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1812Y6300120GCR

In Stock 64185 pcs Reference Price(In US Dollars)
1+
$0.8414
200+
$0.3255
500+
$0.3139
1000+
$0.3095
Manufacturer Part Number:
1812Y6300120GCR
Manufacturer / Brand
Knowles Syfer
Part of Description:
CAP CER 12PF 630V C0G/NP0 1812
Datasheets:
1812Y6300120GCR(1).pdf1812Y6300120GCR(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 64185 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 1812Y6300120GCR
Manufacturer / Brand Knowles Syfer
Stock Quantity 64185 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER 12PF 630V C0G/NP0 1812
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Rated 630V
Tolerance ±2%
Thickness (Max) 0.098' (2.50mm)
Temperature Coefficient C0G, NP0
Size / Dimension 0.177' L x 0.126' W (4.50mm x 3.20mm)
Series FlexiCap™
Ratings -
Package / Case 1812 (4532 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features Soft Termination
Failure Rate -
Capacitance 12 pF
Base Product Number 1812Y
Applications Boardflex Sensitive

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: PayPal@IC-Components.com

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the Knowles FlexiCap technology in the 1812Y6300120GCR mitigate the risk of MLCC cracking in high-vibration industrial environments?
The 1812Y6300120GCR utilizes a proprietary flexible termination material (FlexiCap) consisting of a silver-loaded epoxy polymer layer applied between the ceramic body and the outer solder plating. In high-vibration or mechanical stress scenarios, this layer absorbs the strain caused by PCB deflection, preventing the mechanical stress from transferring directly to the brittle ceramic dielectric. This significantly reduces the likelihood of "flex cracking," a common failure mode in larger 1812 surface-mount components during board singulation or thermal cycling.
When designing for 630V DC rails, what PCB layout precautions are necessary to prevent surface arcing across the 1812Y6300120GCR package?
While the 1812Y6300120GCR is rated for 630V, the physical distance between the pads on an 1812 footprint (4.5mm length) requires careful consideration of creepage and clearance. In environments with high humidity or pollution, designers should implement a solder mask expansion limit or consider a physical slot/cut-out between the pads under the 1812Y6300120GCR to increase the tracking distance. For applications exceeding 500V, applying a conformal coating over the 1812Y6300120GCR is often necessary to prevent ionization and subsequent arcing across the component surface.
Can a standard high-voltage 1812 12pF C0G capacitor from another manufacturer be used as a drop-in replacement for the 1812Y6300120GCR in a high-flex application?
Replacing the 1812Y6300120GCR with a standard "hard termination" 1812 MLCC introduces significant reliability risks if the application involves board bending or heavy thermal shock. The 1812Y6300120GCR is specifically engineered for "Boardflex Sensitive" applications; a standard equivalent without soft termination may develop micro-cracks under identical mechanical loads. If an alternative part is used, it must specifically feature a flexible or "soft" termination technology to match the mechanical compliance of the 1812Y6300120GCR.
What are the parasitic inductance implications when using the 1812Y6300120GCR in a high-frequency snubber or RF matching circuit?
Due to the relatively large 1812 (4532 Metric) physical size, the 1812Y6300120GCR possesses higher Equivalent Series Inductance (ESL) compared to smaller 0603 or 0805 packages. For RF matching or high-speed snubber circuits, this parasitic inductance will lower the Self-Resonant Frequency (SRF) of the 12pF capacitance. Engineers must model the 1812Y6300120GCR as a complex impedance in simulations, as the inductive component may dominate at frequencies in the high MHz or GHz range, potentially shifting the intended resonance of the circuit.
Does the 1812Y6300120GCR exhibit any capacitance drift or piezoelectric noise when operating at its maximum 630V rated voltage?
The 1812Y6300120GCR uses a C0G (NP0) dielectric, which is a Class I ceramic material. Unlike Class II dielectrics like X7R, the 1812Y6300120GCR exhibits zero voltage coefficient of capacitance (VCC), meaning the 12pF value remains stable even when the full 630V bias is applied. Furthermore, C0G materials do not exhibit piezoelectric "singing" or acoustic noise, making the 1812Y6300120GCR suitable for precision analog signal paths and sensitive timing circuits where microphonic effects must be avoided.
How should the reflow soldering profile be adjusted for the 1812Y6300120GCR to prevent thermal shock in large-format multi-layer PCB assemblies?
Because of the 2.50mm thickness and the thermal mass of the 1812Y6300120GCR, the component is sensitive to rapid temperature gradients. It is recommended to use a controlled pre-heat phase (typically 1.5°C to 3°C per second) to ensure the ceramic body of the 1812Y6300120GCR reaches thermal equilibrium before hitting the reflow peak. Additionally, the cooling rate should be limited to 2°C per second to prevent internal delamination or cracking of the FlexiCap termination due to differential contraction between the ceramic and the PCB.
What is the recommended voltage derating for the 1812Y6300120GCR in industrial power supply designs requiring a 15-year operational lifespan?
Although the 1812Y6300120GCR is rated for 630V, long-term reliability in industrial environments is enhanced by operating at a lower stress level. For a 15-year design life, a common engineering practice is to derate the operating voltage to 50%–80% of the maximum rating. Running the 1812Y6300120GCR at or below 500V DC reduces the rate of insulation resistance degradation and protects against transient overvoltage spikes that might otherwise exceed the dielectric breakdown strength of the 12pF ceramic structure.

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