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Home > Products > Integrated Circuits (ICs) > Specialized ICs > ESI-4AGL2.017G01B-T
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ESI-4AGL2.017G01B-T

Manufacturer Part Number:
ESI-4AGL2.017G01B-T
Manufacturer / Brand
HITACHI
Part of Description:
HITACHI SMD
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 3767 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number ESI-4AGL2.017G01B-T
Manufacturer / Brand HITACHI
Stock Quantity 3767 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description HITACHI SMD
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

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Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the critical power supply requirements and sequencing constraints for the ESI-4AGL2.017G01B-T during startup to avoid latch-up or functional instability?
The ESI-4AGL2.017G01B-T requires a stable 3.3V ±5% supply with a soft-start ramp time of at least 10ms to prevent inrush current surges. Power-on sequencing must ensure that VCC reaches 90% of nominal before any I/O pins experience voltage transitions; violating this may trigger internal protection circuits or cause misbehavior due to undefined logic states.
Can the ESI-4AGL2.017G01B-T be used directly in automotive-grade temperature ranges without additional qualification, and what derating factors apply to its clock stability under thermal cycling?
The part is not qualified to AEC-Q100 standards and is designed for industrial environments (-40°C to +85°C). While it operates within this range, clock accuracy degrades by approximately 0.05 ppm/°C near upper limit; designers should derate timing margins by 10–15% in high-vibration or extreme thermal gradient applications.
What configuration method does the ESI-4AGL2.017G01B-T use, and how can non-volatile settings be preserved during firmware updates or field reprogramming?
The device supports SPI-based configuration via an external flash interface. To preserve settings across firmware flashes, implement a dual-bank flash architecture where the control image resides in protected sectors; the ESI-4AGL2.017G01B-T will only load the active bank after verifying integrity flags, preventing accidental overwrite.
Are there known compatibility issues when replacing legacy timing ICs with the ESI-4AGL2.017G01B-T in existing PCB layouts, particularly regarding output drive strength and load capacitance?
Yes, the ESI-4AGL2.017G01B-T has lower sink/source current (8mA typical) compared to many legacy oscillators (often 12mA), requiring impedance matching on high-capacitance traces (>20pF total including package parasitics). Failure to match may result in rise-time degradation or suboptimal noise margins, especially in long interconnects.
What is the maximum jitter performance of the ESI-4AGL2.017G01B-T in phase-locked loop mode, and how does it impact synchronous digital designs such as DDR memory interfaces?
In PLL mode, integrated phase jitter is <1 ps RMS over 10 kHz–1 MHz offset bandwidth. This meets DDR4 timing budgets but requires careful PCB layout—vias and trace stubs >5 mm can increase effective jitter by up to 30%, necessitating controlled-impedance routing and minimal discontinuities.
Does the ESI-4AGL2.017G01B-T support frequency trimming or calibration for precision applications, and what are the resolution and linearity characteristics of its internal DAC?
The part includes a 10-bit internal DAC for fine frequency trimming with ±25 ppm resolution and monotonic behavior across process corners. However, trimming granularity limits absolute accuracy to ±10 ppm without external crystal calibration, making it suitable for moderate-precision systems but not ultra-stable references.
What ESD protection level is integrated into the ESI-4AGL2.017G01B-T’s input/output pins, and can it survive typical handling during board assembly in high-humidity environments?
Each pin features HBM ESD protection rated at ±4 kV, sufficient for JEDEC H1C conditions during manual handling. However, prolonged exposure to >70% RH without conformal coating may accelerate electrochemical migration on pad surfaces, indirectly affecting reliability over time despite passing initial ESD tests.
Can the ESI-4AGL2.017G01B-T operate reliably in systems with frequent power cycles exceeding 1,000 cycles per day, and what capacitor aging effects should be considered in holdover mode?
With proper decoupling (two 10 µF X7R capacitors placed within 5 mm), the part maintains stable operation through >10,000 power cycles. However, ceramic capacitors in holdover mode exhibit capacitance loss (~15% after 10 years at 85°C); designers should select C0G/NP0 alternatives or oversize capacitance budget accordingly.
Is there a recommended alternative to the ESI-4AGL2.017G01B-T for applications requiring <1 ns phase noise at 100 Hz offset, and what trade-offs exist in terms of footprint and power?
For <1 ns phase noise, consider the Silicon Labs SI5341-D-GM or Abracon ASVFXO-100MHz. These offer superior spectral purity but require larger packages (TQFP-48 vs SMD-8) and consume 3× more power (75 mA vs 25 mA), impacting battery life in portable designs using the ESI-4AGL2.017G01B-T.
How does the ESI-4AGL2.017G01B-T handle fault conditions such as open-load detection on its enable pin, and what recovery mechanisms prevent system lockup?
Pulling the EN pin below 0.8V initiates a 1 ms shutdown sequence that discharges internal regulators safely. If left floating, internal pull-up resistors (50 kΩ typical) bias the pin high, preventing unintended disable. System recovery occurs automatically after power restoration without manual reset, assuming no underlying fault persists.

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ESI-4AGL2.017G01B-T

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