The MD1501C11PPL is a specialized integrated circuit (IC) manufactured by HITALHI, designed for advanced electronic applications requiring precise and compact component integration. This BGA (Ball Grid Array) packaged semiconductor offers high-density interconnectivity and enhanced thermal performance, making it suitable for complex electronic systems that demand miniaturization and efficient signal processing.
The BGA encapsulation provides superior electrical connectivity through its array of solder balls, enabling robust mounting and reducing signal interference compared to traditional packaging methods. Its specialized IC classification suggests the component is engineered for specific technical requirements, likely targeting high-performance computing, telecommunications, or advanced industrial control systems.
With a substantial quantity of 5000 units available, the MD1501C11PPL is well-suited for large-scale manufacturing projects and engineering applications that require consistent, reliable semiconductor performance. The component's compact form factor and advanced packaging technology address critical design challenges such as space constraints, thermal management, and signal integrity in modern electronic device development.
While specific detailed electrical characteristics are not provided in the initial specification, the HITALHI MD1501C11PPL represents a high-quality integrated circuit solution for engineers and manufacturers seeking a reliable, specialized semiconductor component. Potential equivalent or alternative models would likely come from manufacturers like Texas Instruments, Analog Devices, or NXP Semiconductors, though direct comparisons would require more comprehensive technical specifications.
The product's BGA package and specialized IC classification indicate it is optimized for applications requiring precision, reliability, and compact integration across various high-technology sectors, including telecommunications, industrial control, aerospace, and advanced consumer electronics.
MD1501C11PPL Key Technical Attributes
Manufacturer Part Number: MD1501C11PPL
Package: BGA, 867 pins
Main Category: Integrated Circuits (ICs)
MD1501C11PPL Packing Size
This product is supplied in a Ball Grid Array (BGA) package, featuring 867 connections for robust and secure mounting on printed circuit boards. The BGA package is renowned for its efficient thermal conduction and electrical performance. Careful handling is necessary due to the fine-pitch and compact pin configuration. Typically, BGAs are packed in anti-static trays or tape and reel, ensuring protection against physical damage and static electricity during transportation and storage.
MD1501C11PPL Application
The MD1501C11PPL is designed for specialized integrated circuit applications, suitable for advanced electronic systems requiring high-density integration and reliable connectivity. Common uses include telecommunications, high-end computing, networking devices, and embedded control systems, where compact packaging and high pin counts are essential for performance.
MD1501C11PPL Features
The MD1501C11PPL boasts a cutting-edge BGA encapsulation with 867 balls, maximizing IO density and minimizing the footprint on the PCB. This device is optimized for high-frequency and high-speed signal transmission, providing excellent heat dissipation and minimal signal loss. The specialized IC design ensures tailored performance for specific industry needs, including stable operation in demanding environments, reduced electrical interference, and support for advanced signal processing. Additionally, this product benefits from a robust manufacturing process that prioritizes both reliability and efficiency.
MD1501C11PPL Quality and Safety Features
The HITALHI MD1501C11PPL undergoes stringent quality checks and follows recognized industry standards. The BGA encapsulation provides mechanical stability and reduces the risk of solder joint failure. Anti-static protection and proper ESD handling guidelines are enforced throughout the packaging and shipping process. Lead-free and RoHS-compliant options are often available, ensuring safety for environmental and end-user considerations.
MD1501C11PPL Compatibility
This specialized IC is compatible with advanced circuit designs that accommodate BGA packages. Its 867-pin configuration matches custom and standard socket and PCB layouts for high-density interconnects in major electronics platforms. Ensure your board layout matches the BGA footprint, and that thermal management and reflow soldering capabilities are accounted for in your production process.
MD1501C11PPL Datasheet PDF
Our website offers the most authoritative and up-to-date datasheet for the MD1501C11PPL from HITALHI. We strongly encourage you to download the official datasheet directly from this page for comprehensive technical specifications and application guidelines. Utilize this essential document to inform your design and procurement decisions with complete confidence.
Quality Distributor
IC-Components is your trusted, premium distributor for HITALHI products, including the MD1501C11PPL. With direct sourcing and a stringent quality assurance process, we guarantee genuine components and competitive pricing. Visit our website to request an instant quote and experience exceptional service and technical support for all your component needs.
