2).pdfDSPIC33EP128MC506-E/MR(3).pdfDSPIC33EP128MC506-E/MR(4).pdfDSPIC33EP128MC506-E/MR(5).pdfDSPIC33EP128MC506-E/MR(6).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 8459 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number DSPIC33EP128MC506-E/MR
Manufacturer / Brand Microchip Technology
Stock Quantity 8459 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microcontrollers
Description IC MCU 16BIT 128KB FLASH 64VQFN
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply (Vcc/Vdd) 3V ~ 3.6V
Supplier Device Package 64-VQFN (9x9)
Speed 60 MIPs
Series Automotive, AEC-Q100, dsPIC™ 33EP
RAM Size 8K x 16
Program Memory Type FLASH
Program Memory Size 128KB (43K x 24)
Peripherals Brown-out Detect/Reset, DMA, Motor Control PWM, POR, PWM, WDT
Package / Case 64-VFQFN Exposed Pad
Package Tube
Oscillator Type Internal
Operating Temperature -40°C ~ 125°C (TA)
Number of I/O 53
Mounting Type Surface Mount
EEPROM Size -
Data Converters A/D 16x10b/12b
Core Size 16-Bit
Core Processor dsPIC
Connectivity CANbus, I²C, IrDA, LINbus, QEI, SPI, UART/USART
Base Product Number DSPIC33EP128MC506

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Company Name : IC COMPONENTS LTD
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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the DSPIC33EP128MC506-E/MR be used in a 5V-tolerant industrial control system without level-shifting circuitry?
No, the DSPIC33EP128MC506-E/MR is not 5V-tolerant. Its Vcc/Vdd range is strictly 3.0V to 3.6V, and applying 5V to any I/O pin may cause latch-up or permanent damage. Level-shifting or voltage translation is required when interfacing with 5V logic systems.
What are the key considerations when replacing a legacy PIC24FJ-series microcontroller with the DSPIC33EP128MC506-E/MR in an existing motor control design?
The DSPIC33EP128MC506-E/MR offers enhanced motor control PWM modules and a higher 60 MIPS performance, but migration requires verification of clock source compatibility, peripheral register mapping differences, and potential changes in interrupt vector handling. Additionally, the 64-VQFN package has a different pinout and thermal pad layout, necessitating PCB redesign.
Is the internal oscillator of the DSPIC33EP128MC506-E/MR sufficient for CAN communication in automotive environments?
The internal oscillator provides adequate timing for basic operation, but CAN protocols demand precise baud rate accuracy. For reliable CAN communication in automotive applications, an external crystal or resonator is recommended to meet ISO 11898 timing tolerances, despite the internal oscillator’s ±2% accuracy.
How does the exposed pad on the 64-VQFN package affect thermal management in high-temperature industrial applications?
The exposed thermal pad on the DSPIC33EP128MC506-E/MR must be soldered to a grounded copper pour on the PCB to effectively dissipate heat. In ambient temperatures approaching 125°C, proper thermal vias and copper area are critical to prevent junction temperature exceedance, as the package relies on conduction through the PCB for cooling.
Can the DSPIC33EP128MC506-E/MR operate reliably in a -40°C environment with frequent power cycling?
Yes, the device is rated for -40°C to 125°C operation and qualified to AEC-Q100, making it suitable for cold environments. However, repeated power cycling at low temperatures may induce mechanical stress on solder joints due to CTE mismatch; ensure proper board layout and conformal coating in harsh environments.
What are the risks of using the DMA controller with concurrent access to flash memory during high-speed data acquisition?
The DSPIC33EP128MC506-E/MR allows concurrent flash access and DMA operations, but sustained high-bandwidth DMA transfers may contend with CPU fetch cycles, increasing effective instruction latency. For time-critical routines, place performance-sensitive code in RAM or use the dual-partition flash architecture to minimize contention.
Is it safe to disable the Brown-out Detect (BOD) feature to reduce power consumption in a battery-powered sensor node?
Disabling BOD on the DSPIC33EP128MC506-E/MR is not recommended unless the power supply includes independent undervoltage monitoring. Without BOD, voltage dips below 2.7V can cause undefined behavior or flash corruption, especially during write/erase cycles.
Can the DSPIC33EP128MC506-E/MR replace a dsPIC33EP128GP502 in a LIN bus gateway application?
While both are dsPIC33EP devices, the DSPIC33EP128MC506-E/MR has additional motor control peripherals and a different pinout. The GP502 lacks QEI and enhanced PWM, but the MC506’s extra I/O and peripherals may require firmware adaptation. Verify UART/LIN timing and pin compatibility before substitution.
What precautions are needed when designing the power supply for the DSPIC33EP128MC506-E/MR in a noisy motor drive environment?
Use a low-noise LDO with adequate PSRR, place decoupling capacitors (100nF ceramic + 10µF bulk) within 2mm of each Vdd pin, and isolate analog and digital grounds. The A/D converters are sensitive to supply noise; consider separate analog supply filtering if using 12-bit conversions.
How does the absence of integrated EEPROM in the DSPIC33EP128MC506-E/MR affect long-term data logging in field-deployed systems?
Since the DSPIC33EP128MC506-E/MR lacks on-chip EEPROM, non-volatile data must be stored in flash. Flash endurance is typically 10,000 cycles per sector, so implement wear-leveling algorithms or use external serial EEPROM if frequent writes are required to avoid premature failure.

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