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10AS066K2F35I2SG

In Stock 23 pcs Reference Price(In US Dollars)
3+
$5,802.313
Manufacturer Part Number:
10AS066K2F35I2SG
Manufacturer / Brand
Intel
Part of Description:
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Datasheets:
10AS066K2F35I2SG(1).pdf10AS066K2F35I2SG(2).pdf10AS066K2F35I2SG(3).pdf10AS066K2F35I2SG(4).pdf10AS066K2F35I2SG(5).pdf10AS066K2F35I2SG(6).pdf
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 23 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number 10AS066K2F35I2SG
Manufacturer / Brand Intel
Stock Quantity 23 pcs Stock
Category Integrated Circuits (ICs) > Embedded - System On Chip (SoC)
Description IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Lead Free Status / RoHS Status: RoHS Compliant
Supplier Device Package 1152-FBGA, FC (35x35)
Speed 1.5GHz
Series Arria 10 SX
RAM Size 256KB
Primary Attributes FPGA - 660K Logic Elements
Peripherals DMA, POR, WDT
Package / Case 1152-BBGA, FCBGA
Package Tray
Operating Temperature -40°C ~ 100°C (TJ)
Number of I/O 396
Flash Size -
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Connectivity EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



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10AS066K2F35I2SG Product Details:

The Intel 10AS066K2F35I2SG is a sophisticated System-on-Chip (SoC) integrated circuit that combines the flexibility of FPGA technology with the processing power of ARM-based computing in a single package. This device belongs to Intel's Arria 10 SX series and represents a comprehensive solution for applications requiring both high-performance processing and reconfigurable logic capabilities.

At its core, this SoC features a dual ARM Cortex-A9 MPCore processor with CoreSight debugging capabilities, operating at 1.5GHz to deliver robust computational performance for embedded applications. The device integrates 660K logic elements in its FPGA fabric, providing extensive reconfigurable resources for custom hardware acceleration, signal processing, and protocol implementation. The hybrid MCU-FPGA architecture addresses the critical design challenge of balancing processing flexibility with real-time performance requirements, enabling developers to implement both software-based algorithms and hardware-accelerated functions within a single device.

The SoC incorporates 256KB of on-chip RAM and offers 396 I/O pins through its 1152-FBGA flip-chip package measuring 35x35mm, providing extensive connectivity options for complex system designs. The device supports a comprehensive range of communication interfaces including Ethernet, USB OTG, MMC/SD/SDIO, SPI, UART/USART, I²C, and EBI/EMI, making it suitable for diverse connectivity requirements. Essential peripherals such as DMA controllers, Power-On Reset (POR), and Watchdog Timer (WDT) are integrated to support robust system operation.

The wide operating temperature range of -40°C to 100°C (junction temperature) makes this SoC suitable for industrial and automotive applications where environmental resilience is crucial. The RoHS-compliant design ensures environmental compliance for commercial deployment. The tray packaging format facilitates automated assembly processes in high-volume manufacturing environments.

Primary advantages include the ability to partition system functionality between software running on the ARM cores and custom hardware implementations in the FPGA fabric, enabling optimal performance-power trade-offs. The CoreSight debugging infrastructure provides comprehensive development and debugging capabilities, while the extensive I/O count supports complex multi-interface applications. The combination of processing power and reconfigurable logic makes it particularly valuable for applications requiring real-time signal processing, protocol bridging, or custom acceleration functions.

This SoC finds applications across multiple domains including industrial automation systems, automotive electronics, telecommunications infrastructure, medical devices, aerospace systems, and advanced embedded computing platforms where the combination of ARM processing and FPGA flexibility provides competitive advantages. The device is particularly well-suited for edge computing applications, software-defined radio implementations, and systems requiring custom hardware acceleration alongside traditional software processing.

Equivalent and alternative models include other members of the Intel Arria 10 SX family such as the 10AS048K2F35I2SG 10AS048K2F35I2SG 10AS048K2F35I2SG Intel IC SOC CORTEX-A9 1.5GHZ 1152FBGA 40 and 10AS048K3F35I2SG 10AS048K3F35I2SG 10AS048K3F35I2SG Intel IC SOC CORTEX-A9 1.5GHZ 1152FBGA 27 with different logic element counts, Xilinx Zynq UltraScale+ series devices like the XCZU7EV and XCZU9EG which offer similar ARM+FPGA architectures, Microsemi SmartFusion2 series SoCs including the M2S090 and M2S150 for lower-performance applications, and Lattice FPGAs with embedded processors such as the CrossLink-NX series, though these alternatives may differ in processing power, FPGA capacity, I/O count, and specific feature sets depending on the target application requirements.

10AS066K2F35I2SG Image
10AS066K2F35I2SG (1)

10AS066K2F35I2SG Key Technical Attributes

Architecture: Dual ARM Cortex-A9 MPCore with CoreSight

FPGA Logic Elements: 660K

Speed: 1.5GHz

RAM Size: 256KB

Number of I/O: 396

10AS066K2F35I2SG Packing Size

This product is packaged in a 1152-FBGA (Fine-Pitch Ball Grid Array) format, specifically 35x35 mm, offering high density and reliable connections. The FBGA, FCBGA package type ensures optimal electrical and thermal performance, suitable for advanced embedded applications. Tray packaging ensures safe transport and handling, supporting bulk manufacturing processes.

10AS066K2F35I2SG Application

Ideal for high-performance embedded computing, this device is commonly used in telecommunications, data centers, automation systems, defense and aerospace electronics, industrial controls, and sophisticated networking solutions. The integration of MCU and FPGA fabric makes it an excellent choice for applications requiring high flexibility, real-time processing, and extensive connectivity, such as signal processing and complex I/O management.

10AS066K2F35I2SG Features

The 10AS066K2F35I2SG offers an advanced feature set including a dual-core ARM Cortex-A9 MPCore architecture with CoreSight debug support, operating at speeds up to 1.5GHz. With 660K FPGA logic elements and a comprehensive set of peripherals (DMA, Power-On Reset, Watchdog Timer), it offers robust expandability for complex designs. Memory interfaces like EBI/EMI and MMC/SD/SDIO provide broad memory and storage fusion, while connectivity options—Ethernet, SPI, USB OTG, and UART/USART—enable seamless integration with other systems. The device supports versatile I/O with 396 dedicated pins, facilitating intricate interfacing and high-bandwidth data transfer. Excellent thermal characteristics allow operation from -40°C to 100°C (TJ), making it suited for demanding environments. FPGA architecture within the Arria 10 SX series delivers high logic density for custom, high-speed signal processing.

10AS066K2F35I2SG Quality and Safety Features

As an RoHS-compliant product, this SoC meets the latest environmental and safety standards, ensuring restriction of hazardous substances and safeguarding user and end-product safety. The robust package design minimizes ESD and mechanical risks during handling. Additionally, integrated peripherals such as the Watchdog Timer contribute to system reliability by ensuring fault recovery in critical operations.

10AS066K2F35I2SG Compatibility

The 10AS066K2F35I2SG is highly compatible with a wide range of embedded platforms, development tools from Intel (Altera), and third-party software and hardware ecosystems. It can be easily integrated into legacy and new system designs that require ARM-based processing combined with high-density programmable logic. Its broad connectivity options also enhance compatibility with various communication protocols and peripheral devices.

10AS066K2F35I2SG Datasheet PDF

For comprehensive product specifications, design guidelines, and reference material, we offer the most authoritative and up-to-date datasheet PDF for the 10AS066K2F35I2SG directly on this page. We highly recommend downloading the datasheet to gain deeper insights into all aspects of this model, ensuring optimum design integration and performance.

Quality Distributor

IC-Components is a premium distributor of Intel and Arria 10 SX series components. We are committed to providing genuine, high-quality integrated circuits with exceptional service and reliability. For the best prices, rapid quotes, and industry-leading support, we invite you to request a quote for the 10AS066K2F35I2SG directly on our website today!

Frequently Asked Questions

What are the key considerations for integrating the Intel 10AS066K2F35I2SG SoC into a high-temperature industrial environment below -40°C?
The Intel 10AS066K2F35I2SG is specified to operate between -40°C and 100°C (TJ), making it suitable for industrial applications requiring wide temperature ranges. Ensure proper thermal management, including adequate heat sinking and airflow, to maintain reliable operation at the lower temperature limit. Also, verify that your power supply and peripheral components support these temperature conditions and that the PCB layout minimizes thermal gradients to prevent stress-related failures.
How does the 1152-FBGA package size of the 10AS066K2F35I2SG impact PCB design and assembly processes?
The 1152-FBGA (35x35mm) package requires precise PCB pad design, including controlled-impedance routing and sufficient via annular ring size to accommodate reliable connections. During assembly, careful handling is needed to prevent damage to the fine-pitch balls. Incorporate appropriate stencil design for reflow soldering and consider using AOI (Automated Optical Inspection) to verify solder joints for high reliability.
When replacing or migrating from a previous SoC to the Intel 10AS066K2F35I2SG, what are the main design-in considerations?
Migration requires evaluating differences in I/O voltage levels, package footprint, and peripheral interfaces. The 10AS066K2F35I2SG features 396 I/O lines, so confirm that your PCB layout can handle the increased I/O count if applicable. Also, review the power supply requirements, clock compatibility, and peripheral support to ensure seamless integration. Compatibility of peripherals—such as Ethernet, UART, USB OTG—must be validated to prevent functional discrepancies.
What are the best practices for ensuring reliable operation of the 10AS066K2F35I2SG in long-term industrial deployments?
Maintain stable power supplies with proper filtering and decoupling capacitors. Use conformal coating or sealing methods to protect against humidity, dust, and chemical exposure. Design for thermal robustness, including adequate heat dissipation and temperature monitoring. Additionally, implement comprehensive system-level testing and include watchdog timers to recover from potential hangs or faults during extended operation.
Can the 10AS066K2F35I2SG support overclocking beyond its specified 1.5GHz speed, and what are the risks?
While some users may attempt to operate the Cortex-A9 at frequencies above 1.5GHz, it is not recommended unless thoroughly validated. Overclocking can lead to increased thermal stress, potential data corruption, decreased reliability, and voiding of warranty. For critical applications, adhere to the specified maximum operating frequency and ensure sufficient cooling and system stability measures are in place.
How should I approach power supply design to support the 10AS066K2F35I2SG with its 1.5GHz dual-core ARM Cortex-A9 processor?
Use low-noise, well-regulated power sources tailored to the device’s voltage requirements. The solution should include dedicated VRMs with adequate transient response, multiple decoupling capacitors near the IC, and proper grounding strategies to minimize noise coupling. Pay special attention to power sequencing to meet startup requirements, and include adjustable voltage regulators if optional voltage scaling is needed.
What are the key considerations for configuring and programming the complex peripherals (Ethernet, USB OTG, SPI, UART) on the 10AS066K2F35I2SG during system initialization?
Ensure that the peripheral interfaces are correctly configured according to your system’s communication protocols, including proper clock enablement, pin multiplexing, and reset sequences. Use the Intel SDK or appropriate firmware tools to load initial configuration and verify peripheral functionality during early system boot. Additionally, account for potential conflicts with other I/O functions and ensure proper pin assignments during PCB design.
Is the 10AS066K2F35I2SG suitable for use in applications requiring extensive FPGA logic, given its 660K logic elements?
Yes, the device's FPGA component with 660K logic elements makes it suitable for complex logic functions, IP cores, and high-bandwidth data processing. When designing for such applications, ensure that the FPGA fabric is properly partitioned and that power delivery is sufficient to handle dynamic switching currents. Also, consider signal integrity issues when routing high-speed or sensitive signals to prevent data corruption.
How does the combination of embedded ARM Cortex-A9 cores and FPGA logic elements in the 10AS066K2F35I2SG influence system-level design decisions?
This integration provides a flexible platform for combining software execution with hardware acceleration. Design your system to efficiently partition tasks between the processor and FPGA fabric—for example, offloading signal processing or data encoding tasks to the FPGA. Pay attention to synchronization mechanisms, interfacelink bandwidth, and shared resource management to optimize performance and power consumption.
What environmental and reliability factors should I consider when deploying the 10AS066K2F35I2SG in mission-critical systems?
Consider the device's specified operating temperature range, ensuring ambient conditions are within limits. Implement redundancy or watchdog timer mechanisms to recover from unexpected faults. Use protective circuit elements such as ESD protection, TVS diodes, and proper grounding. Regular system maintenance and monitoring of temperature, voltage, and operational parameters help ensure long-term reliability in critical applications.
What troubleshooting approaches are recommended if the 10AS066K2F35I2SG fails to initialize or exhibits intermittent operation?
First, verify power supply stability and check power-up sequencing. Confirm that all peripheral signals are correctly configured and that I/O voltages match intended levels. Use oscilloscopes and logic analyzers to monitor clock and data signals, looking for signal integrity issues. Inspect PCB solder joints with AOI, and replace the device if physical damage or suspect soldering is detected. Review configuration files and firmware for errors.
How can I optimize the thermal design when incorporating the 10AS066K2F35I2SG in a densely populated PCB with high processing demands?
Incorporate adequate heatsinking, thermal vias, and airflow pathways to dissipate heat effectively. Use thermal interface materials between the device and heatsinks. Perform thermal simulations during design to identify hotspots. Keep high-power components away from sensitive circuitry and ensure that the PCB layout minimizes thermal gradients, which helps prevent stress and failure over time.

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