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2ED28073J06FXUMA1

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Manufacturer Part Number:
2ED28073J06FXUMA1
Manufacturer / Brand
Infineon Technologies
Part of Description:
LEVEL SHIFT JUNCTION ISO
Datasheets:
2ED28073J06FXUMA1.pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 29417 pcs Stock Available.
ECAD Model:
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Part Number 2ED28073J06FXUMA1
Manufacturer / Brand Infineon Technologies
Stock Quantity 29417 pcs Stock
Category Integrated Circuits (ICs) > Power Management (PMIC) - Gate Drivers
Description LEVEL SHIFT JUNCTION ISO
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Supply 10V ~ 20V
Supplier Device Package 8-SOIC
Series -
Package / Case 8-SOIC (0.154", 3.90mm Width)
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 125°C (TA)
Number of Drivers 2
Mounting Type Surface Mount
Logic Voltage - VIL, VIH 0.8V, 2.2 V
Input Type CMOS, TTL
High Side Voltage - Max (Bootstrap) 600 V
Gate Type IGBT, N-Channel MOSFET
Driven Configuration Half-Bridge
Channel Type Independent
Base Product Number 2ED28073

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2ED28073J06FXUMA1 Product Details:

The 2ED28073J06FXUMA1 from Infineon Technologies is a half-bridge gate driver IC with integrated level-shift and junction isolation, engineered for high-voltage switching applications where isolated drive capability and reliable control are necessary. This device manages two independent output channels in a half-bridge configuration, delivering asymmetric peak output currents of 20mA source and 80mA sink to effectively drive IGBT and N-channel MOSFET power stages. The integrated level shifter supports bootstrap voltages up to 600V, enabling direct control of high-side switches in motor drives, solar inverters, switched-mode power supplies, and industrial automation systems without external isolation components.

Operating from a supply voltage range of 10V to 20V, the 2ED28073J06FXUMA1 accepts CMOS and TTL logic inputs with defined thresholds of 0.8V for VIL and 2.2V for VIH, offering straightforward interfacing with microcontrollers and DSPs. The driver exhibits a rise time of 1.5µs and a fall time of 225ns, providing controlled switching transitions that balance speed with noise immunity in both IGBT gate driver circuits and MOSFET gate driver designs. This switching performance supports applications requiring moderate switching frequencies while maintaining stable operation across the full temperature range of -40°C to 125°C.

Housed in an 8-SOIC surface-mount package with 3.90mm body width, the device is supplied in tape and reel format, facilitating automated assembly in volume production environments. The compact footprint and RoHS3-compliant construction align with space-constrained PCB layouts and regulatory requirements in industrial and renewable energy equipment. With MSL-2 moisture sensitivity rating and a one-year floor life, the component supports standard handling and storage protocols in manufacturing operations.

The half-bridge gate driver architecture of the 2ED28073J06FXUMA1 simplifies drive circuitry in inverter topologies, allowing efficient control of power semiconductors in applications such as three-phase motor control, PFC converters, and DC-DC power modules. The independent channel operation provides design flexibility for timing and dead-time control, while the integrated junction isolation reduces external component count and board area compared to discrete optocoupler-based solutions. Infineon's base product family 2ED28073 addresses mid-voltage power conversion needs where integrated isolation and robust drive performance are required in cost-sensitive designs.

2ED28073J06FXUMA1 Image
2ED28073J06FXUMA1 (1)

Replacing the Infineon Technologies 2ED28073J06FXUMA1 in 600 V Half-Bridge Gate Driver Designs

When a 2ED28073J06FXUMA1 replacement is needed, the main challenge is not simply finding another 8-SOIC half-bridge gate driver. The substitute must match the high-side bootstrap rating, low-side and high-side input behavior, supply-voltage range, logic thresholds, output-drive capability, propagation behavior, package constraints, and system-level protection expectations.

The Infineon Technologies 2ED28073J06FXUMA1 is a 600 V half-bridge gate driver for IGBTs and N-channel MOSFETs, supplied in an 8-SOIC package and designed for CMOS/TTL-compatible control inputs. Suitable alternative part numbers that may be evaluated include:

These parts are not identical in every parameter. Some offer higher output current, some use different input/control schemes, and some may require PCB or firmware review. A qualified replacement should be selected by comparing the gate-drive requirement of the MOSFET or IGBT, switching frequency, bootstrap capacitor sizing, input polarity, UVLO behavior, and available package footprint.

What the Infineon Technologies 2ED28073J06FXUMA1 Requires from a Replacement Gate Driver

The 2ED28073J06FXUMA1 is a half-bridge gate driver IC intended to drive one high-side and one low-side switch in power-conversion stages. Its main replacement-relevant specifications are summarized below.

ParameterInfineon Technologies 2ED28073J06FXUMA1
ManufacturerInfineon Technologies
FunctionHalf-bridge gate driver IC
Driver channels2 independent drivers
Supported power switchesIGBT, N-channel MOSFET
High-side rating600 V bootstrap operation
Supply voltage10 V to 20 V
Input typeCMOS, TTL
Logic thresholdsVIL 0.8 V, VIH 2.2 V
Peak output current20 mA source, 80 mA sink
Rise/fall time1.5 µs rise, 225 ns fall typical
Package8-SOIC, 3.90 mm body width
MountingSurface mount
Operating temperature-40°C to 125°C
PackagingTape & Reel
ComplianceRoHS3 compliant, REACH unaffected

For replacement evaluation, the 600 V high-side bootstrap rating is one of the first compatibility checks. A substitute with a lower high-side voltage rating should not be used in offline motor-drive, inverter, or half-bridge bus systems where switching-node voltage can approach several hundred volts.

The 10 V to 20 V supply range also affects compatibility. Designs using 12 V or 15 V gate-drive rails can usually accommodate many standard 600 V half-bridge drivers, but undervoltage-lockout thresholds must still be reviewed because they influence startup behavior and fault recovery.

The 2ED28073J06FXUMA1 has relatively modest gate-drive current, especially on the sourcing side. This makes it suitable for moderate-speed switching, smaller MOSFETs, IGBTs with limited gate-charge requirements, or designs where EMI is controlled through slower turn-on. A replacement with much higher output current can reduce switching losses, but it may also increase dv/dt, ringing, and EMI unless external gate resistors are adjusted.

Typical applications include half-bridge power supplies, small inverter stages, motor-control circuits, ballast-style switching stages, and general high-side/low-side MOSFET or IGBT gate-drive circuits. In these applications, replacement suitability depends on more than matching the package: the substitute must preserve timing behavior, avoid shoot-through, tolerate negative VS transients, and maintain acceptable gate voltage under load.

Candidate 2ED28073J06FXUMA1 Alternative Parts for Technical Evaluation

Part NumberManufacturerKey SpecificationsProduct FeaturesTypical ApplicationsWhy It Can Replace the Original PartMain Differences or LimitationsRecommended Usage
2ED28073J06FXUMA1Infineon Technologies600 V half-bridge driver, 10 V to 20 V supply, CMOS/TTL inputs, 20 mA source / 80 mA sink, 8-SOICIndependent high-side and low-side drivers, bootstrap high-side drive, TTL-compatible input thresholdsMOSFET/IGBT half-bridges, inverter stages, motor-drive power stages, switching power suppliesOriginal reference deviceBaseline part; relatively low output-drive current compared with many newer alternativesUse when original electrical behavior, switching speed, and BOM continuity are preferred
IR2101STRPBF IR2101STRPBF IR2101STRPBF Infineon Technologies IC GATE DRVR HALF-BRIDGE 8SOIC 39005 Infineon Technologies600 V high-side/low-side driver, typical 10 V to 20 V operation, SOIC-8, higher gate-drive current than 2ED28073J06FXUMA1Industry-standard HVIC half-bridge driver, independent inputs, bootstrap high-side supplyHalf-bridge converters, motor drives, Class D power stages, offline switching circuitsSame general function, same manufacturer family heritage, 600 V capability, similar SOIC-8 implementationOutput drive is stronger; timing, UVLO, and pin compatibility must be verified against the PCB and controller logicGood first-choice alternative when stronger gate drive is acceptable and the design can tolerate timing differences
IRS2101STRPBF IRS2101STRPBF IRS2101STRPBF Infineon Technologies IC GATE DRVR HI/LOW SIDE 8SOIC 27800 Infineon Technologies600 V high-side/low-side driver, SOIC-8, independent logic inputs, improved ruggedness versus older IR2101 IR2101 IR2101 Infineon Technologies IC GATE DRVR HALF-BRIDGE 8DIP 18600 family devicesRuggedized high-voltage level-shift driver, bootstrap operation, CMOS/TTL-compatible interface in many designsIndustrial inverters, motor-control half-bridges, power supplies using 600 V bus structuresFunctionally close to 2ED28073J06FXUMA1 for 600 V half-bridge gate-drive applicationsHigher drive current and different protection/timing characteristics may require gate-resistor and EMI reviewSuitable where a modern Infineon 600 V half-bridge driver is preferred and layout qualification is possible
UCC27710D UCC27710D UCC27710D Texas Instruments IC GATE DRVR HALF-BRIDGE 8SOIC 3200 Texas Instruments620 V high-side/low-side driver, 10 V to 20 V VDD range, SOIC-8, higher source/sink current class than originalHigh-voltage half-bridge driver with robust switching-node transient immunity and separate inputsAC/DC power supplies, motor drives, solar inverters, industrial half-bridge power stagesVoltage rating and functional architecture support the same high-side/low-side gate-drive roleNot a drop-in choice without pinout, propagation-delay, UVLO, and input-threshold verification; stronger drive may alter EMIRecommended when additional drive strength and transient robustness are desired
FAN7382MX FAN7382MX FAN7382MX onsemi IC GATE DRVR HALF-BRIDGE 8SOP 22100 onsemi600 V high-side/low-side gate driver, SOIC-8, higher output current than 2ED28073J06FXUMA1, logic-compatible inputsHigh-voltage process driver, bootstrap high-side operation, separate high/low inputsMotor drives, lamp ballasts, power supplies, inverter half-bridgesMatches the required 600 V half-bridge driver category and package classElectrical timing, input thresholds, and pin configuration should be checked; stronger output stage may require gate-drive tuningPractical option for cost-sensitive or availability-driven replacement when design validation is planned
L6384ED013TR L6384ED013TR L6384ED013TR STMicroelectronics IC GATE DRVR HALF-BRIDGE 8SO 22800 STMicroelectronics600 V half-bridge driver, SOIC-8, higher drive current class, integrated control features depending on configurationHigh-voltage half-bridge driver with bootstrap supply and protection-oriented behaviorMotor-control circuits, compact inverters, appliance power stages, SMPS half-bridgesCan perform the same high-side/low-side MOSFET or IGBT driving functionControl scheme may differ from fully independent-input drivers; may require schematic and firmware adaptationBetter suited for redesigns or controlled substitutions rather than blind drop-in replacement

Among these alternatives, IR2101STRPBF IR2101STRPBF IR2101STRPBF Infineon Technologies IC GATE DRVR HALF-BRIDGE 8SOIC 39005 and IRS2101STRPBF IRS2101STRPBF IRS2101STRPBF Infineon Technologies IC GATE DRVR HI/LOW SIDE 8SOIC 27800 are often the closest starting points because they remain within the Infineon high-voltage half-bridge driver ecosystem and are familiar in 600 V bootstrap gate-drive circuits. However, they generally provide stronger gate-drive current than the 2ED28073J06FXUMA1, so the external gate resistance and switching waveform should be reviewed.

The UCC27710D UCC27710D UCC27710D Texas Instruments IC GATE DRVR HALF-BRIDGE 8SOIC 3200 is a strong candidate when the design benefits from a 620 V rating and higher output-drive capability. It may be attractive in systems where switching-node transients and gate-charge demand are higher than the original design allowed, but it should be qualified carefully for timing and layout behavior.

The FAN7382MX FAN7382MX FAN7382MX onsemi IC GATE DRVR HALF-BRIDGE 8SOP 22100 offers a comparable 600 V half-bridge driver function and can be considered where availability or cost structure favors onsemi. Its use should be based on datasheet-level comparison of input thresholds, propagation delay, and output current.

The L6384ED013TR L6384ED013TR L6384ED013TR STMicroelectronics IC GATE DRVR HALF-BRIDGE 8SO 22800 can replace the original function in some half-bridge applications, but it is less likely to be a simple drop-in replacement if the original design depends on fully independent high-side and low-side logic inputs. It is better evaluated in redesigns or board revisions.

Engineering Comparison of 2ED28073J06FXUMA1 Replacement Options

Evaluation FactorIR2101STRPBFIRS2101STRPBFUCC27710DFAN7382MXL6384ED013TR
Electrical compatibilityGood functional match for 600 V half-bridge drive; check exact input thresholds and UVLOGood match with ruggedized behavior; verify timing and UVLOStrong candidate with 620 V rating; requires detailed logic and UVLO comparisonCompatible function class; verify supply range, thresholds, and timingFunctionally similar but control behavior may differ more than other options
Mechanical compatibilitySOIC-8 package class; PCB pinout must be confirmedSOIC-8 package class; pinout verification requiredSOIC-8 package class; not assumed pin-identical without layout reviewSOIC-8 package class; confirm footprint and pin assignmentSOIC-8 package class; schematic compatibility must be reviewed
Gate-drive strengthHigher than original; may speed up switchingHigher than original; suitable for larger gate chargeMuch higher than original; useful for higher-frequency or larger MOSFETsHigher than original; can reduce switching transition timeHigher drive class; may need gate-resistor adjustment
Performance impactMay reduce switching loss but increase EMI if gate network is unchangedSimilar benefit with potentially improved ruggednessBest suited where stronger drive and transient performance are neededBalanced alternative for availability-driven replacementGood in redesigned control schemes; may not preserve original timing behavior
Reliability considerationsMature HVIC family; qualification still needed for negative VS transientsRuggedized family option; suitable for demanding switching nodesGood for harsh switching environments if layout supports itSuitable when validated under real load and temperatureDepends heavily on correct control-interface adaptation
Package availabilityCommonly available in SOIC-8 tape-and-reel formatsCommonly available in SOIC-8 tape-and-reel formatsWidely used industrial driver packageOften available in SOIC-8 tape-and-reelAvailable in SOIC-8 tape-and-reel
Cost considerationsUsually practical for standard half-bridge BOMsMay cost more than older IR2101 IR2101 IR2101 Infineon Technologies IC GATE DRVR HALF-BRIDGE 8DIP 18600 -type parts depending on supplyMay be higher cost but justified by drive strength and ratingOften considered when procurement flexibility is neededCost depends on redesign effort as much as unit price
Best-fit scenarioClosest general-purpose replacement candidate when stronger drive is acceptablePreferred Infineon alternative for robust 600 V half-bridge applicationsBest for designs needing more drive current and voltage marginSuitable second-source style option after timing and pinout reviewBest for redesigns, not direct substitution without control review
Main limitationStronger output current can change switching behaviorTiming and protection differences must be validatedMay require EMI, ringing, and gate-resistor redesignDatasheet and layout checks needed before approvalInput/control differences may prevent drop-in use

For a conservative replacement path, IR2101STRPBF IR2101STRPBF IR2101STRPBF Infineon Technologies IC GATE DRVR HALF-BRIDGE 8SOIC 39005 or IRS2101STRPBF IRS2101STRPBF IRS2101STRPBF Infineon Technologies IC GATE DRVR HI/LOW SIDE 8SOIC 27800 should usually be evaluated first because they align closely with the 600 V half-bridge gate driver role of the Infineon Technologies 2ED28073J06FXUMA1. If the original circuit uses small MOSFETs or intentionally slow switching edges, the higher drive capability of these replacements should be moderated with external gate resistance.

For performance-oriented redesigns, UCC27710D UCC27710D UCC27710D Texas Instruments IC GATE DRVR HALF-BRIDGE 8SOIC 3200 provides a stronger output stage and a 620 V high-side rating. This can be useful when the original 2ED28073J06FXUMA1 is limiting switching speed or gate-charge capability, but layout, bootstrap sizing, and EMI behavior should be rechecked.

For procurement flexibility, FAN7382MX FAN7382MX FAN7382MX onsemi IC GATE DRVR HALF-BRIDGE 8SOP 22100 can be considered as an alternative 600 V half-bridge gate driver, especially where sourcing continuity is the main concern. It should not be treated as automatically interchangeable without verifying pinout, propagation delay, logic behavior, and operating temperature suitability.

For board revisions or designs where the control logic can be adapted, L6384ED013TR L6384ED013TR L6384ED013TR STMicroelectronics IC GATE DRVR HALF-BRIDGE 8SO 22800 may be suitable. Its replacement value depends on whether the application can accommodate its input/control architecture and timing characteristics.

Before approving any 2ED28073J06FXUMA1 equivalent or alternative part number, compare the datasheets under the actual operating bus voltage, gate charge, switching frequency, ambient temperature, bootstrap capacitor value, and controller logic levels. For quotations and sourcing support for 2ED28073J06FXUMA1 replacement parts, use the professional electronic components website IC-Components.com or email Info@IC-Components.com.

Frequently Asked Questions

What are the critical voltage constraints for the high-side bootstrap capacitor in a 2ED28073J06FXUMA1-based half-bridge design to ensure reliable IGBT or N-channel MOSFET gate driving?
The 2ED28073J06FXUMA1 supports a maximum high-side bootstrap voltage of 600 V, which directly limits the allowable DC bus voltage and bootstrap capacitor selection. Engineers must ensure that the bootstrap capacitor’s rated voltage exceeds the peak high-side supply by at least 20% to handle voltage transients during switching. Additionally, the bootstrap capacitor must provide sufficient charge to maintain gate drive voltage throughout the PWM cycle, especially at high duty cycles. Failure to size this correctly can result in gate oxide degradation or incomplete turn-on of the high-side device.
How does the 2ED28073J06FXUMA1 handle desaturation detection, and what design considerations are required if this feature is used in an industrial motor control application?
The 2ED28073J06FXUMA1 includes integrated DESAT (desaturation) protection circuitry that monitors the collector-emitter voltage of the IGBT. When overcurrent or short-circuit conditions occur, the driver asserts a fault signal and disables gate drive outputs to protect the power device. However, accurate operation requires precise external resistor and diode selection in the DESAT pin circuit, proper layout to minimize noise pickup, and correct timing margin to distinguish between normal turn-off and fault conditions. In long-term industrial use, periodic validation of DESAT response under thermal stress is recommended due to potential parameter drift in IGBTs at elevated temperatures.
Can the 2ED28073J06FXUMA1 be safely used with SiC MOSFETs, and what adjustments are needed compared to traditional IGBT driving?
While the 2ED28073J06FXUMA1 is optimized for IGBTs and N-channel MOSFETs, it can drive SiC MOSFETs with careful attention to gate drive requirements. SiC devices demand faster rise/fall times and lower gate resistance than standard silicon MOSFETs. The 2ED28073J06FXUMA1 provides fast rise time (1.5 µs typ), but external gate resistors must be minimized and placed close to the driver output to reduce parasitic inductance. Additionally, gate-source voltage should not exceed ±20 V, so level shifting or Zener clamping may be necessary if the system uses higher gate drive voltages incompatible with SiC thresholds.
What is the minimum dead-time requirement when using the 2ED28073J06FXUMA1 in a half-bridge configuration to prevent shoot-through?
The 2ED28073J06FXUMA1 incorporates internal blanking and propagation delays that influence effective dead time. With typical fall time of 225 ns and input-to-output delay asymmetry, engineers should implement at least 300–500 ns of intentional dead time in firmware or hardware logic to account for worst-case propagation skew and device turn-off characteristics. This ensures that both high-side and low-side drivers never conduct simultaneously, even under process or temperature variations, thereby protecting against shoot-through currents that could damage the IC or connected power devices.
Is it possible to replace the 2ED28073J06FXUMA1 with alternative Infineon gate driver ICs like the 2EDF72xx series, and what key trade-offs should be evaluated?
Yes, the 2ED28073J06FXUMA1 can often be replaced with other Infineon 2EDF72xx family parts such as the 2EDF72150 or 2EDF72155, provided package compatibility and electrical specifications align. However, differences exist: the 2EDF72xx series typically features higher peak sink current (up to 150 mA vs. 80 mA here), which improves turn-off speed for fast-switching applications. Conversely, the 2ED28073J06FXUMA1 offers better noise immunity due to lower dV/dt sensitivity and enhanced isolation robustness. Migration must include re-validation of EMI performance, DESAT functionality, and thermal derating under continuous load.
How does the 2ED28073J06FXUMA1 perform in high-temperature environments above 100°C, and what layout practices mitigate reliability risks?
The 2ED28073J06FXUMA1 operates reliably from -40°C to 125°C (TA), making it suitable for industrial environments. However, at elevated temperatures, gate threshold voltages of external MOSFETs or IGBTs shift downward, potentially increasing conduction losses. To maintain stability, PCB layouts should minimize loop inductance on gate drive paths, use star grounding near the driver, and avoid placing sensitive analog traces adjacent to high-current commutation nodes. Thermal vias under the SOIC package enhance heat dissipation, but local hotspots near bootstrap diodes or gate resistors must be monitored during long-term reliability testing.
Can the 2ED28073J06FXUMA1 drive multiple parallel MOSFETs or IGBTs on a single channel, and what precautions are necessary?
The 2ED28073J06FXUMA1 can source up to 20 mA per channel, which may support small parallel configurations of low-gate-charge devices. However, paralleling power devices increases total gate capacitance significantly, requiring higher peak current than the driver provides. For most practical applications, each power switch should have its own dedicated driver channel or a more robust multi-ampere driver. If parallel driving is unavoidable, external push-pull stages or buffer circuits must be added, and gate resistors should be matched closely to balance current sharing and prevent oscillations.
What input logic levels does the 2ED28073J06FXUMA1 accept, and how does this affect interfacing with 3.3 V microcontrollers in industrial control systems?
The 2ED28073J06FXUMA1 accepts CMOS/TTL inputs with VIH(min) = 2.2 V and VIL(max) = 0.8 V, making it compatible with 5 V logic systems but marginal for 3.3 V MCUs. Direct connection may fail to meet VIH requirements under worst-case temperature or voltage droop. Therefore, designers should either use a logic-level translator between the MCU and the driver, or verify that the MCU’s output high voltage remains above 2.2 V across all operating conditions. Alternatively, some 3.3 V MCUs offer 5 V-tolerant I/O pins, which can be leveraged if datasheet guarantees are confirmed.
Does the 2ED28073J06FXUMA1 require external components for basic operation, and which ones are essential for functional isolation and protection?
Yes, several external components are mandatory for safe and functional operation. A bootstrap capacitor (typically 0.1–1 µF X7R ceramic) and diode (fast-recovery, <100 ns) are required for high-side gate charging. Gate resistors (typically 5–20 Ω) limit ringing and control switching speed. A bypass capacitor (0.1 µF) must be placed within 1 cm of the VCC pin to suppress noise. For DESAT protection, an external resistor and diode network must be connected to the FAULT pin. Without these, the IC cannot function as intended and risks failure during operation.
How does the 2ED28073J06FXUMA1 compare to non-isolated alternatives in terms of noise immunity and system safety in motor drive applications?
Unlike non-isolated gate drivers, the 2ED28073J06FXUMA1 provides reinforced galvanic isolation between control logic and power stage, critical for safety and EMC compliance in motor drives. This reduces ground loops and minimizes common-mode noise coupling into sensitive control circuits. Non-isolated solutions may offer cost savings but increase risk of latch-up or MCU damage during faults. The 2ED28073J06FXUMA1’s ISO rating ensures consistent performance under transient surges typical in industrial environments, justifying its use where reliability and regulatory approval are priorities.

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2ED28073J06FXUMA1

2ED28073J06FXUMA1

Infineon Technologies

LEVEL SHIFT JUNCTION ISO

In Stock: 29417

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