The JAE Electronics WB3M200VD2T is a high-density, surface-mount D-Sub connector designed for sophisticated electronic interconnect applications. This precision-engineered plug connector features an impressive 200-position configuration spread across two rows, with a compact 0.020" (0.50mm) pitch, making it ideal for space-constrained electronic design environments.
Engineered with advanced connectivity requirements in mind, the connector offers robust design features including integrated board guides and superior solder retention capabilities. The gold-plated contacts, with a substantial 30.0in (0.76m) contact finish thickness, ensure exceptional electrical performance and long-term reliability in demanding signal transmission scenarios.
The surface-mount mounting type allows for streamlined PCB integration, with a modest 0.146" (3.70mm) height above the board and a 4mm mated stacking height. These dimensional characteristics make the connector particularly suitable for high-density electronic packaging where space optimization is critical.
Primary advantages include its high-density contact arrangement, reliable gold contact finish, and mechanical design features that facilitate precise mounting and consistent electrical connections. The connector is particularly well-suited for telecommunications, computing, industrial control systems, and advanced signal transmission applications requiring compact, high-performance interconnect solutions.
While specific equivalent models are not directly mentioned in the specification, similar high-density D-Sub connectors from manufacturers like Amphenol, TE Connectivity, and Molex might offer comparable specifications. Potential alternative models would likely share similar pitch, contact count, and surface-mount characteristics.
The connector is packaged in a tray format, facilitating convenient handling and integration into manufacturing processes, and represents a sophisticated solution for engineers seeking reliable, high-performance interconnect technology.
WB3M200VD2T Key Technical Attributes
Manufacturer Part Number WB3M200VD2T
Number of Positions 200
Pitch 0.020 inch (0.50 mm)
WB3M200VD2T Packing Size
Type Plug Connector
Material Gold Contact Finish with 30.0 in (0.76 µm) Thickness
Size 200 Positions, 2 Rows
Pin Configuration D-Shaped Connector with Outer Shroud Contacts
Thermal Characteristics Surface Mount Device, Height Above Board 0.146 inch (3.70 mm)
Electrical Properties Designed for Reliable Solder Retention and Board Guide Stability
WB3M200VD2T Application
This connector model is primarily used in high-density interconnect applications requiring secure and stable board-to-board connections. It is suitable for telecommunications, data communication, industrial instrumentation, and other electronic systems where precise signal integrity and space-saving surface mount solutions are critical.
WB3M200VD2T Features
The WB3M200VD2T features a durable gold contact finish that enhances conductivity and resists corrosion, ensuring long-term reliability in demanding environments. Its board guide and solder retention design provide robust mechanical stability during assembly and operation, minimizing the risk of connection failures caused by vibration or mechanical shock. The high position count of 200 and fine pitch of 0.50 mm allow for compact and high-density configurations ideal for advanced electronic equipment. The plug connector type with outer shroud contacts aids in secure mating and alignment, reducing wear and damage to the contacts. Surface mount assembly facilitates automated manufacturing processes and lower profile designs. Tray packaging ensures component protection and efficient handling during production.
WB3M200VD2T Quality and Safety Features
This product complies with stringent industry standards, including RoHS directives ensuring environmental safety. The gold plating thickness exceeds standard requirements at 0.76 microns, enhancing corrosion resistance and contact reliability. JAE Electronics maintains rigorous quality management systems including ISO certifications, guaranteeing consistency and performance. The robust design incorporates anti-solder wicking features to prevent connectivity issues and enhance thermal stability during soldering processes, safeguarding the integrity of electrical connections.
WB3M200VD2T Compatibility
The WB3M200VD2T is compatible within the WB3 series connectors from JAE Electronics, designed specifically for matching header counterparts and accessories within the same product line. Its dimensions and pitch conform to industry standards for D-Sub high-density connectors, ensuring ease of integration into existing systems and compatibility with related components in telecommunications, computing, and embedded control platforms.
WB3M200VD2T Datasheet PDF
For the most authoritative and comprehensive technical information about the WB3M200VD2T connector, please download the datasheet available on our website. This datasheet contains detailed mechanical drawings, electrical specifications, thermal ratings, recommended soldering profiles, and compliance certifications. Accessing the datasheet on the current page guarantees up-to-date and official manufacturer data to support your design and procurement decisions.
Quality Distributor
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