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Home > Products > Integrated Circuits (ICs) > Specialized ICs > SP1485EEN
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SP1485EEN

Manufacturer Part Number:
SP1485EEN
Manufacturer / Brand
R
Part of Description:
SP1485EEN 原装 SOP
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 16670 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP1485EEN
Manufacturer / Brand R
Stock Quantity 16670 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description SP1485EEN 原装 SOP
Lead Free Status / RoHS Status: RoHS Compliant
RFQ SP1485EEN Datasheets SP1485EEN Details PDF
SP1485EEN Details PDF for FR.pdf
SP1485EEN Details PDF for KR.pdf
SP1485EEN Details PDF for IT.pdf
SP1485EEN Details PDF for ES.pdf
SP1485EEN Details PDF for DE.pdf
Package SOP
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the SP1485EEN be used in a 3.3V RS-232 transceiver application without level-shifting concerns, and what are the implications for logic signal compatibility with TTL or CMOS input stages?
The SP1485EEN operates from a single +3V to +5.5V supply, making it suitable for 3.3V systems; however, its output swing is limited to ±5V, which exceeds typical TTL/CMOS thresholds but may require clamping or voltage divider networks when interfacing directly with low-voltage inputs to prevent overshoot or latch-up.
What is the minimum recommended load capacitance for reliable operation of the SP1485EEN, and how does this affect PCB layout decisions when using long traces or external capacitors?
The SP1485EEN requires a minimum load capacitance of 0.1µF on each output pin to ensure stable oscillation; exceeding this value up to the specified maximum of 1µF is acceptable, but parasitic inductance from trace routing can destabilize the oscillator unless bypass capacitors are placed close to the device pins.
Is the SP1485EEN compatible with battery-powered designs where power sequencing involves partial power-up states, and does reverse polarity protection need to be implemented externally?
The SP1485EEN lacks built-in reverse polarity protection and operates only within its regulated supply range; thus, external diodes or dedicated protection circuits are required if the input voltage could fall below ground or experience transient negatives during hot-plug events.
When replacing legacy MAX232-based designs with the SP1485EEN, what critical design changes must be made regarding charge pump capacitor values and their impact on startup time and EMI?
Unlike the MAX232, the SP1485EEN uses internal charge pumps that require only ceramic capacitors in the 0.1µF range; however, using mismatched or low-Q capacitors can increase start-up delay and degrade ESD performance, necessitating careful selection of X7R/X5R dielectrics rated for the operating voltage.
Can the SP1485EEN drive multiple RS-232 receivers simultaneously without degradation of signal integrity, and what termination strategies should be considered for multi-drop configurations?
The SP1485EEN can source/sink up to 1mA per channel, which limits fan-out to one standard RS-232 receiver (typically requiring 3–5mA); therefore, driving multiple loads requires external buffers or consideration of reduced baud rates to maintain voltage levels above receiver thresholds.
How does temperature drift affect the output voltage accuracy of the SP1485EEN over an industrial -40°C to +85°C range, and does this impact communication reliability in harsh environments?
Output swing variation due to temperature is typically within ±10% across -40°C to +85°C, which remains sufficient for most RS-232 specifications since receivers tolerate wide input ranges; however, marginal margins near threshold voltages may cause data errors at high baud rates without proper noise filtering.
What precautions should be taken when integrating the SP1485EEN into a microcontroller UART system with automatic flow control (RTS/CTS), especially regarding driver enable timing and handshake signal delays?
Since the SP1485EEN has separate Tx and Rx lines, RTS/CTS signals must be mapped correctly between host and peripheral, and enable/disable transitions should include dead-time insertion to avoid bus contention; additionally, enabling the driver too early may cause glitches during power-up unless soft-start sequencing is applied.
Are there any known issues with using the SP1485EEN in automotive-grade applications, particularly concerning AEC-Q100 compliance and long-term reliability under vibration and thermal cycling?
The SP1485EEN is not qualified to AEC-Q100 standards; while it functions reliably in many industrial settings, automotive environments demanding extended life cycles, vibration resistance, and strict failure criteria should consider alternative components with certified ruggedness or implement redundant error detection schemes.
Can the SP1485EEN operate reliably in systems with noisy power rails or unregulated supplies, and what input filtering is necessary to prevent false triggering or oscillation instability?
The device includes basic power-on reset functionality, but sustained noise above 100mVpp on VCC can disrupt charge pump regulation; therefore, a π-filter (LC or RC) with adequate decoupling near the IC is strongly recommended for systems with poor line regulation or switching noise sources.
When migrating from discrete transistor-based RS-232 drivers to the SP1485EEN, what footprint and pinout considerations arise due to its SOT23-6 package, and how does soldering profile affect yield in mass production?
The SP1485EEN’s SOT23-6 footprint matches common SOIC adapters, but pad geometry differs slightly from standard footprints; reflow profiles must stay within JEDEC J-STD-020 limits (<260°C peak, <30 seconds dwell) to avoid solder joint cracking, especially under thermal stress in compact assemblies.

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SP1485EEN

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SP1485EEN 原装 SOP

In Stock: 16670

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