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0505Y2501P50CQT

In Stock 140731 pcs Reference Price(In US Dollars)
1+
$0.3949
200+
$0.1529
500+
$0.1474
1000+
$0.1448
Manufacturer Part Number:
0505Y2501P50CQT
Manufacturer / Brand
Knowles Syfer
Part of Description:
CAP CER 1.5PF 250V C0G/NP0 0505
Datasheets:
0505Y2501P50CQT(1).pdf0505Y2501P50CQT(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 140731 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 0505Y2501P50CQT
Manufacturer / Brand Knowles Syfer
Stock Quantity 140731 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER 1.5PF 250V C0G/NP0 0505
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Rated 250V
Tolerance ±0.25pF
Thickness (Max) 0.050' (1.27mm)
Temperature Coefficient C0G, NP0 (1B)
Size / Dimension 0.055' L x 0.055' W (1.40mm x 1.40mm)
Series FlexiCap™
Ratings -
Package / Case 0505 (1313 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 125°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features High Q, Low Loss, Soft Termination
Failure Rate -
Capacitance 1.5 pF
Base Product Number 0505Y
Applications RF, Microwave, High Frequency, Boardflex Sensitive

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

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Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the square 0505 footprint of the 0505Y2501P50CQT impact RF signal integrity compared to standard EIA 0402 or 0603 rectangular components?
The 0505Y2501P50CQT utilizes a square 0505 form factor which provides a wider width-to-length ratio than traditional 0603 parts, effectively reducing the equivalent series inductance (ESL). In high-frequency designs, the geometry of the 0505Y2501P50CQT allows for a higher self-resonant frequency (SRF) by shortening the current path across the dielectric, which minimizes inductive parasitics that typically cause unwanted phase shifts in RF matching networks.
When substituting the 0505Y2501P50CQT for an ATC 600S series ultra-low ESR capacitor, what specific impedance shifts should be considered?
While the 0505Y2501P50CQT shares similar High-Q characteristics with the ATC 600S series, engineers must verify the Effective Series Resistance (ESR) at their specific operating frequency. The 0505Y2501P50CQT is designed for low-loss performance in the GHz range, but slight variations in the dielectric constant between manufacturers may require minor adjustments to the microstrip line width or pad geometry to maintain exact 50-ohm impedance matching.
Can the 250V rating of the 0505Y2501P50CQT safely handle peak-to-peak voltage swings in high-power RF amplifiers operating under high VSWR conditions?
The 0505Y2501P50CQT is rated for 250V DC, which provides a robust safety margin for many RF applications; however, in high VSWR scenarios, the peak voltage at antinodes can exceed nominal values. Because the 0505Y2501P50CQT is an MLCC, designers must account for voltage derating and the potential for dielectric heating, ensuring the combined DC bias and RF peak voltage does not approach the dielectric breakdown limit of the 1.5pF structure.
How does the "Y" termination code in the 0505Y2501P50CQT part number improve reliability in industrial equipment subject to thermal cycling?
The "Y" designation in 0505Y2501P50CQT refers to Knowles' FlexiCap termination, a proprietary flexible epoxy polymer undercoat applied beneath the outer tin plating. This feature allows the 0505Y2501P50CQT to absorb more mechanical strain and board flexure than standard rigid terminations, significantly reducing the risk of ceramic cracking due to CTE (Coefficient of Thermal Expansion) mismatches during extreme temperature fluctuations.
What are the design implications of using the 0505Y2501P50CQT in a low-noise amplifier (LNA) input stage regarding thermal noise contributions?
In LNA applications, the ultra-high Q factor of the 0505Y2501P50CQT results in an extremely low ESR, which directly minimizes the thermal noise generated by the capacitor itself. By selecting the 0505Y2501P50CQT for input matching, engineers can maintain a lower overall system noise figure, as the resistive losses contributing to $kTB$ noise are kept to a minimum compared to general-purpose MLCCs.
For high-density PCB layouts, does the 0505Y2501P50CQT require specific solder stencil apertures to prevent tombstoning or bridge defects?
Due to its square 0505 geometry, the 0505Y2501P50CQT has a larger wetting surface area relative to its mass compared to 0402 components. To ensure stable placement of the 0505Y2501P50CQT, a 1:1 pad-to-aperture ratio is generally recommended, but rounding the inner corners of the stencil apertures can help optimize solder paste release and prevent the component from shifting during the reflow profile's liquidus phase.
Is the 1.5pF capacitance of the 0505Y2501P50CQT stable enough for use in precision frequency-determining circuits across the full industrial temperature range?
The 0505Y2501P50CQT is typically manufactured with a C0G/NP0 or similar high-stability dielectric, which offers a near-zero temperature coefficient of capacitance (TCC). This means the 1.5pF value of the 0505Y2501P50CQT will remain highly consistent, usually within ±30ppm/°C, making it an appropriate choice for resonant filters and oscillators where frequency drift must be minimized across varying environmental conditions.
When comparing the 0505Y2501P50CQT to a Murata GQM series equivalent, what are the primary trade-offs regarding ripple current handling?
The 0505Y2501P50CQT is engineered for high-power RF applications where ripple current leads to self-heating. While the Murata GQM series is also a high-Q contender, the 0505Y2501P50CQT often provides a different thermal resistance profile due to its 0505 case size and termination structure; engineers should evaluate the power dissipation limit (measured in mW) of the 0505Y2501P50CQT to ensure it remains within the maximum allowable temperature rise for the specific PCB substrate used.

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