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F65A+

Manufacturer Part Number:
F65A+
Manufacturer / Brand
MAXIM
Part of Description:
MAXIM BGA
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 4401 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F65A+
Manufacturer / Brand MAXIM
Stock Quantity 4401 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description MAXIM BGA
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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F65A+ Product Details:

The F65A+ is a specialized integrated circuit manufactured by Analog Devices/Maxim Integrated, designed to address complex electronic system requirements through advanced semiconductor technology. This component falls within the specialized ICs category, representing Maxim's expertise in delivering high-performance solutions for demanding applications.

This device features a BGA (Ball Grid Array) package configuration with 869 connections, providing exceptional density and signal integrity for space-constrained designs. The BGA packaging addresses critical design challenges including thermal management, reduced parasitic inductance, and improved electrical performance compared to traditional packaging methods. This high pin-count configuration enables complex functionality while maintaining a compact footprint, making it ideal for applications requiring extensive I/O capabilities and robust interconnection reliability.

The primary advantages of this specialized IC include superior signal integrity due to shorter interconnect paths, enhanced thermal dissipation characteristics, and improved mechanical stability. The BGA format allows for higher integration density, enabling designers to implement sophisticated features within limited board space. With 4201 units available, this component offers good supply availability for both prototyping and production requirements.

This specialized integrated circuit finds application across diverse sectors including telecommunications infrastructure, industrial automation systems, medical instrumentation, automotive electronics, data acquisition systems, and high-performance computing platforms. Its robust design makes it particularly suitable for applications demanding reliable operation under challenging environmental conditions.

Regarding equivalent or alternative models, specific cross-references would depend on the exact functional specifications of the F65A+, which aren't fully detailed in the basic parameters provided. Designers seeking alternatives should consult Analog Devices/Maxim Integrated's product selector tools or contact their technical support for pin-compatible or functionally equivalent options within their specialized IC portfolio, as direct replacements for specialized BGA devices typically require careful verification of electrical characteristics, pinout compatibility, and thermal performance parameters.

F65A+ Key Technical Attributes

Manufacturer Part Number: F65A+

Brand: Analog Devices / Maxim Integrated

Package / Case: 869-Ball BGA

F65A+ Packing Size

This product is supplied in an 869-ball BGA (Ball Grid Array) package, which is widely recognized for enabling high-density component placement, compact design, and improved thermal management. The BGA’s substrate is typically made from high-reliability materials suited for advanced IC assembly, ensuring robust mechanical and thermal performance. The specific pin configuration features 869 individual solder balls that facilitate efficient and reliable electrical connections with the PCB. The compact packaging supports enhanced signal integrity, reduced parasitics, and efficient heat dissipation, making it suitable for intensive applications.

F65A+ Application

The F65A+ specialized IC is engineered for advanced, high-performance electronic systems that demand meticulous design and integration. It is commonly utilized in networking equipment, telecommunications infrastructure, industrial automation, and cutting-edge embedded systems. This part is ideally suited for environments where a combination of reliability, high-density integration, and minimal form factor are required to achieve optimal system performance.

F65A+ Features

This specialized IC from Analog Devices / Maxim Integrated features comprehensive signal processing capabilities, precision control, and low noise operation, which are all critical for ensuring the highest levels of data integrity and accuracy in complex systems. The 869-ball BGA package supports efficient space utilization on the board, allowing engineers to design smaller, lighter, and more robust devices without compromising performance. Outstanding thermal dissipation is delivered through the BGA architecture, ensuring operational stability even in thermally demanding applications. The part’s electrical and mechanical robustness is achieved through advanced packaging and precise pin-out, reducing risks of signal cross-talk and electromagnetic interference. Furthermore, the component is designed for long-term reliability under continuous high-cycle operation, which adds significant value to mission-critical applications.

F65A+ Quality and Safety Features

The F65A+ adheres to stringent manufacturing quality controls in accordance with Analog Devices / Maxim Integrated’s internationally recognized standards. It is constructed with high-reliability materials for enhanced durability, and features built-in mechanisms for electrostatic discharge (ESD) protection and thermal management, safeguarding the device against operational hazards. Traceability and conformance documentation are provided to ensure peace of mind for supply chain quality assurance. Comprehensive testing assures superior device consistency and reliability across all batches.

F65A+ Compatibility

Engineered for seamless integration, the F65A+ is compatible with industry-standard PCB layouts for BGA packages and supports a broad range of host controllers and companion ICs commonly used in telecommunications, industrial, and networking solutions. Its pin configuration and electrical interface are tailored for compatibility with advanced circuit materials and lead-free, RoHS-compliant assembly lines, facilitating eco-friendly and future-proof electronic designs.

F65A+ Datasheet PDF

Customers can find and download the most authoritative and up-to-date datasheet for the F65A+ directly on our website. We strongly recommend reviewing this document to obtain comprehensive details including electrical specifications, mechanical drawings, recommended operating conditions, and in-depth application guides, ensuring you make the best design and procurement decisions for your project.

Quality Distributor

IC-Components is proud to be your premium and trusted distributor for Analog Devices / Maxim Integrated products, including the F65A+. We offer competitive pricing, comprehensive support, and global sourcing capabilities to ensure timely delivery and full traceability with every shipment. Get an instant quote for the F65A+ on our website today and benefit from our industry-leading service and supply chain solutions!

Frequently Asked Questions

What are the key design considerations when integrating the MAXIM F65A+ BGA IC into my power management system?
When integrating the MAXIM F65A+ BGA IC, ensure the PCB layout accommodates its 869-case BGA package for optimal heat dissipation and signal integrity. Pay attention to the recommended thermal pad placement, maintain proper clearances for ground planes, and follow MAXIM's guidelines for decoupling capacitor placement. Additionally, verify that your power supply voltage levels and I/O voltage compatibility meet the device’s operational specifications to prevent damage or performance issues.
Can the MAXIM F65A+ BGA IC be used in industrial temperature environments, and what factors affect its reliability?
The MAXIM F65A+ BGA IC is suitable for industrial applications if operated within its specified temperature range, which typically covers -40°C to +85°C or higher, depending on the datasheet specifications. For long-term reliability, ensure proper thermal management, minimize thermal cycling, and verify that power supply stability and proper filtering are maintained under industrial conditions to prevent premature failure.
What are the critical considerations when replacing an older BGA component with the MAXIM F65A+ in an existing design?
When replacing an older BGA component with the MAXIM F65A+, confirm PCB pad compatibility, including footprint dimensions and pinouts. Assess thermal dissipation requirements, as different ICs may have varied heat generation. Also, review the supply voltage and logic levels to ensure compatibility, and consider re-evaluating decoupling and grounding schemes to meet the new device’s specific needs for optimal performance and reliability.
How does the package size and pin configuration of the MAXIM F65A+ (869 case, BGA) influence PCB design and manufacturing complexity?
The 869-case BGA package of the MAXIM F65A+ requires precise PCB layout, including well-designed via fencing, controlled capture pads, and adequate thermal reliefs. The large pin count and spacing can increase assembly complexity, demanding high-precision reflow and testing procedures. Proper design reduces the risk of solder joint failures and facilitates effective thermal management, ensuring reliable operation.
Is the MAXIM F65A+ suitable for low-voltage digital interfaces, and what are the considerations for I/O compatibility?
Yes, the MAXIM F65A+ is suitable for low-voltage digital interfaces if its I/O voltage levels are compatible with your system (check the datasheet for maximum I/O voltage ratings). Ensure that the I/O drive strengths and voltage thresholds align with the digital logic levels used. To prevent signal integrity issues or damage, incorporate appropriate level-shifting or buffering if necessary.
What are the main differences between the MAXIM F65A+ and similar ICs from competing brands, and how do these influence component selection?
The MAXIM F65A+ offers specific features such as its BGA package, advanced power management capabilities, and manufacturer-specific design support. When comparing with alternatives, consider factors like supply voltage range, thermal performance, availability, and existing design familiarity. The choice impacts manufacturability, reliability, and long-term support; selecting a comparable device may require evaluating trade-offs in package, performance specifications, and application suitability.
How should I handle the power supply decoupling and grounding when using the MAXIM F65A+ BGA IC in high-current applications?
For high-current applications, implement a robust decoupling strategy using multiple high-quality ceramic capacitors placed close to the power pins of the MAXIM F65A+ to minimize transient impedance. Use a solid, low-impedance ground plane with via stitching around the device to reduce ground noise and improve signal integrity. Proper power routing and thermal considerations are also critical to ensure stable operation.
What operating conditions are critical for ensuring the longevity of the MAXIM F65A+ in continuous industrial deployment?
To maximize longevity, maintain stable supply voltages, avoid voltage spikes, and operate within recommended temperature ranges. Provide adequate thermal management—such as heat sinking or airflow—and minimize mechanical stress on the BGA package during assembly and operation. Regular testing and monitoring of device parameters can also help detect early signs of failure, ensuring reliable long-term deployment.
Are there recommended alternative parts to the MAXIM F65A+ for applications requiring similar functionality and package?
When seeking alternatives, consider components from reputable manufacturers that offer comparable internal circuitry, package types, and thermal performance. For example, some devices from other brands may offer similar integrated features but differ in pinout, voltage ranges, or thermal characteristics. It’s essential to evaluate datasheets thoroughly to ensure compatibility and to assess design trade-offs such as power consumption, availability, and thermal management.
What are the best practices for handling and assembling the MAXIM F65A+ BGA IC during manufacturing to prevent defects?
Handle the MAXIM F65A+ with proper ESD precautions, using anti-static tools and mats. During assembly, ensure precise PCB alignment and controlled reflow soldering processes tailored to the BGA package. Use proper flux application and inspect solder joints carefully post-assembly with X-ray or AOI to confirm electrical and mechanical reliability. Proper storage in dry, static-free environments also preserves the device’s integrity prior to assembly.

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