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Home > Products > Integrated Circuits (ICs) > Specialized ICs > F25L008A
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F25L008A

Manufacturer Part Number:
F25L008A
Manufacturer / Brand
ESMT
Part of Description:
F25L008A ESMT SOP8
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 12034 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number F25L008A
Manufacturer / Brand ESMT
Stock Quantity 12034 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description F25L008A ESMT SOP8
Lead Free Status / RoHS Status: RoHS Compliant
RFQ F25L008A Datasheets F25L008A Details PDF
F25L008A Details PDF for FR.pdf
F25L008A Details PDF for KR.pdf
F25L008A Details PDF for ES.pdf
F25L008A Details PDF for DE.pdf
F25L008A Details PDF for IT.pdf
Package SOP8
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the critical power supply and I/O voltage compatibility considerations when integrating the F25L008A into a 3.3V system with mixed-voltage peripherals?
The F25L008A operates at a supply voltage range of 2.7V to 3.6V and features 5V-tolerant inputs on its I/O pins, allowing direct interfacing with 5V logic outputs without level shifting. However, the outputs remain at 3.3V levels, so when driving 5V inputs, ensure the receiving device recognizes 3.3V as a valid high logic level. For systems with 1.8V or lower voltage domains, a bidirectional level translator is required to avoid signal integrity issues or damage.
Can the F25L008A be used in industrial temperature environments, and what are the long-term reliability implications for extended operation at elevated temperatures?
The F25L008A is rated for an operating temperature range of -40°C to +85°C, making it suitable for industrial applications. However, sustained operation near the upper limit accelerates data retention degradation and increases the risk of bit errors over time. For mission-critical systems requiring >10-year data retention, derating the operating temperature to below +70°C and implementing periodic refresh cycles is recommended.
What are the key differences between the F25L008A and the Winbond W25L080C when considering a drop-in replacement in an existing SOP-8 footprint design?
While both the F25L008A and W25L080C are 8Mb SPI Flash devices in SOP-8 packages, the F25L008A supports a maximum clock frequency of 75 MHz compared to 104 MHz on the W25L080C. Additionally, the F25L008A uses a slightly different status register layout and lacks the deep power-down mode available in the Winbond part. Firmware must be verified for timing compliance and command compatibility before substitution.
How does the F25L008A handle write protection and sector locking during firmware updates in field-deployed systems?
The F25L008A provides hardware and software write protection via the WP# pin and status register block protection bits (BP0–BP3). These can be used to lock specific 64KB sectors during firmware updates to prevent accidental overwrites. However, unlike some newer flash devices, it does not support individual 4KB sector protection, which may require firmware-level segmentation strategies for fine-grained update control.
What clocking and SPI mode configurations are required to ensure reliable communication with the F25L008A in high-noise industrial environments?
The F25L008A supports SPI modes 0 and 3 (CPOL=0/CPHA=0 and CPOL=1/CPHA=1). For noisy environments, use mode 0 with a grounded chip select (CS#) line between transactions and minimize clock rise/fall times. Keep SCK frequency below 50 MHz if trace lengths exceed 10 cm or if unshielded cabling is used. Implementing a pull-up resistor on the HOLD# pin prevents unintended hold states during EMI events.
Is the F25L008A suitable for storing boot code in a microcontroller-based system with frequent power cycling, and what endurance limitations should be considered?
Yes, the F25L008A is suitable for boot code storage with a typical endurance of 100,000 program/erase cycles per sector. However, frequent power cycling during write operations increases the risk of incomplete writes. To mitigate this, use a brown-out detection circuit and ensure all writes are atomic or protected by a transaction log. Avoid storing frequently updated configuration data in the same sectors as boot code.
What are the migration challenges when replacing an older parallel Flash device with the F25L008A in a legacy design?
Migrating from parallel to SPI Flash like the F25L008A requires significant firmware and PCB changes, including SPI controller integration, reduced pin count routing, and potential bootloader modifications. The F25L008A’s sequential read performance may also be slower than parallel devices for random access patterns. Evaluate whether the system’s MCU supports XIP (execute-in-place) over SPI or if code shadowing to RAM is necessary.
How does the F25L008A perform in terms of data retention under high-temperature storage conditions, and what derating guidelines apply for automotive applications?
The F25L008A guarantees 20-year data retention at 25°C, but this decreases exponentially with temperature. At 85°C, retention may drop below 10 years. For automotive under-hood applications, consider periodic background verification or use of ECC if storing calibration or safety-critical data. The device is not AEC-Q100 qualified, so additional qualification testing is advised for automotive use.
Can the F25L008A be used in a multi-device SPI daisy-chain configuration, and what are the timing implications?
The F25L008A does not support true daisy-chaining via a shared data out (DO) line like some SPI Flash devices. Each device requires a separate CS# signal. In multi-device systems, ensure CS# lines are properly decoded and that only one device drives the MISO line at a time. Propagation delays from multiple devices on the same bus may require reduced SCK frequency or insertion of small delays between transactions.

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