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C1210X561J5HAC7800

In Stock 990596 pcs Reference Price(In US Dollars)
1+
$0.0634
200+
$0.0245
500+
$0.0237
1000+
$0.0233
Manufacturer Part Number:
C1210X561J5HAC7800
Manufacturer / Brand
KEMET
Part of Description:
CAP CER 1210 560PF 50V ULTRA STA
Datasheets:
C1210X561J5HAC7800(1).pdfC1210X561J5HAC7800(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 990596 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number C1210X561J5HAC7800
Manufacturer / Brand KEMET
Stock Quantity 990596 pcs Stock
Category Capacitors > Ceramic Capacitors
Description CAP CER 1210 560PF 50V ULTRA STA
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Rated 50V
Tolerance ±5%
Thickness (Max) 0.039" (0.98mm)
Temperature Coefficient X8R
Size / Dimension 0.130" L x 0.102" W (3.30mm x 2.60mm)
Series SMD Comm X8R HT150C Flex
Ratings -
Package / Case 1210 (3225 Metric)
Package Tape & Reel (TR)
Operating Temperature -55°C ~ 150°C
Mounting Type Surface Mount, MLCC
Lead Style -
Lead Spacing -
Height - Seated (Max) -
Features Low ESL, Soft Termination, High Temperature
Failure Rate -
Capacitance 560 pF
Base Product Number C1210X
Applications Boardflex Sensitive

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the key integration constraints when using the KEMET C1210X561J5HAC7800 in a 1210 package for high-density PCB layouts with nearby components?
The KEMET C1210X561J5HAC7800 measures 3.30 mm x 2.60 mm with a maximum thickness of 0.98 mm in the 1210 (3225 Metric) case. Designers should maintain adequate clearance around the part to accommodate the soft termination layer and account for solder fillet formation during reflow, as the low ESL construction benefits high-frequency decoupling when placed close to power pins but requires attention to thermal expansion mismatch on multilayer boards.
How does the X8R temperature coefficient of the KEMET C1210X561J5HAC7800 affect capacitance stability in applications operating continuously near 150°C?
The KEMET C1210X561J5HAC7800 with X8R dielectric maintains capacitance variation within ±15% across its full operating range of -55°C to 150°C. In long-term exposure near the upper limit, engineers observe gradual capacitance behavior consistent with Class II dielectrics, making it suitable for circuits where moderate variation can be tolerated through design margins rather than requiring C0G-level stability.
When migrating from standard X7R MLCCs to the KEMET C1210X561J5HAC7800 in an existing high-temperature design, what circuit adjustments may be needed?
Replacing an X7R part with the KEMET C1210X561J5HAC7800 extends the guaranteed temperature range to 150°C while retaining similar ±15% capacitance limits up to that point. The soft termination and low ESL features introduce minor differences in mechanical robustness and high-frequency response; designers typically verify loop inductance and board-level strain in the new layout to ensure equivalent filtering or bypassing performance.
Is the KEMET C1210X561J5HAC7800 appropriate for boardflex-sensitive applications in industrial equipment subject to vibration or mechanical stress during operation?
The KEMET C1210X561J5HAC7800 belongs to the SMD Comm X8R HT150C Flex series and incorporates soft termination, which absorbs mechanical stress from PCB bending or vibration. This construction reduces the transfer of strain to the ceramic body compared to standard rigid terminations, supporting use in environments where repeated flexure occurs without requiring additional underfill in many cases.
What power supply decoupling considerations arise when selecting the 560 pF KEMET C1210X561J5HAC7800 for noise suppression in switching regulator circuits?
With its low ESL characteristic, the KEMET C1210X561J5HAC7800 provides effective high-frequency noise attenuation when paired with larger bulk capacitors. At 50 V rating and 560 pF capacitance, placement near the IC pins minimizes parasitic inductance in the current loop; engineers often combine it with higher-value parts to cover both mid- and high-frequency ranges while monitoring voltage coefficient effects under DC bias.
For long-term reliability in an industrial control system running at elevated ambient temperatures, what operating condition factors should be evaluated with the KEMET C1210X561J5HAC7800?
The KEMET C1210X561J5HAC7800 is rated for continuous operation from -55°C to 150°C with X8R stability. In sustained high-temperature industrial use, thermal cycling and DC bias influence long-term capacitance behavior similarly to other Class II MLCCs; qualification testing under application-specific profiles helps confirm insulation resistance and dissipation factor margins over the product lifecycle.
What are the practical differences when considering the KEMET C1210X561J5HAC7800 as a replacement for non-flex termination 1210 X8R capacitors from other manufacturers?
The soft termination in the KEMET C1210X561J5HAC7800 enhances resistance to flexure-induced cracking compared to standard termination equivalents, while maintaining the same 560 pF ±5%, 50 V, and X8R ratings. This can reduce field failure rates in mechanically stressed assemblies, though solder process parameters may need minor optimization to accommodate the conductive polymer layer without affecting assembly yield.
In high-reliability designs requiring operation across wide temperature swings, how does the soft termination of the KEMET C1210X561J5HAC7800 influence thermal shock performance during assembly and field use?
Soft termination on the KEMET C1210X561J5HAC7800 improves tolerance to thermal shock by allowing greater compliance between the ceramic body and the board during temperature excursions. This behavior supports higher survival rates in reflow soldering and subsequent operational cycling up to 150°C, particularly in applications with rapid temperature changes or mismatched CTE materials.
When evaluating the KEMET C1210X561J5HAC7800 for replacement in legacy designs using standard 1210 MLCCs rated only to 125°C, what design boundary considerations apply?
The KEMET C1210X561J5HAC7800 extends the upper temperature limit to 150°C under X8R classification while delivering low ESL and flex robustness. Engineers assess whether the existing voltage derating, capacitance budget, and board strain levels remain compatible, as the flex termination may allow relaxed mechanical constraints without changing the electrical footprint.
What configuration or mounting factors should PCB designers address to maximize the low ESL benefit of the KEMET C1210X561J5HAC7800 in RF or high-speed digital circuits?
The low ESL design of the KEMET C1210X561J5HAC7800 performs best with short, wide traces connecting to power/ground planes and vias placed close to the terminations. In 1210 package layouts, symmetric mounting and avoidance of excessive solder volume help preserve the inherent inductance reduction, supporting improved decoupling effectiveness at higher frequencies within the 50 V limit.

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