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Home > Products > Integrated Circuits (ICs) > Specialized ICs > F751824GJH
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F751824GJH

Manufacturer Part Number:
F751824GJH
Manufacturer / Brand
TI
Part of Description:
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 16004 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F751824GJH
Manufacturer / Brand TI
Stock Quantity 16004 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key design considerations when integrating the F751824GJH into a mixed-voltage system with 3.3V and 5V logic domains?
The F751824GJH requires careful level-shifting or I/O voltage domain management when interfacing between 3.3V and 5V logic levels, as its absolute maximum input voltage is tied to VCC. Direct connection to 5V signals without proper buffering or level translation may exceed the device’s voltage tolerance and risk long-term reliability. Use of series resistors or dedicated level translators is recommended for signal lines crossing voltage domains, especially in bidirectional communication paths.
Can the F751824GJH be used as a drop-in replacement for the PCA9517A in existing I2C bus designs?
While both devices serve I2C bus buffering functions, the F751824GJH is not a direct pin-compatible or electrically equivalent replacement for the PCA9517A. Key differences include supply voltage range, enable logic thresholds, and bus capacitance handling. Replacing the PCA9517A with the F751824GJH requires verification of timing margins, pull-up resistor sizing, and enable signal compatibility, particularly in systems operating near 3.3V or with high capacitive loads.
What are the thermal and power dissipation limits of the F751824GJH in a sealed industrial enclosure with limited airflow?
The F751824GJH has a maximum junction temperature of 125°C and a thermal resistance (θJA) that varies by package. In a sealed enclosure with ambient temperatures exceeding 70°C, power dissipation from bus activity and quiescent current must be calculated to ensure junction temperature remains within limits. Derating is advised above 85°C ambient, and thermal vias or copper pour under the package can improve heat spreading.
How does the F751824GJH handle bus contention during hot-plug events in backplane applications?
The F751824GJH includes built-in slew rate control and glitch filtering to mitigate transient disturbances during hot-plug scenarios. However, during insertion, floating or momentarily shorted I/O lines can cause unintended bus states. Designers should incorporate pull-up resistors on both sides of the buffer and consider staggered connector pin sequencing to ensure ground and power establish before signal lines make contact.
Is the F751824GJH suitable for use in automotive environments with wide temperature fluctuations and EMI exposure?
The F751824GJH is not rated for automotive qualification (e.g., AEC-Q100), and its operating temperature range and ESD performance may not meet the robustness required for under-hood or exterior vehicle applications. While it may function in benign cabin environments, long-term reliability under thermal cycling, vibration, and conducted EMI cannot be assured without additional filtering and protection circuitry.
What configuration options are available for enabling or disabling the F751824GJH in a multi-drop I2C network with dynamic device presence?
The F751824GJH features an active-low enable pin (EN) that allows software or hardware control of buffer operation. This enables selective isolation of bus segments in multi-drop systems. When EN is asserted low, the buffer enters high-impedance state, effectively disconnecting its side of the bus. This is useful for power management or fault containment, but timing of EN relative to I2C transactions must be managed to avoid bus corruption.
How does the F751824GJH perform under high capacitive loading, such as in long cable runs or daisy-chained sensor arrays?
The F751824GJH is designed to drive bus capacitances up to 400 pF, but performance degrades with longer cables or multiple node connections. Rise time degradation and signal integrity issues may occur beyond this limit. For loads exceeding 400 pF, consider segmenting the bus with additional buffers or reducing pull-up resistor values while staying within the device’s current sourcing capability.
Are there known compatibility issues when using the F751824GJH with fast-mode plus (FM+) I2C devices operating at 1 MHz?
The F751824GJH supports standard and fast-mode I2C up to 400 kHz. It is not specified for 1 MHz FM+ operation, and internal propagation delays may distort timing margins at higher speeds. Use in 1 MHz systems risks setup/hold violations and ACK/NACK misinterpretation. For FM+ applications, select a buffer explicitly rated for 1 MHz operation.
What precautions should be taken when replacing a failed F751824GJH in a field-deployed system with mixed legacy and modern I2C peripherals?
Before replacing the F751824GJH, verify that the replacement unit matches the original’s firmware configuration, pull-up network design, and bus loading conditions. Mismatched buffer characteristics can alter rise times and affect communication with slower legacy devices. Additionally, inspect for latent bus faults such as solder bridges or ESD damage that may have caused the original failure.
Can the F751824GJH be powered down independently while other I2C devices remain active on the same bus?
Powering down the F751824GJH while the bus remains active can lead to unintended loading or signal clamping through internal protection diodes. If the downstream side is unpowered, leakage current may backfeed into the active bus segment. To safely isolate, use the EN pin to disable the buffer before removing power, or ensure both sides of the buffer share a common power-down sequence.

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F751824GJH

TI

In Stock: 16004

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