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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP0102BE3-T
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SP0102BE3-T

Manufacturer Part Number:
SP0102BE3-T
Manufacturer / Brand
KNOWLES
Part of Description:
SP0102BE3-T KNOWLES SMD
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 9913 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP0102BE3-T
Manufacturer / Brand KNOWLES
Stock Quantity 9913 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP0102BE3-T KNOWLES SMD
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP0102BE3-T Datasheets SP0102BE3-T Details PDF
SP0102BE3-T Details PDF for FR.pdf
SP0102BE3-T Details PDF for KR.pdf
SP0102BE3-T Details PDF for IT.pdf
SP0102BE3-T Details PDF for ES.pdf
SP0102BE3-T Details PDF for DE.pdf
Package SMD
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key integration constraints when designing with the SP0102BE3-T in a compact PCB layout?
The SP0102BE3-T, packaged in a QPN format, requires careful attention to pad geometry and thermal relief due to its small form factor and leadless design. Engineers must ensure proper solder stencil aperture ratios to avoid tombstoning during reflow. Additionally, the absence of leads increases sensitivity to board warpage, so a flat, high-Tg PCB substrate is recommended. The component’s proximity to high-speed digital traces should be minimized to prevent coupling noise, especially since the SP0102BE3-T is typically used in precision analog signal paths.
Can the SP0102BE3-T be used in high-humidity industrial environments without additional protection?
While the SP0102BE3-T is rated for standard operating conditions, prolonged exposure to high humidity—particularly above 85% RH—can lead to moisture ingress at the package interface due to the QPN’s exposed pad and minimal encapsulation. In such environments, conformal coating or hermetic sealing of the assembly is advised to maintain long-term reliability. Without mitigation, electrochemical migration may degrade performance over time.
What are the risks of replacing the SP0102BE3-T with a generic equivalent in a medical audio application?
Substituting the SP0102BE3-T with a non-KNOWLES equivalent introduces risks related to acoustic response consistency, long-term drift, and supply chain traceability. The SP0102BE3-T is engineered with tight tolerances on frequency response and sensitivity, critical in medical devices such as hearing aids or diagnostic equipment. A generic part may meet nominal specs but lack the same aging characteristics or ESD robustness, potentially leading to field failures or regulatory non-compliance.
How does the SP0102BE3-T perform under temperature cycling in automotive-grade applications?
The SP0102BE3-T is not explicitly qualified for AEC-Q100 standards, so its use in automotive environments requires derating and validation. Under repeated temperature cycling from -40°C to +85°C, the QPN package may experience microcracking at the solder joints due to CTE mismatch with standard FR4. For under-hood or exterior applications, mechanical reinforcement such as underfill or selection of a more robust package variant is recommended.
What input signal levels and biasing considerations are critical when interfacing the SP0102BE3-T with a low-voltage ADC?
The SP0102BE3-T outputs an analog signal proportional to acoustic input, but its DC bias point and output impedance must be matched to the ADC’s input range. Without proper DC blocking and impedance matching, signal clipping or loading can occur. A series capacitor (e.g., 1 µF) and a pull-down resistor network are typically required to center the signal within the ADC’s 0–1.8 V range. Failure to account for this can result in reduced dynamic range or nonlinear distortion.
Is the SP0102BE3-T suitable for always-on voice trigger applications in battery-powered devices?
The SP0102BE3-T itself is a passive acoustic transducer and does not include built-in amplification or wake-on-sound functionality. For always-on voice detection, it must be paired with a low-power audio codec or dedicated voice processor. While its low-profile QPN package supports compact designs, system-level power consumption will depend heavily on the downstream electronics. Engineers should evaluate total system current draw rather than the SP0102BE3-T in isolation.
What are the implications of migrating from the SP0102BE3-T to a surface-mount microphone with digital output?
Transitioning from the analog SP0102BE3-T to a digital-output microphone (e.g., PDM type) eliminates analog signal integrity concerns but introduces new constraints: increased firmware complexity, higher clocking requirements, and sensitivity to electromagnetic interference on the data line. Additionally, the digital microphone may consume more peak current during data transmission, impacting battery life. The migration is viable only if the host processor supports the digital interface and the system can tolerate the added latency and processing overhead.
How should the SP0102BE3-T be handled during automated assembly to prevent damage?
The SP0102BE3-T’s QPN package is susceptible to mechanical stress during pick-and-place operations. Nozzle selection must match the component’s top surface area to avoid vacuum-induced cracking. Additionally, placement speed should be reduced to minimize impact force. Post-reflow, avoid probing or mechanical contact near the acoustic port, as debris or pressure can permanently alter sensitivity. Use of a protective cover during assembly is recommended if the port remains exposed.
Can the SP0102BE3-T be used in high-vibration environments such as industrial machinery monitoring?
The SP0102BE3-T lacks explicit vibration testing data, and its internal diaphragm structure may exhibit microphonic resonance or fatigue under sustained mechanical vibration above 5 G RMS. In high-vibration settings, acoustic isolation mounts or selection of a ruggedized microphone variant with reinforced internal supports is preferable. Continuous vibration may also degrade solder joint integrity over time due to the QPN’s minimal anchor points.
What are the long-term reliability concerns when using the SP0102BE3-T in outdoor IoT sensor nodes?
Prolonged UV exposure, thermal cycling, and particulate contamination pose risks to the SP0102BE3-T in outdoor deployments. The plastic package material may degrade under UV light, leading to embrittlement, while dust or moisture can obstruct the acoustic port. Sealing the port with a hydrophobic membrane (e.g., PTFE) is essential to maintain performance. Additionally, long-term drift in sensitivity due to material aging should be characterized over the expected product lifecycle.

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