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Home > Products > Integrated Circuits (ICs) > Specialized ICs > MM3Z11V
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MM3Z11V

Manufacturer Part Number:
MM3Z11V
Manufacturer / Brand
ASONIC
Part of Description:
MM3Z11V TC SOD323
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 84200 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number MM3Z11V
Manufacturer / Brand ASONIC
Stock Quantity 84200 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description MM3Z11V TC SOD323
Lead Free Status / RoHS Status: RoHS Compliant
RFQ MM3Z11V Datasheets MM3Z11V Details PDF
MM3Z11V Details PDF for FR.pdf
MM3Z11V Details PDF for KR.pdf
MM3Z11V Details PDF for IT.pdf
MM3Z11V Details PDF for ES.pdf
MM3Z11V Details PDF for DE.pdf
Package SOD323
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the MM3Z11V be used as a replacement for the ZMM6V2 in a 3.3V power rail clamping circuit, and what are the key differences in voltage tolerance and response time?
The MM3Z11V cannot reliably replace the ZMM6V2 in a 3.3V clamping application due to its breakdown voltage being significantly higher than the supply rail. The ZMM6V2 is rated at 6.2V ±5%, making it suitable for 3.3V systems where it remains well below its maximum operating voltage. In contrast, the MM3Z11V has a nominal reverse standoff voltage of 11V, which would operate deep in its avalanche region under normal 3.3V conditions, increasing leakage current and risking thermal instability. This mismatch can lead to premature failure or insufficient protection during transients.
What are the thermal limitations when using the MM3Z11V in high-ambient temperature environments, and does it require a heatsink in compact PCB designs?
The MM3Z11V is a SOD323 package with limited thermal dissipation capability—typically rated for 200mW at 25°C ambient, derating to near zero above 85°C. In industrial applications exceeding 70°C ambient, continuous operation near full power rating risks junction overstress. Due to its small footprint and lack of exposed thermal pad, it generally does not require a heatsink but demands careful layout with adequate copper pour and spacing. Engineers should verify power dissipation against actual transient energy and duty cycle, especially in surge-protected circuits.
Is the MM3Z11V suitable for use in a buck converter feedback divider where input voltage ranges from 5V to 12V, and how does its capacitance affect high-frequency noise filtering?
The MM3Z11V has a junction capacitance typically around 70pF, which may interfere with high-frequency switching noise in feedback paths above 1MHz. While it can stabilize the reference voltage within the 5V–12V range, its capacitance could couple switching ripple into the control loop if placed too close to the regulator output. For optimal performance, place the MM3Z11V downstream of RC filters and avoid routing adjacent to noisy traces. It is not recommended for primary EMI filtering due to insufficient capacitance value and slow response compared to ceramic capacitors.
How does the MM3Z11V compare to the BZT52C11 in terms of long-term stability and reliability under repeated transient events?
The MM3Z11V and BZT52C11 both target 11V Zener applications, but the BZT52C11 often exhibits tighter tolerance (±5% vs typical ±10% for MM3Z11V) and better long-term drift characteristics. Under repeated surge events, the MM3Z11V may degrade faster due to less robust metallization and packaging compared to the glass-sealed BZT52C11. For critical reliability applications such as automotive or industrial control, the BZT52C11 is preferred despite potential cost or sourcing differences. Designers should derate voltage by 10–15% to ensure margin.
Can the MM3Z11V be used in parallel with another diode to increase current handling, and what issues arise from mismatched forward voltages?
Parallel connection of MM3Z11V diodes is not recommended due to significant mismatch in forward voltage drop (typically 0.7–1.2V depending on current), leading to uneven current sharing. One diode will carry most of the load while others remain inactive, causing localized heating and early failure. Even with matched parts, parasitic inductance and package asymmetry exacerbate imbalance. Instead, use a single diode rated for total expected forward current or consider alternative protection schemes like TVS arrays.
What configuration method should be used when integrating the MM3Z11V into an ESD protection network alongside a series resistor, and how does impedance matching affect transient response?
When integrating the MM3Z11V into an ESD clamp circuit with a series resistor, the resistor must be sized to limit peak current into the Zener while allowing rapid discharge of electrostatic charges. Typical values range from 10Ω to 100Ω depending on system impedance (e.g., USB 2.0 requires <8kV HBM compliance). The MM3Z11V’s fast response (sub-nanosecond) enables effective clamping only if the series impedance doesn’t delay charge injection. Ensure PCB parasitics are minimized through short traces and ground plane proximity to maintain bandwidth.
Does the MM3Z11V support bidirectional voltage regulation, and how can it be configured for use in CAN bus protection?
No, the MM3Z11V is unidirectional and designed for unclamped reverse-bias operation. To protect a CAN bus line operating at 5V (ISO 11898-2 compliant), two MM3Z11V diodes must be used in anti-parallel configuration across the differential lines. This allows symmetric clamping of both positive and negative transients. However, note that the forward voltage drop (~0.6V) introduces slight signal distortion; for low-voltage differential signaling, consider dedicated CAN transceivers with built-in ESD protection instead.
What precautions should be taken when soldering the MM3Z11V on a high-density PCB with reflow profiles exceeding 245°C?
The MM3Z11V has a maximum junction temperature of 150°C and is sensitive to thermal stress. Reflow profiles above 245°C for extended durations may cause delamination or bond wire degradation. Use a solder paste compatible with lead-free processes but limit peak temperature to ≤240°C and dwell time under liquidus to <60 seconds. Prefer nitrogen atmosphere to reduce oxidation and ensure proper wetting on small pads. Post-reflow inspection via X-ray is advised for batch validation.
Is the MM3Z11V RoHS compliant, and does it contain any substances restricted under REACH or WEEE directives?
Yes, the MM3Z11V is fully RoHS compliant and free from lead, mercury, cadmium, hexavalent chromium, PBB, and PBDE. It meets EU REACH and WEEE requirements for electronic components. Documentation is available upon request for supply chain transparency, particularly important in aerospace and medical device design-in cycles where material traceability is mandatory.

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MM3Z11V TC SOD323

In Stock: 84200

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