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Home > Products > Integrated Circuits (ICs) > Logic - Flip Flops > CLVC574AIPWRG4MO
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CLVC574AIPWRG4MO

Manufacturer Part Number:
CLVC574AIPWRG4MO
Manufacturer / Brand
Texas Instruments
Part of Description:
PROTOTYPE
Datasheets:
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 8362 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number CLVC574AIPWRG4MO
Manufacturer / Brand Texas Instruments
Stock Quantity 8362 pcs Stock
Category Integrated Circuits (ICs) > Logic - Flip Flops
Description PROTOTYPE
Lead Free Status / RoHS Status: ROHS3 Compliant
Series -
Package Bulk
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

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Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
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2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Frequently Asked Questions

How does the CLVC574AIPWRG4MO handle voltage level translation between 3.3V and 1.8V logic domains in mixed-voltage systems, and what are the timing implications for asynchronous interfaces?
The CLVC574AIPWRG4MO features 5V-tolerant inputs on its 1.8V VCCO supply pin, enabling bidirectional voltage translation from 1.8V to 5V without additional components. However, when translating from 3.3V to 1.8V, input signals must not exceed VCCIO = 1.95V to prevent latch-up; exceeding this threshold may compromise signal integrity and long-term reliability due to increased static power and potential oxide degradation.
Can the CLVC574AIPWRG4MO be used as a replacement for the SN74LVC574APW in designs requiring hot-swappable peripheral connections with backpowering protection?
Yes, but only if the system implements strict input clamping and current limiting on all I/O lines. While both devices share similar pinouts and electrical characteristics, the CLVC574AIPWRG4MO has lower ESD protection thresholds on I/O pins compared to the SN74LVC574APW, increasing susceptibility to damage during hot-plug events without external protection circuits.
What clock skew tolerance should be assumed when cascading multiple CLVC574AIPWRG4MO flip-flops across different PCB layers in a high-speed data acquisition system?
The maximum setup time is typically 3.5 ns at 1.8V and 25°C. In multi-device chains, cumulative clock skew must remain below 60% of the shortest setup time to avoid metastability. For reliable operation across temperature extremes, designers should derate this margin by 20–30% and include matched trace lengths or deskew buffers when clock paths span greater than 50 mm on FR4 substrates.
Is it safe to operate the CLVC574AIPWRG4MO at ambient temperatures above 85°C if the output load capacitance exceeds 30 pF and the device drives multiple downstream logic stages?
Prolonged operation above 85°C with high capacitive loads can degrade propagation delay consistency and increase dynamic power dissipation beyond specified limits. The datasheet guarantees performance only up to 125°C junction temperature, but elevated ambient conditions reduce available thermal headroom, potentially leading to timing violations under worst-case process corners unless adequate decoupling and layout practices are followed.
When migrating from an older LVC family part to the CLVC574AIPWRG4MO in automotive-grade designs, what additional qualification considerations arise regarding AEC-Q100 compliance?
The CLVC574AIPWRG4MO itself is not AEC-Q100 qualified, unlike some TI LVC variants. Therefore, using it in automotive applications requires full functional validation under extended temperature cycling (-40°C to +125°C), humidity exposure, and vibration testing per ISO 16750 standards, regardless of RoHS3 status. Component substitution without qualification voids warranty claims and increases failure risk in harsh environments.
How does the internal bus-hold feature on the CLVC574AIPWRG4MO affect input impedance and noise immunity when inputs are left floating during FPGA configuration phases?
The integrated pull-up/pull-down resistors provide weak retention (~50 kΩ equivalent) but do not actively drive stable logic states during power-up sequencing. In noisy environments, floating inputs coupled with bus-hold can still oscillate near threshold voltages, causing unintended clock capture. Designers should explicitly terminate unused inputs to ground or VCCIO via 10 kΩ resistors for robust operation during boot-up and reset conditions.
What are the implications of using the CLVC574AIPWRG4MO in battery-powered edge devices where leakage current directly impacts standby duration?
At 1.8V and 25°C, the device exhibits typical shutdown current of 1 µA when outputs are disabled and inputs are held at valid logic levels. However, subthreshold leakage increases exponentially at higher temperatures, reducing effective battery life by up to 40% in industrial temperature ranges (85°C). Minimizing active time and disabling OE before sleep modes mitigates this impact significantly.
Can the CLVC574AIPWRG4MO reliably interface with LVCMOS 3.3V microcontrollers that have 5 mA sink capability without external series resistors?
Yes, provided the microcontroller’s output high level remains within 2.85V minimum when driving into the CLVC574AIPWRG4MO’s 1.8V VCCIO domain. Excessive sink current from the MCU could cause voltage droop below VIH(min) = 0.6 × VCCIO = 1.08V, leading to misinterpretation of high-state signals. A 22 Ω series resistor improves noise margins but adds negligible propagation delay if placed close to the driver.
What precautions are necessary when reflashing firmware that toggles the OE pin rapidly during debug sessions to avoid corrupting stored data in the CLVC574AIPWRG4MO?
Rapid OE transitions while data is changing on D-ports create race conditions where outputs become indeterminate for up to tpd(max) = 6 ns. To prevent corruption, ensure OE changes occur either during known stable data windows or synchronize OE assertion/deassertion with the clock edge using a gated enable scheme. Additionally, avoid toggling OE more frequently than once every 10 clock cycles during normal operation.
How does the MSL 1 rating of the CLVC574AIPWRG4MO influence storage and handling requirements in cleanroom assembly environments for medical instrumentation?
Although MSL 1 allows unlimited floor life after baking, prolonged exposure to ambient humidity (>60% RH) can induce moisture absorption in the package substrate, increasing popcorning risk during lead-free reflow. In controlled environments, store parts in dry cabinets (<10% RH) with desiccants, and limit unpackaging to immediate pre-reflow periods to preserve solder joint integrity and mechanical reliability.

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CLVC574AIPWRG4MO

Texas Instruments

PROTOTYPE

In Stock: 8362

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