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SP1233-01ETG

In Stock 267994 pcs Reference Price(In US Dollars)
5+
$0.1144
50+
$0.1009
150+
$0.0952
500+
$0.0879
2500+
$0.0847
5000+
$0.0828
Manufacturer Part Number:
SP1233-01ETG
Manufacturer / Brand
Littelfuse Inc.
Part of Description:
TVS DIODE 20A SOD882
Datasheets:
SP1233-01ETG(1).pdfSP1233-01ETG(2).pdf
Lead Free Status / RoHS Status:
ROHS3 Compliant
Stock Condition:
New original, 267994 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

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Part Number SP1233-01ETG
Manufacturer / Brand Littelfuse Inc.
Stock Quantity 267994 pcs Stock
Category Circuit Protection > Transient Voltage Suppressors (TVS) - TVS Diodes
Description TVS DIODE 20A SOD882
Lead Free Status / RoHS Status: ROHS3 Compliant
Voltage - Reverse Standoff (Typ) 3.3V (Max)
Voltage - Clamping (Max) @ Ipp 8.5V (Typ)
Voltage - Breakdown (Min) 4.2V (Typ)
Type Zener
Supplier Device Package SOD-882
Series Automotive, AEC-Q101, SP1220, SPA®
Power Line Protection No
Power - Peak Pulse 180W
Package / Case SOD-882
Package Tape & Reel (TR)
Operating Temperature -40°C ~ 125°C
Mounting Type Surface Mount
Current - Peak Pulse (10/1000µs) 20A (8/20µs)
Capacitance @ Frequency 35pF @ 1MHz
Bidirectional Channels 1
Applications Automotive

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges: (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

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PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

How does the 35pF capacitance of the SP1233-01ETG affect signal integrity when placed on high-speed interfaces near 3.3V logic lines?
The SP1233-01ETG bidirectional TVS diode exhibits approximately 35pF capacitance at 1MHz, which introduces a low-pass filtering effect on the protected line. In design-in scenarios involving data rates above several hundred Mbps, engineers should evaluate the resulting rise time degradation and eye diagram closure; shorter trace lengths from the SP1233-01ETG to the protected pin and careful impedance matching help minimize reflections and maintain acceptable signal quality.
What power supply or I/O voltage conditions allow safe integration of the SP1233-01ETG without triggering unwanted clamping during normal operation?
With a maximum reverse standoff voltage of 3.3V and typical breakdown starting at 4.2V, the SP1233-01ETG remains in a high-impedance state for 3.3V nominal rails that stay below the breakdown threshold across the full -40°C to 125°C range. Designers must account for supply tolerances, overshoot during switching, and temperature-induced shifts in breakdown voltage to ensure the diode does not conduct under steady-state conditions.
Can the SP1233-01ETG be used to replace a similar 3.3V bidirectional TVS in an existing SOD-882 footprint during a component obsolescence event?
The SP1233-01ETG maintains pin-to-pin compatibility with many other SOD-882 packaged 3.3V bidirectional TVS devices while delivering a typical 8.5V clamp at 20A (8/20µs). Migration requires verifying that the slightly different dynamic resistance and capacitance profile do not alter the previous clamping behavior or introduce additional signal distortion in the target circuit.
In what application scenarios does the 20A (8/20µs) surge rating of the SP1233-01ETG become a limiting factor for protection design?
The SP1233-01ETG handles peak pulse currents up to 20A for an 8/20µs waveform, making it suitable for moderate ESD and surge events on 3.3V lines in instrumentation or peripheral interfaces. For environments with frequent higher-energy transients or longer duration surges, multiple devices in parallel or a higher-rated TVS may be required to stay within the single-pulse energy limits.
How should layout and placement of the SP1233-01ETG be approached to optimize transient current paths in a dense PCB design?
Placing the SP1233-01ETG as close as possible to the connector or exposed trace entry point minimizes the inductive loop area for transient currents. The SOD-882 package of the SP1233-01ETG allows tight integration, but vias and return paths to ground must be low-inductance to keep the effective clamping voltage seen by the protected IC as close as possible to the datasheet 8.5V typical value.
Is the SP1233-01ETG appropriate for long-term deployment in automotive or industrial systems exposed to wide temperature swings and repetitive transients?
The SP1233-01ETG carries AEC-Q101: qualification and supports an operating temperature range of -40°C to 125°C. Under repetitive ESD or surge stress, the avalanche technology maintains performance without progressive degradation within its rated limits, allowing sustained protection in automotive-grade or industrial environments when peak currents and energy remain within the 180W peak pulse power envelope.
What considerations arise when evaluating the SP1233-01ETG against lower-capacitance alternatives for USB 2.0 or similar mid-speed data lines?
While the SP1233-01ETG provides robust 20A surge handling and an 8.5V clamp level, its 35pF capacitance is higher than ultra-low capacitance TVS options. Engineers protecting USB 2.0 or comparable interfaces should compare the resulting bandwidth limitation against the required surge robustness; in cases where signal integrity margins are tight, a lower-capacitance device may be traded for reduced current-handling capability.
During thermal cycling or extended high-temperature operation, what behavior of the SP1233-01ETG leakage current should designers monitor?
Reverse leakage current of the SP1233-01ETG remains low at nominal 3.3V standoff across its temperature range. At elevated temperatures approaching 125°C, leakage increases predictably per silicon avalanche characteristics; system-level designs should ensure this does not exceed the input leakage budget of connected MCUs or interfaces under worst-case conditions.
When migrating from a unidirectional TVS to the bidirectional SP1233-01ETG on a 3.3V differential or AC-coupled signal, what design adjustments are typically needed?
The bidirectional nature of the SP1233-01ETG clamps both positive and negative excursions symmetrically around ground. On differential pairs or signals that swing below ground reference, this eliminates the need for separate positive and negative protection paths, but the effective clamping voltage relative to the signal common mode must be re-verified to protect sensitive receiver inputs.
For high-reliability applications requiring PPAP or extended qualification, how does the automotive grading of the SP1233-01ETG influence component selection?
The AEC-Q101: qualification and RoHS3 compliance of the SP1233-01ETG streamline PPAP documentation and reliability demonstrations in automotive-adjacent or industrial projects. This grading reflects controlled manufacturing and testing that supports consistent performance under thermal, mechanical, and electrical stress, reducing uncertainties during long-term field deployment.

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