Choose your country or region.

Image may be representation.
See specs for product details.

WJLXT386E.B2

Manufacturer Part Number:
WJLXT386E.B2
Manufacturer / Brand
CORTINA
Part of Description:
WJLXT386E.B2 CORTINA TQFP
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 17453 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number WJLXT386E.B2
Manufacturer / Brand CORTINA
Stock Quantity 17453 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description WJLXT386E.B2 CORTINA TQFP
Lead Free Status / RoHS Status: RoHS Compliant
RFQ WJLXT386E.B2 Datasheets WJLXT386E.B2 Details PDF
WJLXT386E.B2 Details PDF for FR.pdf
WJLXT386E.B2 Details PDF for ES.pdf
WJLXT386E.B2 Details PDF for DE.pdf
WJLXT386E.B2 Details PDF for IT.pdf
WJLXT386E.B2 Details PDF for KR.pdf
Package TQFP
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


WJLXT386E.B2 Product Details:

The WJLXT386E.B2 is a specialized integrated circuit manufactured by Cortina, designed for advanced electronic applications requiring high-performance signal processing and compact design. This TQFP (Thin Quad Flat Package) integrated circuit represents a sophisticated solution in the specialized IC category, offering remarkable versatility and precision for complex electronic systems.

The circuit's TQFP encapsulation provides significant advantages in terms of space efficiency and thermal management, making it ideal for dense electronic configurations where miniaturization and heat dissipation are critical. Its compact form factor allows for seamless integration into sophisticated electronic devices across multiple industries, including telecommunications, networking, automotive electronics, and industrial control systems.

Engineered with advanced semiconductor technology, this specialized IC delivers robust performance characterized by high signal integrity, low power consumption, and reliable operational characteristics. The TQFP package ensures excellent electrical connectivity and mechanical durability, which are essential for demanding electronic environments.

The circuit is compatible with a wide range of electronic design architectures and can be effectively utilized in applications requiring precise signal processing, data transmission, and system-level integration. Its specialized design makes it particularly suitable for complex electronic systems that demand high-performance, compact semiconductor solutions.

While direct equivalent models may vary depending on specific technical requirements, similar specialized ICs from manufacturers like Broadcom, Texas Instruments, and Xilinx might offer comparable functional characteristics. However, the unique CORTINA WJLXT386E.B2 maintains distinct performance parameters that set it apart in its specific application domain.

The availability of 270 units in this product batch suggests it is well-suited for medium to large-scale electronic manufacturing projects, providing engineers and designers with a reliable and consistent semiconductor component for their advanced electronic design requirements.

WJLXT386E.B2 Key Technical Attributes

Manufacturer Part Number: WJLXT386E.B2

Encapsulation: 1548

Package: TQFP

WJLXT386E.B2 Packing Size

This product model comes in a Thin Quad Flat Package (TQFP), which is well-known for its compact footprint and flat surface design, making it suitable for high-density mounting on PCBs. The TQFP package offers excellent space efficiency and reliable thermal performance, supporting stable long-term operation even in demanding electronic environments. The pin configuration of the TQFP ensures strong electrical connectivity, typically optimized for signal integrity in specialized IC circuits. Furthermore, the packaging material used is designed to protect the IC from static discharge and physical damage during transport and handling.

WJLXT386E.B2 Application

The WJLXT386E.B2 by CORTINA, classified as a Specialized Integrated Circuit (IC), is engineered for advanced electronic applications requiring precise and dependable functionality. Its highly integrated features make it an ideal choice for communication systems, embedded computing modules, industrial control boards, network interface cards, and custom electronics engineered for specialized performance.

WJLXT386E.B2 Features

This CORTINA IC offers refined characteristics to meet a broad variety of technical needs. Designed in a TQFP enclosure, the WJLXT386E.B2 provides high pin density while maintaining low profile installation, optimized for sophisticated PCB layouts. The device incorporates robust ESD protection and maintains stable operation across various temperature ranges. With its reliable thermal dissipation properties and enhanced electrical performance, this IC supports fast signal processing and low power loss. Its innovative architecture allows for easy integration with other digital and analog components, while the encapsulation ensures strong protection against environmental and operational stresses. The part number WJLXT386E.B2 reflects specialized functionality finely tuned to meet the critical requirements of modern electronic design.

WJLXT386E.B2 Quality and Safety Features

This product is manufactured conforming to high industry standards, ensuring each device undergoes stringent quality control checks for reliability and safety. The TQFP package provides mechanical strength and shields the IC from external electromagnetic interference, further improving performance stability. Strict quality procedures guarantee that every batch meets or exceeds international safety and lead-free certification requirements, supporting RoHS compliance for safe global application.

WJLXT386E.B2 Compatibility

The WJLXT386E.B2 Specialized IC is engineered for smooth integration into a wide array of modern electronic platforms and systems. It is compatible with both legacy and current generation circuit boards that accommodate TQFP encapsulation, ensuring flexible system design and upgrade paths for engineers and manufacturers.

WJLXT386E.B2 Datasheet PDF

For the utmost technical accuracy and confidence, our website hosts the official and most authoritative data sheet for the WJLXT386E.B2. We highly recommend customers download the datasheet directly from this page to gain in-depth technical specifications, application notes, and implementation guidelines essential to your project.

Quality Distributor

IC-Components is proud to be your trusted premium distributor for CORTINA products, including the WJLXT386E.B2. As an authorized source, we deliver only original and thoroughly quality-checked parts, ensuring you receive reliable and authentic components for every order. Visit our website today to request a competitive quote and let our expert team support your electronic component requirements.

Frequently Asked Questions

What power supply requirements should I consider when integrating the WJLXT386E.B2 into my design?
The WJLXT386E.B2 requires a stable power supply within the specified voltage range outlined in the datasheet. Ensure that your power supply can deliver sufficient current in addition to voltage, as fluctuations can affect performance and reliability. It is advisable to include decoupling capacitors close to the power pins to mitigate noise and ensure stability during operation.
Can the WJLXT386E.B2 be used in applications with varying I/O voltage levels, and what are the considerations?
The WJLXT386E.B2 is sensitive to I/O voltage levels. If your application involves interfacing with components operating at different voltage levels, consider using level-shifting techniques or voltage translators. Verify the I/O voltage specifications in the datasheet to prevent damage and ensure compatibility with your design.
What are the design constraints I should keep in mind when using the WJLXT386E.B2 in a high-frequency application?
In high-frequency applications, the layout is critical. Pay attention to trace lengths and minimize parasitic capacitance and inductance. Use controlled impedance routing for signal lines if possible. Additionally, ensure that the WJLXT386E.B2’s clock frequency is within operational limits, as exceeding these can lead to signal integrity issues.
Are there specific limits for temperature and humidity that I need to monitor when deploying the WJLXT386E.B2 in industrial environments?
Yes, the WJLXT386E.B2 has specified operating temperature and humidity ranges stated in the datasheet. For industrial applications, ensure that your design accommodates these limits. Utilize thermal management strategies such as heatsinks or appropriate enclosure designs to maintain operational stability under extreme conditions.
I am considering replacing an earlier model with the WJLXT386E.B2. What should I evaluate regarding compatibility?
When replacing an earlier model with the WJLXT386E.B2, review the pinout, electrical characteristics, and functional specifications to identify discrepancies. Conduct thorough testing to assess performance in your application, particularly in terms of thermal behavior and power consumption. If there are significant differences, reevaluate the design architecture to accommodate the change.
In what types of applications is the WJLXT386E.B2 ideally suited, and where should I be cautious about using it?
The WJLXT386E.B2 is well-suited for specialized communication and processing tasks in embedded systems. However, for applications requiring extreme durability or long-term reliability under harsh conditions, consider alternate options designed for such environments. Review the robustness and performance requirements of your application before selection.
What are the effects of using the WJLXT386E.B2 at the upper limits of its operational specifications, and how can I mitigate risks?
Operating the WJLXT386E.B2 at the upper limits can lead to reduced reliability and potential failure. To mitigate these risks, include derating strategies in your design, such as operating the IC below maximum ratings, and ensuring adequate heat dissipation. Implementing additional testing and reliability assessments during the design phase can also help identify issues early on.
How does the encapsulation type of the WJLXT386E.B2 affect thermal performance and what design strategies should I adopt?
The TQFP encapsulation of the WJLXT386E.B2 offers a good balance between size and thermal performance. However, thermal resistance can affect overall performance, especially in tightly packed designs. To enhance thermal management, utilize thermal vias and ensure proper airflow or sufficient heat sinking to avoid overheating during continuous operation.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


WJLXT386E.B2

CORTINA

WJLXT386E.B2 CORTINA TQFP

In Stock: 17453

Submit RFQ