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WG82583V SLGVD

In Stock 8847 pcs Reference Price(In US Dollars)
1+
$49.2944
Manufacturer Part Number:
WG82583V SLGVD
Manufacturer / Brand
INTEL
Part of Description:
WG82583V SLGVD INTEL QFN
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 8847 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number WG82583V SLGVD
Manufacturer / Brand INTEL
Stock Quantity 8847 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description WG82583V SLGVD INTEL QFN
Lead Free Status / RoHS Status: RoHS Compliant
RFQ WG82583V SLGVD Datasheets WG82583V SLGVD Details PDF
WG82583V SLGVD Details PDF for FR.pdf
WG82583V SLGVD Details PDF for IT.pdf
WG82583V SLGVD Details PDF for ES.pdf
WG82583V SLGVD Details PDF for KR.pdf
WG82583V SLGVD Details PDF for DE.pdf
Package QFN
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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WG82583V SLGVD Product Details:

The WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD is a specialized integrated circuit manufactured by Intel, designed to deliver robust networking and connectivity solutions for embedded and enterprise applications. This IC belongs to Intel's Gigabit Ethernet controller family, engineered to address the demanding challenges of high-speed data transmission, network reliability, and system integration in modern computing environments.

As a specialized IC within the broader integrated circuits category, this component tackles critical design challenges including power efficiency optimization, thermal management in compact form factors, and maintaining signal integrity at gigabit speeds. The device is housed in a QFN (Quad Flat No-lead) package with 831 pins, which provides excellent thermal performance and electrical characteristics while minimizing board space requirements. This compact packaging solution enables designers to create dense, high-performance network implementations without sacrificing reliability or functionality.

Key specifications include its gigabit Ethernet controller capabilities, advanced packet processing features, and support for multiple network protocols. The component offers integrated PHY functionality, reducing external component count and simplifying board design. It supports various power management states, enabling energy-efficient operation across different workload scenarios, which is particularly valuable in server and embedded applications where power consumption directly impacts operational costs and thermal design requirements.

The primary advantages of the WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 include its proven Intel reliability, comprehensive hardware offload capabilities that reduce CPU overhead, support for virtualization technologies, and robust error detection and correction mechanisms. The integrated design reduces bill-of-materials costs while improving overall system reliability by minimizing potential points of failure. With 9047 units available, this component offers excellent supply availability for volume production requirements.

This specialized IC is compatible with various Intel chipsets and processor platforms, making it suitable for integration into server motherboards, network appliances, industrial computers, embedded systems, and telecommunications equipment. Primary application areas include data center infrastructure, enterprise networking solutions, industrial automation systems, network-attached storage devices, and high-reliability embedded computing platforms where consistent gigabit Ethernet performance is essential.

Equivalent or alternative models include the Intel WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 in different package variations, Intel I210 and I211 series Gigabit Ethernet controllers, Intel I350 series for multi-port applications, and Broadcom BCM5720 and BCM5719 controllers. Other alternatives include Marvell Alaska 88E1512 PHY controllers, Realtek RTL8111 series for cost-sensitive applications, and Microchip LAN7430 and LAN7431 controllers, though specific feature sets and performance characteristics may vary across these alternatives.

WG82583V SLGVD Key Technical Attributes

Manufacturer: Intel

Manufacturer Part Number: WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD

Main Category: Integrated Circuits (ICs)

WG82583V SLGVD Packing Size

The WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD is presented in a QFN (Quad Flat No-lead) package, with case specification number 831. QFN packages offer excellent thermal and electrical performance due to their exposed pad design, facilitating efficient heat dissipation and reliable signal integrity. The compact footprint allows for dense board layouts, making it highly suitable for modern high-performance applications. Its multi-pin configuration supports advanced circuitry integration and robust electrical connections for critical systems.

WG82583V SLGVD Application

This specialized IC from Intel is typically utilized in networking devices, industrial control systems, embedded platforms, and high-speed data communication infrastructure. Its design is optimized for Ethernet controller solutions, providing stable connectivity and superior network performance in enterprise and consumer electronics. The WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD supports applications requiring rapid data processing, low latency, and reliable network interfacing.

WG82583V SLGVD Features

The WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD delivers a comprehensive suite of features, including advanced power management, enhanced thermal dissipation through its QFN package, and integration of specialized networking protocols. It boasts low power consumption, high-speed data handling capability, and sophisticated error correction mechanisms, ensuring uninterrupted communications in demanding environments. The IC includes EMI suppression, signal integrity assurance, and offers compatibility with popular circuit designs. Its robust construction ensures extended operational life, and its versatile footprint allows flexible placement on densely populated PCBs.

WG82583V SLGVD Quality and Safety Features

Intel's stringent manufacturing standards guarantee the WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD’s reliability and compliance with international safety regulations. The IC exhibits resistance to environmental stressors such as temperature fluctuations, humidity, and electrical transients. Comprehensive testing protocols ensure every unit meets or exceeds quality benchmarks, providing customers with peace of mind regarding performance consistency and safety.

WG82583V SLGVD Compatibility

This product model is designed with wide compatibility, supporting integration with an extensive array of systems and devices employing Ethernet controllers. Its electrical and signal standards adhere to industry requirements, ensuring seamless interoperability in diverse application scenarios ranging from consumer electronics to enterprise networking hardware.

WG82583V SLGVD Datasheet PDF

We encourage customers to download the most authoritative and up-to-date datasheet for the WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD directly from our website. The datasheet contains complete technical specifications, detailed application guidance, and comprehensive pinout diagrams, assisting you in making the best design and purchasing decisions for your projects.

Quality Distributor

IC-Components is proud to be a premium distributor of Intel products. Our commitment to quality and service ensures you receive genuine WG82583V WG82583V WG82583V INTEL WG82583V INTEL QFN 1719 SLGVD ICs with full support and competitive pricing. We strongly recommend our customers request a quote today through our website to benefit from the best deals and fast, reliable delivery on your specialized IC requirements.

Frequently Asked Questions

How can I determine if the Intel WG82583V SLGVD Ethernet controller is compatible with my existing system’s power supply specifications?
The Intel WG82583V SLGVD typically operates within standard voltage ranges for QFN packages. Ensure your system’s supply provides stable 3.3V or 5V levels as specified in the current datasheet and verify that decoupling and filtering meet the recommended design practices to avoid noise and stability issues.
What are the key considerations when integrating the Intel WG82583V SLGVD into a high-speed networking system regarding signal integrity?
Proper PCB layout is essential, including controlled impedance traces for the high-speed I/O pairs, adequate grounding, and minimizing crosstalk. Follow Intel’s reference design recommendations for differential pair routing and placement to maintain signal integrity when deploying the WG82583V SLGVD.
Is the Intel WG82583V SLGVD suitable for industrial environments with extended temperature ranges?
The WG82583V SLGVD is designed for standard commercial environments; for industrial applications, verify the component’s operating temperature specifications, and consider any additional conformal coating or ruggedization measures if required. Long-term reliability can be supported by ensuring proper thermal management.
Can I replace the Intel WG82583V SLGVD with a different Ethernet controller, and what are the implications?
Replacing the WG82583V SLGVD with an alternative requires careful evaluation of pin compatibility, supported features, and driver support. Differences in power consumption, supported protocols, and package size (QFN 831) may influence your design constraints and performance, so select alternatives with compatible form factors and similar electrical characteristics.
What are the primary design constraints related to I/O voltage levels when using the WG82583V SLGVD in a mixed-voltage system?
The WG82583V SLGVD typically interfaces with 3.3V logic levels; ensure that the I/O signals from other subsystems are compatible or use level translation circuitry. Mismatched voltages can cause unreliable communication or damage, so detailed signal compatibility analysis is crucial.
How does the package type (QFN 831) influence the thermal management and layout considerations for the WG82583V SLGVD?
The QFN package offers good thermal conduction if mounted with appropriate heat sinking and beneath-board copper pours. Design your PCB to include adequate thermal vias and ensure proper placement to facilitate heat dissipation, especially in high-throughput networking applications.
Are there any specific clocking or reset configuration requirements for integrating the WG82583V SLGVD into my system?
The controller typically requires a stable clock source as per the datasheet, along with a proper reset sequence. Review the reference circuitry and timing diagrams to implement a robust clock management and reset scheme to ensure reliable initialization and operation.
What are the critical reliability considerations for long-term deployment of the Intel WG82583V SLGVD in industrial or data center environments?
Ensure proper environmental ratings for temperature, humidity, and electrostatic discharge. The device’s longevity depends on stable power, controlled thermal conditions, and proper PCB design to prevent stress on the IC. Regular system testing and adherence to manufacturer recommended operating conditions will enhance reliability.
Is the WG82583V SLGVD suitable for use in low-power or energy-efficient designs?
While the WG82583V SLGVD is optimized for network performance, assess its power consumption profiles under typical loads from the datasheet. For ultra-low-power applications, consider if power management features or alternative low-power Ethernet controllers are more appropriate.
What factors should I consider when migrating from older Ethernet controllers to the Intel WG82583V SLGVD in existing hardware designs?
Evaluate pin compatibility, package dimensions, and interface compatibility. Review electrical characteristics such as voltage levels and supported protocols, as well as driver and firmware support. Transitioning may require redesigning PCB traces and updating driver software to ensure seamless integration.

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