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DAC8501E/250G4

Manufacturer Part Number:
DAC8501E/250G4
Manufacturer / Brand
Texas Instruments
Part of Description:
IC DAC 16BIT V-OUT 8VSSOP
Datasheets:
DAC8501E/250G4.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 3420 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number DAC8501E/250G4
Manufacturer / Brand Texas Instruments
Stock Quantity 3420 pcs Stock
Category Integrated Circuits (ICs) > Data Acquisition - Digital to Analog Converters (DAC)
Description IC DAC 16BIT V-OUT 8VSSOP
Lead Free Status / RoHS Status: ROHS3 Compliant
RFQ DAC8501E/250G4 Datasheets DAC8501E/250G4 Details PDF
DAC8501E/250G4 Details PDF for FR.pdf
DAC8501E/250G4 Details PDF for KR.pdf
DAC8501E/250G4 Details PDF for IT.pdf
DAC8501E/250G4 Details PDF for ES.pdf
DAC8501E/250G4 Details PDF for DE.pdf
Voltage - Supply, Digital 2.7V ~ 5.5V
Voltage - Supply, Analog 2.7V ~ 5.5V
Supplier Device Package 8-VSSOP
Settling Time 10µs
Series -
Reference Type External
Package / Case 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Package Tape & Reel (TR)
Output Type Voltage - Buffered
Operating Temperature -40°C ~ 105°C
Number of D/A Converters 1
Number of Bits 16
Mounting Type Surface Mount
INL/DNL (LSB) -, ±1 (Max)
Differential Output No
Data Interface SPI, DSP
Base Product Number DAC8501
Architecture String DAC

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
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DAC8501E/250G4 Product Details:

The DAC8501E/250G4 is a 16-bit digital-to-analog converter (DAC) manufactured by Luminary Micro/Texas Instruments. It belongs to the data acquisition category, specifically designed for digital-to-analog conversion applications.

The key features of this product include its high-resolution 16-bit conversion, SPI and DSP data interface, and external reference configuration. It is designed to operate within a wide temperature range of -40°C to 105°C, making it suitable for a variety of industrial and commercial applications.

The DAC8501E/250G4 addresses design challenges by providing a compact, surface-mount package (8-VSSOP) with a low power consumption profile. Its RoHS-compliant, lead-free construction ensures environmental compliance and compatibility with modern electronic systems.

The primary advantages of this DAC include its high accuracy, with a maximum integral non-linearity (INL) and differential non-linearity (DNL) of ±1 LSB. It features a fast settling time of 10μs, allowing for efficient signal processing and control applications.

The DAC8501E/250G4 is compatible with a wide range of systems and devices that require digital-to-analog conversion, such as industrial control systems, data acquisition equipment, and audio/video processing circuits. It can be used in a variety of application areas, including process control, instrumentation, and portable electronics.

Equivalent or alternative models available include the DAC8501E/250 and DAC8501E/250G, which share similar specifications and features, but may differ in packaging or other minor details. These models can be considered as alternatives to the DAC8501E/250G4 depending on the specific requirements of the application.

DAC8501E/250G4 Image
DAC8501E/250G4 (1)

DAC8501E/250G4 Key Technical Attributes

16 Bit Resolution, Voltage - Supply Digital/Analog 2.7 V ~ 5.5 V, Data Interface SPI/DSP

DAC8501E/250G4 Packing Size

Type: 8-VSSOP; Material: MSOP8; Size: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width); Pin Configuration: Surface Mount; Thermal Characteristics: Operating Temperature -40°C ~ 105°C; Electrical Properties: Voltage - Supply 2.7 V ~ 5.5 V

DAC8501E/250G4 Application

Used in precision data acquisition systems and automation that require high-speed digital-to-analog conversion

DAC8501E/250G4 Features

The DAC8501E/250G4 features a 16-bit digital to analog converter with an SPI and DSP compatible data interface. It supports a voltage supply range from 2.7V to 5.5V for both digital and analog circuits, enabling its usage in systems with varied power supplies. The architecture of the DAC8501E/250G4 is based on String DAC, which provides accurate and stable performance. This IC offers Output Type as Voltage - Buffered and uses an External type reference. It has an impressive settling time of 10 microseconds, making it apt for high-speed applications.

DAC8501E/250G4 Quality and Safety Features

Lead-free and RoHS Compliant, ensuring it meets global environmental standards and safety regulations. Moisture Sensitivity Level (MSL) 2 (1 Year), guaranteeing reliability in humid conditions.

DAC8501E/250G4 Compatibility

This digital to analog converter is compatible with systems requiring Voltage - Buffered output with an external reference and works with a digital supply and analog voltage of 2.7 V ~ 5.5 V.

DAC8501E/250G4 Datasheet PDF

For the most comprehensive and authoritative datasheet of DAC8501E/250G4, customers are encouraged to download it directly from our webpage ensuring they receive the most accurate product specifications and usage guidelines.

Quality Distributor

IC-Components stands as a top-tier distributor for Luminary Micro / Texas Instruments products. As a reliable partner, we suggest you get a quote directly from our website to ensure best pricing and availability for high-quality components such as DAC8501E/250G4.

Frequently Asked Questions

What are the key power supply design considerations when integrating the DAC8501E/250G4 into a mixed-signal system with both 3.3V and 5V logic domains?
The DAC8501E/250G4 supports a wide digital and analog supply range of 2.7 V to 5.5 V, enabling direct interface with both 3.3V and 5V microcontrollers without level shifting. However, ensure that the reference voltage (VREF) and analog output stage share the same ground plane and are decoupled with low-ESR capacitors (e.g., 100 nF ceramic + 10 µF tantalum) close to the pins to minimize noise coupling. Since the device uses an external reference, mismatched supply rails can introduce offset errors if ground potentials differ—use a star ground or solid ground plane to maintain signal integrity.
Can the DAC8501E/250G4 be used in industrial environments with ambient temperatures exceeding 85°C, and what derating or thermal management is required?
Yes, the DAC8501E/250G4 is rated for operation from –40°C to +105°C, making it suitable for industrial applications such as factory automation or motor control. However, at elevated temperatures (>85°C), ensure adequate PCB copper area under the MSOP8 package for heat dissipation and avoid placing heat-sensitive components nearby. Long-term reliability may be affected by thermal cycling; consider conformal coating and avoid prolonged exposure near the upper temperature limit without airflow or thermal relief.
What are the risks of replacing a 12-bit DAC with the DAC8501E/250G4 in an existing control loop, and how should the firmware be adjusted?
Migrating from a 12-bit to the 16-bit DAC8501E/250G4 significantly increases resolution (from 4,096 to 65,536 steps), which can expose previously masked nonlinearities or noise in the system. The control algorithm must be updated to handle finer output increments—failure to do so may cause limit cycling or instability. Additionally, verify that the SPI clock rate and timing meet the DAC8501E/250G4’s requirements (up to 30 MHz), and ensure the microcontroller’s SPI peripheral supports 16-bit frame transfers or implement software bit-banging with proper CS assertion timing.
Is the DAC8501E/250G4 suitable for high-precision voltage calibration applications requiring long-term stability, and what external components influence drift performance?
The DAC8501E/250G4 itself has good monotonicity (±1 LSB DNL max) but lacks internal temperature compensation, so long-term stability depends heavily on the external reference voltage source. For precision calibration, pair it with a low-drift reference (e.g., REF5025 with ±3 ppm/°C drift) and minimize thermal gradients across the PCB. Avoid using low-cost resistor-ladder references, as their temperature coefficients will dominate overall error over time. Also, ensure the load impedance is >10 kΩ to prevent output buffer loading effects.
How does the SPI interface timing of the DAC8501E/250G4 compare to common microcontroller peripherals, and what configuration pitfalls should be avoided?
The DAC8501E/250G4 uses a standard SPI-compatible interface with mode 1 or 3 (CPOL=0/1, CPHA=1) and requires 16 clock cycles per transfer. A critical pitfall is failing to meet the t_CSH (CS high time) specification—minimum 50 ns—which can cause incomplete data latching. Some MCUs automatically deassert CS too quickly; use GPIO-controlled CS or configure the SPI peripheral for extended inter-frame delay. Also, ensure the SDI line is stable during SCLK falling edges, as the device samples on the rising edge.
Can the DAC8501E/250G4 drive capacitive loads directly, and what output buffer limitations must be considered in actuator or filter applications?
The buffered voltage output of the DAC8501E/250G4 can drive capacitive loads up to 1000 pF, but exceeding this without series isolation resistance may cause oscillation due to phase margin degradation. For driving long cables or large filter capacitors, add a 10–100 Ω resistor in series with the output to dampen ringing. Note that the output slew rate is limited (~0.5 V/µs typical), so fast transient responses (e.g., in waveform generation) may require an external op-amp buffer for improved dynamics.
What alternatives exist if the DAC8501E/250G4 is unavailable, and how do pin-compatible substitutes like the DAC8560 or MAX5136 differ in real-world performance?
The DAC8560 (TI) and MAX5136 (Maxim) are potential drop-in replacements in 8-MSOP packages, but critical differences exist: the DAC8560 includes an internal reference (2.5 V), eliminating external REF circuitry but adding ~±2 LSB gain error, while the MAX5136 offers faster settling time (6 µs) but higher power consumption. Neither matches the DAC8501E/250G4’s ultra-low quiescent current (250 µA typ). Replacing requires re-evaluation of reference stability, power budget, and timing constraints—especially in battery-powered or high-channel-count systems.
How should the DAC8501E/250G4 be handled during PCB assembly given its moisture sensitivity level (MSL 2), and what storage precautions are necessary?
As an MSL 2 device, the DAC8501E/250G4 can be exposed to ambient conditions (<30°C/60% RH) for up to 1 year without baking. However, after opening the moisture barrier bag, it must be assembled within 168 hours (7 days). If exposure exceeds this, bake at 125°C for 24 hours per JEDEC J-STD-033. During reflow, adhere to the peak temperature of 260°C with a controlled ramp rate (<3°C/s) to prevent package delamination. Always store unused parts in dry cabinets or resealable bags with desiccant.
In multi-DAC systems, can multiple DAC8501E/250G4 devices share a single SPI bus, and what synchronization challenges arise during simultaneous updates?
Yes, multiple DAC8501E/250G4 devices can share an SPI bus using individual chip select (CS) lines. However, since each DAC updates its output only on the rising edge of CS after data transfer, true simultaneous update requires daisy-chaining or using a broadcast scheme with external latch logic. Without hardware synchronization, slight timing skew between CS assertions can cause glitches in coordinated outputs (e.g., in stereo audio or phased array systems). For precise alignment, consider adding a global LDAC pin (not available on this part) or use a microcontroller with parallel GPIO-triggered update routines.
What is the impact of using a noisy digital supply rail on the analog output of the DAC8501E/250G4, and how can power supply rejection be improved in cost-sensitive designs?
The DAC8501E/250G4 shares digital and analog supply pins, making it susceptible to digital switching noise coupling into the analog output. Even with good PSRR (typically 60 dB at 1 kHz), high-frequency spikes from MCU activity can manifest as output ripple. To mitigate this in budget-constrained designs, use a separate LDO for the DAC supply (e.g., TPS7A20), insert a π-filter (ferrite bead + capacitors) on the digital side, and route analog traces away from high-speed digital lines. Avoid sharing ground return paths between noisy digital loads and the DAC’s analog ground.

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