Choose your country or region.

Image may be representation.
See specs for product details.

WB3M200VD2T

In Stock 5100 pcs Reference Price(In US Dollars)
1+
$7.6255
Manufacturer Part Number:
WB3M200VD2T
Manufacturer / Brand
JAE Electronics
Part of Description:
CONN PLUG 200POS SMD GOLD
Datasheets:
WB3M200VD2T(1).pdfWB3M200VD2T(2).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5100 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number WB3M200VD2T
Manufacturer / Brand JAE Electronics
Stock Quantity 5100 pcs Stock
Category Connectors, Interconnects > Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
Description CONN PLUG 200POS SMD GOLD
Lead Free Status / RoHS Status: RoHS Compliant
Series WB3
Pitch 0.020" (0.50mm)
Package Tray
Number of Rows 2
Number of Positions 200
Mounting Type Surface Mount
Mated Stacking Heights 4mm
Height Above Board 0.146" (3.70mm)
Features Board Guide, Solder Retention
Contact Finish Thickness 30.0µin (0.76µm)
Contact Finish Gold
Connector Type Plug, Outer Shroud Contacts
Base Product Number WB3M200

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


WB3M200VD2T Product Details:

The JAE Electronics WB3M200VD2T is a high-density, surface-mount D-Sub connector designed for sophisticated electronic interconnect applications. This precision-engineered plug connector features an impressive 200-position configuration spread across two rows, with a compact 0.020" (0.50mm) pitch, making it ideal for space-constrained electronic design environments.

Engineered with advanced connectivity requirements in mind, the connector offers robust design features including integrated board guides and superior solder retention capabilities. The gold-plated contacts, with a substantial 30.0in (0.76m) contact finish thickness, ensure exceptional electrical performance and long-term reliability in demanding signal transmission scenarios.

The surface-mount mounting type allows for streamlined PCB integration, with a modest 0.146" (3.70mm) height above the board and a 4mm mated stacking height. These dimensional characteristics make the connector particularly suitable for high-density electronic packaging where space optimization is critical.

Primary advantages include its high-density contact arrangement, reliable gold contact finish, and mechanical design features that facilitate precise mounting and consistent electrical connections. The connector is particularly well-suited for telecommunications, computing, industrial control systems, and advanced signal transmission applications requiring compact, high-performance interconnect solutions.

While specific equivalent models are not directly mentioned in the specification, similar high-density D-Sub connectors from manufacturers like Amphenol, TE Connectivity, and Molex might offer comparable specifications. Potential alternative models would likely share similar pitch, contact count, and surface-mount characteristics.

The connector is packaged in a tray format, facilitating convenient handling and integration into manufacturing processes, and represents a sophisticated solution for engineers seeking reliable, high-performance interconnect technology.

WB3M200VD2T Key Technical Attributes

Manufacturer Part Number WB3M200VD2T

Number of Positions 200

Pitch 0.020 inch (0.50 mm)

WB3M200VD2T Packing Size

Type Plug Connector

Material Gold Contact Finish with 30.0 in (0.76 µm) Thickness

Size 200 Positions, 2 Rows

Pin Configuration D-Shaped Connector with Outer Shroud Contacts

Thermal Characteristics Surface Mount Device, Height Above Board 0.146 inch (3.70 mm)

Electrical Properties Designed for Reliable Solder Retention and Board Guide Stability

WB3M200VD2T Application

This connector model is primarily used in high-density interconnect applications requiring secure and stable board-to-board connections. It is suitable for telecommunications, data communication, industrial instrumentation, and other electronic systems where precise signal integrity and space-saving surface mount solutions are critical.

WB3M200VD2T Features

The WB3M200VD2T features a durable gold contact finish that enhances conductivity and resists corrosion, ensuring long-term reliability in demanding environments. Its board guide and solder retention design provide robust mechanical stability during assembly and operation, minimizing the risk of connection failures caused by vibration or mechanical shock. The high position count of 200 and fine pitch of 0.50 mm allow for compact and high-density configurations ideal for advanced electronic equipment. The plug connector type with outer shroud contacts aids in secure mating and alignment, reducing wear and damage to the contacts. Surface mount assembly facilitates automated manufacturing processes and lower profile designs. Tray packaging ensures component protection and efficient handling during production.

WB3M200VD2T Quality and Safety Features

This product complies with stringent industry standards, including RoHS directives ensuring environmental safety. The gold plating thickness exceeds standard requirements at 0.76 microns, enhancing corrosion resistance and contact reliability. JAE Electronics maintains rigorous quality management systems including ISO certifications, guaranteeing consistency and performance. The robust design incorporates anti-solder wicking features to prevent connectivity issues and enhance thermal stability during soldering processes, safeguarding the integrity of electrical connections.

WB3M200VD2T Compatibility

The WB3M200VD2T is compatible within the WB3 series connectors from JAE Electronics, designed specifically for matching header counterparts and accessories within the same product line. Its dimensions and pitch conform to industry standards for D-Sub high-density connectors, ensuring ease of integration into existing systems and compatibility with related components in telecommunications, computing, and embedded control platforms.

WB3M200VD2T Datasheet PDF

For the most authoritative and comprehensive technical information about the WB3M200VD2T connector, please download the datasheet available on our website. This datasheet contains detailed mechanical drawings, electrical specifications, thermal ratings, recommended soldering profiles, and compliance certifications. Accessing the datasheet on the current page guarantees up-to-date and official manufacturer data to support your design and procurement decisions.

Quality Distributor

IC-Components is a premium authorized distributor for JAE Electronics products. We offer competitive quotes, reliable supply chains, and dedicated customer support. By choosing IC-Components, you ensure authentic parts with full traceability and after-sales service. Visit our website to request a personalized quote for the WB3M200VD2T and benefit from our expertise in connecting you to world-class connector solutions.

Frequently Asked Questions

What are the key considerations for a high-density 200-position D-Sub SMD connector like the WB3M200VD2T in a compact embedded system with strict space constraints, specifically regarding board-to-board mating and signal integrity at its 0.50mm pitch?
For the JAE Electronics WB3M200VD2T, high-density 200-position SMD mating in compact systems necessitates careful impedance matching and crosstalk minimization. The 0.50mm pitch requires precise PCB layout with controlled trace impedance and adequate spacing between differential pairs or adjacent signal lines. The 4mm mated stacking height of the WB3M200VD2T is a critical factor; ensure your overall enclosure and component height budget accommodates this. Additionally, consider using a controlled impedance PCB fabrication process and consult with your PCB manufacturer on their capabilities for routing at such fine pitches to maintain signal integrity.
When migrating from a legacy industrial connector to the WB3M200VD2T, what potential design challenges or risks should an engineer anticipate regarding its surface mount termination and gold contact finish?
Migrating to the JAE Electronics WB3M200VD2T, a surface mount D-Sub connector, requires a shift from through-hole or older SMD termination methods. Engineers must ensure their PCB design supports reliable solder paste stencil apertures and reflow profiles suitable for fine-pitch SMD components. The gold contact finish offers excellent conductivity and corrosion resistance, ideal for harsh environments, but it's crucial to verify solder paste compatibility and lead-free soldering process temperatures to avoid damaging the gold plating. The WB3M200VD2T's solder retention feature is designed to mitigate solder wicking issues, but proper PCB pad design and soldering techniques are still paramount.
How does the WB3M200VD2T's 200-position configuration and 0.50mm pitch impact the thermal management and power delivery capabilities in a high-power density application?
The JAE Electronics WB3M200VD2T's high contact density at a 0.50mm pitch means that while it offers significant interconnectivity in a small footprint, thermal management becomes a critical design consideration, especially if high currents are routed through these 200 positions. The current carrying capacity per contact in the WB3M200VD2T is typically modest due to its size. For high-power density applications, it is crucial to analyze the current draw per pin and ensure that the total power dissipated within the connector and surrounding PCB traces does not exceed acceptable thermal limits. Consider offloading high-current paths to dedicated, larger gauge connections or implementing localized cooling solutions if the WB3M200VD2T is intended to carry significant power.
What are the specific advantages and potential limitations of using the WB3M200VD2T for a new design compared to alternative 200-position connectors, particularly if considering long-term industrial reliability?
The JAE Electronics WB3M200VD2T offers advantages such as its compact SMD form factor for space-constrained applications and gold plating for superior corrosion resistance and conductivity, enhancing long-term industrial reliability. Its integrated board guides facilitate automated assembly and alignment. Potential limitations to consider include its 0.50mm pitch, which demands very tight manufacturing tolerances on both the connector and the PCB. If the application involves extreme vibration or shock, the surface mount termination of the WB3M200VD2T might require additional mechanical support, such as potting or mounting brackets, compared to through-hole or crimp-style connectors. Always review the product's lifecycle and environmental testing data for the specific application.
In a scenario where a direct replacement for a legacy 200-position connector is unavailable, what specific technical differences and potential design implications should be assessed when considering the WB3M200VD2T as a substitute?
When considering the JAE Electronics WB3M200VD2T as a substitute for a legacy 200-position connector, key technical differences to assess include mounting type (SMD vs. through-hole or panel mount), physical dimensions, mating cycles, environmental sealing capabilities, and current/voltage ratings per contact. The WB3M200VD2T is an SMD connector with a 0.50mm pitch, meaning a PCB redesign is almost certainly required to accommodate its mounting and termination. Its rated voltage and current will likely differ from older, larger connectors. Verify that the contact plating (gold on the WB3M200VD2T) is compatible with your system's operating environment and that its mating mechanism (plug, outer shroud) provides sufficient mechanical security for your application.
For an industrial control system requiring robust performance over a wide temperature range, what specific aspects of the WB3M200VD2T's construction and materials should be investigated for long-term reliability, especially concerning its surface mount design?
For long-term industrial reliability of the JAE Electronics WB3M200VD2T across a wide temperature range, engineers should investigate the plastic housing material's thermal stability and its compatibility with the operating temperature extremes. While the gold contact finish offers good resistance to oxidation, its performance at elevated or sub-zero temperatures should be verified against application requirements. The reliability of the solder joint for surface mount connectors like the WB3M200VD2T is heavily dependent on the PCB finish, solder alloy, and reflow process used during manufacturing, and this needs to be robust enough to withstand thermal cycling. The 30 micro-inch gold plating thickness on the WB3M200VD2T is standard for high-reliability applications, but consult JAE Electronics for specific operational temperature ratings and recommended assembly processes.
How does the WB3M200VD2T's specified mated stacking height of 4mm influence the design of a multi-board system where precise vertical alignment and minimal flexure are critical for reliable interconnectivity?
The 4mm mated stacking height of the JAE Electronics WB3M200VD2T is a fundamental design parameter for any multi-board system utilizing this connector. This dimension dictates the minimum vertical clearance required between stacked PCBs to allow for mating. Engineers must ensure that the PCB layout and enclosure design account for this height, along with any additional clearance needed for cable routing or other components. For systems requiring precise vertical alignment, the PCB itself must be rigid, and the connectors should be properly soldered with adequate mechanical reinforcement if necessary to prevent flexure at the mating interface, which could otherwise lead to intermittent connections or damage to the WB3M200VD2T.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


WB3M200VD2T

JAE Electronics

CONN PLUG 200POS SMD GOLD

In Stock: 5100

Submit RFQ