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C325C331G3G5TA7301

In Stock 262493 pcs Reference Price(In US Dollars)
1+
$0.2333
200+
$0.0903
500+
$0.0871
1000+
$0.0856
Manufacturer Part Number:
C325C331G3G5TA7301
Manufacturer / Brand
KEMET
Part of Description:
CAP CER 330PF 25V C0G/NP0 RADIAL
Datasheets:
C325C331G3G5TA7301.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 262493 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number C325C331G3G5TA7301
Manufacturer / Brand KEMET
Stock Quantity 262493 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER 330PF 25V C0G/NP0 RADIAL
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Rated 25V
Tolerance ±2%
Thickness (Max) -
Temperature Coefficient C0G, NP0
Size / Dimension 0.200" L x 0.125" W (5.08mm x 3.18mm)
Series GoldMax 300 Comm C0G
Ratings -
Package / Case Radial
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 125°C
Mounting Type Through Hole
Lead Style Formed Leads - Kinked
Lead Spacing 0.200" (5.08mm)
Height - Seated (Max) 0.300" (7.62mm)
Features Low ESL
Failure Rate -
Capacitance 330 pF
Base Product Number C325C
Applications General Purpose

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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Company Name : IC COMPONENTS LTD
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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
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Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key integration constraints when designing a PCB layout for the KEMET C325C331G3G5TA7301: radial capacitor with 5.08mm lead spacing and kinked leads?
The C325C331G3G5TA7301: features formed kinked leads with 0.200" (5.08mm) spacing in a radial package measuring 0.200" L x 0.125" W (5.08mm x 3.18mm) and maximum seated height of 0.300" (7.62mm). Designers must ensure hole diameters accommodate the lead diameter while allowing for the kink to secure the part during wave soldering. Pad placement should account for the body width to prevent interference with adjacent components, and the through-hole mounting requires sufficient clearance on both sides of the board for reliable mechanical retention in vibration-prone assemblies.
How does the low ESL characteristic of the C325C331G3G5TA7301: influence its suitability for high-frequency decoupling or RF tuning circuits?
The C325C331G3G5TA7301: in the GoldMax 300 Comm C0G series provides low equivalent series inductance, which supports its use in applications requiring minimal parasitic effects at higher frequencies. In practice, this behavior allows the 330pF capacitance to remain effective in resonant circuits or timing networks where lead inductance in through-hole parts could otherwise shift resonance points. Engineers should still evaluate total loop inductance in the specific layout, as board traces and vias contribute additional inductance.
When migrating from surface-mount C0G capacitors to the through-hole KEMET C325C331G3G5TA7301, what design adjustments are typically needed?
Transitioning to the C325C331G3G5TA7301: requires accommodating radial through-hole mounting instead of SMT pads, including 5.08mm lead spacing and kinked leads for board retention. The ±2% tolerance and C0G/NP0 temperature coefficient remain consistent with Class I SMT equivalents, delivering stable 330pF performance from -55°C to 125°C with no voltage coefficient. Layout changes must include drilled holes and wave soldering process compatibility, while the radial form factor can offer mechanical robustness in environments where SMT parts risk flex-induced cracking.
Is the KEMET C325C331G3G5TA7301: appropriate for precision timing or oscillator circuits in industrial control systems operating across wide temperature ranges?
The C325C331G3G5TA7301: uses C0G/NP0 dielectric, resulting in capacitance variation limited to approximately ±30ppm/°C over -55°C to 125°C and negligible change with applied DC voltage up to the 25V rating. This stability supports consistent RC time constants or resonant frequencies in timing applications. At 330pF ±2%, it fits scenarios where small, predictable capacitance values are needed without the drift or aging effects seen in Class II dielectrics.
What considerations arise when evaluating the C325C331G3G5TA7301: as a replacement for older radial ceramic capacitors with similar 330pF C0G values from other manufacturers?
The C325C331G3G5TA7301: matches common 330pF ±2% 25V C0G radial footprints with 5.08mm lead spacing and kinked leads, facilitating drop-in mechanical compatibility in many legacy designs. Performance aligns with standard C0G behavior, including low dissipation factor and high Q, but designers should verify soldering process compatibility with the conformally coated construction and confirm that the 25V rating provides adequate derating margin compared to higher-voltage legacy parts.
In long-term industrial applications with thermal cycling, how does the C0G dielectric in the KEMET C325C331G3G5TA7301: behave regarding capacitance drift?
The C325C331G3G5TA7301: exhibits negligible capacitance drift or hysteresis with temperature cycling due to its C0G/NP0 dielectric, maintaining values close to the initial 330pF ±2% across the full -55°C to 125°C range. Unlike Class II ceramics, there is no significant aging effect over time, which reduces the need for periodic recalibration in systems exposed to repeated thermal excursions.
What power supply or voltage-related factors should engineers account for when selecting the 25V rated KEMET C325C331G3G5TA7301: for filtering or coupling roles?
The C325C331G3G5TA7301: maintains its 330pF capacitance with effectively zero voltage coefficient up to the rated 25V, allowing predictable performance in low-voltage analog or digital circuits. For reliability in sustained operation, applied voltage is typically kept well below rating to minimize any minor field-induced effects, while the low ESR and ESL characteristics support efficient filtering without introducing phase shifts or losses that vary with bias.
Are there application boundaries where the radial leaded KEMET C325C331G3G5TA7301: may require additional evaluation compared to film or mica alternatives in high-reliability designs?
The C325C331G3G5TA7301: offers compact size and stable C0G performance in a through-hole package, but in scenarios demanding extremely high Q or specific dielectric absorption levels, engineers compare its behavior directly to film or mica types through circuit simulation and prototyping. Its construction supports general-purpose and precision use up to 125°C, with the kinked leads aiding vibration resistance, though board-level mechanical stress testing confirms suitability for the target environment.
How does the lead configuration of the KEMET C325C331G3G5TA7301: affect automated insertion and soldering processes in high-volume manufacturing?
The formed kinked leads on the C325C331G3G5TA7301: are designed to provide mechanical stability during insertion into 5.08mm spaced holes and wave soldering, reducing the likelihood of part movement before solder joint formation. Production setups should calibrate insertion equipment to the 0.200" x 0.125" body dimensions and 0.300" max height to avoid lead forming issues or excessive stress on the ceramic element.
For replacement or second-sourcing the C325C331G3G5TA7301: in existing designs, what practical differences in tolerance and stability should be verified against alternative C0G radial parts?
The C325C331G3G5TA7301: provides ±2% tolerance on 330pF with C0G/NP0 characteristics, delivering consistent temperature and voltage stability that matches most commercial-grade radial C0G alternatives. Differences may appear in exact lead forming or coating thickness, so validation focuses on verifying lead spacing, overall dimensions, and electrical parameters under operating conditions to ensure no shift in circuit performance.

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