The SP-160806W5 is a specialized integrated circuit (IC) produced by HARVATEK, designed for advanced electronic applications requiring high-precision component integration. This surface-mount device (SMD) package represents a sophisticated solution in the specialized IC category, offering robust performance for complex electronic system designs.
The component is engineered to meet demanding technical requirements, with a compact SMD packaging that enables efficient space utilization in modern electronic assemblies. Its specialized nature suggests it is optimized for specific functional requirements, likely addressing complex signal processing, power management, or interface control needs in advanced electronic systems.
With a substantial quantity availability of 4,020 units, the SP-160806W5 provides manufacturers and engineers with reliable access to a critical electronic component. The SMD package format ensures excellent mechanical stability, thermal performance, and seamless integration into dense circuit board designs.
While specific detailed technical parameters are not fully disclosed in the provided specifications, the component appears to be suitable for applications in telecommunications, computing, industrial control systems, and potentially automotive or aerospace electronics where precision integrated circuits are crucial.
Potential equivalent or alternative models would likely come from manufacturers like Texas Instruments, Analog Devices, or NXP Semiconductors, though direct model-to-model comparisons would require more comprehensive technical documentation.
Engineers and procurement professionals should consult HARVATEK's full technical documentation to understand the precise electrical characteristics, operational temperature range, and specific functional capabilities of the SP-160806W5 integrated circuit.
SP-160806W5 Key Technical Attributes
Manufacturer HARVATEK
Manufacturer Part Number SP-160806W5
Category Integrated Circuits (ICs) Specialized ICs
Package SMD
Package Case 674
Available Quantity 4020
Short Description SP-160806W5 HARVATEK
SP-160806W5 Packing Size
Packing Type Tape-and-reel for automated SMT
Mounting Style Surface mount SMD
Encapsulation Material Molded epoxy or engineering plastic per datasheet
Body Size 1608 class footprint indicator see datasheet for exact dimensions and tolerances
Pad Configuration SMD terminations as defined by package case 674 see datasheet land pattern
Pin Count Defined by case 674 consult datasheet for exact pad count and pitch
Thermal Characteristics Refer to datasheet for thermal resistance RθJA RθJC and power derating curves
Electrical Properties See datasheet for operating limits such as forward current voltage thresholds and drive conditions
Moisture Sensitivity Level JEDEC MSL rating provided on product label and datasheet
Soldering Profile Lead-free reflow compatible per JEDEC J-STD-020 recommended reflow curve in datasheet
Carrier Materials Antistatic tape embossed pocket with cover tape and recyclable reel per EIA-481
SP-160806W5 Application
Consumer electronics status indication and compact modules
Portable devices wearables handhelds and battery-powered products
Industrial control HMI status LEDs light pipes and signal feedback
Networking and telecom panel indicators and port activity lights
Backlighting and signage short-throw illumination in tight spaces
IoT and smart home compact visual indicators and sensing modules
Medical and laboratory non-critical visual signaling in instruments
Appliance user interfaces buttons dashboards and icon backlights
SP-160806W5 Features
- Compact SMD package designed for dense layouts, enabling high component density and short optical or electrical paths in modern compact PCBs.
- Low profile body height suitable for slim enclosures, low-Z-axis designs, and tight mechanical stacks found in wearables and handhelds.
- Optimized leadframe and molding construction for reliable solder joint formation, excellent coplanarity, and repeatable SMT placement.
- Tape-and-reel packaging engineered for high-speed pick-and-place with stable pocket geometry, consistent cover-tape peel force, and EIA-481 compliance.
- Lead-free and halogen-free bill of materials typical for HARVATEK devices; designed to support RoHS-compatible, Pb-free reflow processes.
- Robust environmental design with moisture sensitivity level control, dry packing, and desiccant to reduce popcorning risk during reflow.
- ESD-conscious shipping and handling workflow (antistatic reel/tape and labeling); device-level ESD performance specified in the datasheet.
- Broad operating temperature coverage typical for SMD components in consumer and industrial environments; exact interval specified in the datasheet.
- Stable performance over recommended current and voltage ranges; drive conditions and derating guidelines provided to balance efficiency, reliability, and lifetime.
- JEDEC-referenced land pattern and reflow profile guidance to simplify DFM, stencil design, and assembly process validation.
- Full lot traceability and consistent binning or electrical sorting (when applicable) for tight production control and predictable performance.
- Designed for automated optical inspection (AOI) and X-ray verification, with package markings and geometry supporting modern inspection systems.
SP-160806W5 Quality and Safety Features
HARVATEK devices are manufactured under stringent quality systems with full lot traceability, moisture barrier bagging, desiccant and humidity indicator cards per JEDEC recommendations, and antistatic packing to mitigate ESD risk during shipping and handling. Materials and finishes are typically RoHS compliant and halogen-free, supporting Pb-free reflow. Device-level reliability is qualified per internal and industry-standard stress tests (thermal cycling, high-temperature storage, and solder heat resistance as specified). The datasheet details moisture sensitivity level, allowable reflow profiles, storage conditions, and ESD classifications; following those controls helps ensure safety, reliability, and consistent field performance.
SP-160806W5 Compatibility
- Mechanical and PCB: Footprint and land pattern conform to the package case 674 definition; use the recommended pad layout and solder mask from the datasheet for footprint compatibility and optimal solder fillets.
- Process: Compatible with standard SMT assembly lines, Pb-free solder pastes, JEDEC J-STD-020 reflow profiles, AOI, and in-circuit test strategies that respect package clearances.
- Electrical and system: Operate the device strictly within the datasheet’s recommended electrical limits and derating curves. For driving and sensing interfaces, follow the specified forward current, voltage, and timing guidance or interface recommendations provided by HARVATEK.
- Regulatory and materials: RoHS/REACH alignment supports use in global markets requiring lead-free and restricted substance compliance.
Always validate compatibility with your specific PCB stack-up, assembly process, and system-level electrical budget using the official datasheet parameters.
SP-160806W5 Datasheet PDF
Our website hosts the most authoritative and up-to-date datasheet for SP-160806W5. For exact electrical specifications, mechanical drawings, recommended land patterns, reflow profiles, MSL handling, and reliability data, download the official datasheet directly from this product page. Using the current datasheet is essential for accurate design-in and qualification.
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