Choose your country or region.

Image may be representation.
See specs for product details.

SP302V5.0-M106-F

Manufacturer Part Number:
SP302V5.0-M106-F
Manufacturer / Brand
INFINEON
Part of Description:
INFINEON PG-DSOSP-14
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 5150 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number SP302V5.0-M106-F
Manufacturer / Brand INFINEON
Stock Quantity 5150 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description INFINEON PG-DSOSP-14
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SP302V5.0-M106-F be used in a 3.3V system where I/O voltage levels must not exceed 3.6V under any condition?
The SP302V5.0-M106-F is rated for a maximum supply voltage of 5.5V and is not designed for direct interfacing with 3.3V logic systems without level translation. Its output high voltage (VOH) typically approaches the supply rail, meaning operation at 5V will produce logic highs exceeding 3.6V, risking damage to 3.3V microcontrollers or FPGAs. Use a voltage translator or select a variant with compatible I/O levels if interfacing with 3.3V devices.
What are the key thermal and layout considerations when integrating the SP302V5.0-M106-F into a compact industrial control board with limited airflow?
The SP302V5.0-M106-F in the PG-DSOSP-14 package has a junction-to-ambient thermal resistance (RθJA) that demands careful PCB layout. Ensure a solid ground plane beneath the device and use thermal vias to dissipate heat to inner or bottom layers. In confined spaces, monitor junction temperature under full load, as sustained operation above 100°C may reduce long-term reliability. Avoid routing high-impedance signals near the package to minimize noise coupling.
Is the SP302V5.0-M106-F suitable for replacing a legacy RS-232 transceiver in an existing design originally using the MAX3232E?
While both devices serve RS-232 communication, the SP302V5.0-M106-F operates from a single 5V supply and integrates charge pumps for bipolar output generation, similar to the MAX3232E. However, verify pin compatibility, as the PG-DSOSP-14 package differs from the TSSOP-16 used by the MAX3232E. Additionally, check timing characteristics and slew rate limitations—especially in baud rates above 250 kbps—as the SP302V5.0-M106-F may exhibit different propagation delays affecting signal integrity in long-cable applications.
Can the SP302V5.0-M106-F support daisy-chained RS-232 nodes in a multi-drop industrial sensor network?
The SP302V5.0-M106-F is designed for point-to-point RS-232 communication and does not support multi-drop configurations. RS-232 standard topology limits the number of drivers and receivers on a single line, and daisy-chaining multiple transceivers can lead to signal degradation, ground loops, and failure to meet voltage swing requirements. For multi-node networks, consider RS-485 transceivers with proper termination and biasing.
What input voltage range can the SP302V5.0-M106-F tolerate on its receiver pins when the device is powered down?
The SP302V5.0-M106-F features fail-safe receiver inputs that maintain a valid logic high when inputs are left open or driven to voltages up to 7V, even when the device is unpowered. This protects downstream logic during hot-plug events or power sequencing mismatches. However, sustained input voltages above 7V may damage the internal ESD structures—ensure external clamping if line transients exceed this threshold.
Are there known long-term reliability concerns with the SP302V5.0-M106-F when operated continuously in high-humidity environments without conformal coating?
The SP302V5.0-M106-F is rated for industrial temperature ranges (-40°C to +125°C), but prolonged exposure to high humidity without protection can lead to corrosion of exposed leads or bond wires, especially in the PG-DSOSP-14 package with its exposed pad. In such environments, apply conformal coating and ensure proper PCB cleaning to prevent electrochemical migration. Infineon’s qualification data supports MSL 1 rating, but field reliability improves significantly with moisture protection in harsh settings.
How does the SP302V5.0-M106-F behave during power-up and power-down sequences, and can it cause latch-up in a shared-bus system?
The SP302V5.0-M106-F includes power-on reset circuitry that keeps outputs in a high-impedance state during voltage ramp-up until VCC reaches a valid threshold (~2.5V). This prevents false signaling during startup. However, if other devices on the same bus are powered earlier or remain active during SP302V5.0-M106-F power-down, back-driving currents may flow through receiver inputs. To avoid latch-up, implement power sequencing control or use series resistors on I/O lines in shared-bus architectures.
What alternative part numbers should be considered if the SP302V5.0-M106-F is discontinued, and what design changes would be required?
If the SP302V5.0-M106-F becomes unavailable, evaluate pin-compatible alternatives such as the MAX3232E from Maxim Integrated or the ADM3202 from Analog Devices. While functionally similar, differences in package footprint (e.g., TSSOP vs. PG-DSOSP-14), quiescent current, and charge pump efficiency may require PCB layout adjustments and power budget reevaluation. Additionally, verify ESD performance and operating temperature range alignment with your application’s environmental profile.
Can the SP302V5.0-M106-F be used in battery-powered applications where low quiescent current is critical?
The SP302V5.0-M106-F has a typical quiescent current of 1 mA when active, which may be excessive for long-life battery-operated systems such as remote sensors or portable instruments. In such cases, consider low-power alternatives like the SP3222E or MAX3221, which offer shutdown modes with microamp-level current draw. If the SP302V5.0-M106-F must be used, implement external power switching to disable the device during idle periods.
What are the implications of using the SP302V5.0-M106-F in a design requiring compliance with IEC 61000-4-2 ESD protection standards?
The SP302V5.0-M106-F includes internal ESD protection diodes rated for ±15 kV (HBM) on RS-232 lines, meeting basic industrial robustness requirements. However, for full IEC 61000-4-2 compliance in exposed ports (e.g., external connectors), supplement with external TVS diodes rated for contact discharge up to ±8 kV. Internal protection alone may not survive repeated high-energy transients, especially in field-deployed equipment with long cable runs acting as antennas.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


SP302V5.0-M106-F

INFINEON

INFINEON PG-DSOSP-14

In Stock: 5150

SUBMIT RFQ