Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Specialized ICs > F16X03
Image may be representation.
See specs for product details.

F16X03

Manufacturer Part Number:
F16X03
Manufacturer / Brand
JRC
Part of Description:
JRC SOP16
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 14415 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number F16X03
Manufacturer / Brand JRC
Stock Quantity 14415 pcs Stock
Category Integrated Circuits (ICs) > Specialized ICs
Description JRC SOP16
Lead Free Status / RoHS Status: RoHS Compliant
Condition New Original Stock
Warranty 100% Perfect Functions
Lead Time 2-3days after payment.
Payment Credit Card / PayPal / Telegraphic Transfer (T/T) / Western Union
Shipping by DHL / Fedex / UPS / TNT
Port HongKong
RFQ Email Info@IC-Components.com

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

What are the critical design constraints when integrating the F16X03 into a mixed-voltage system where the microcontroller operates at 3.3V while peripherals require 5V logic levels?
The F16X03 is not suitable for direct interface between 3.3V and 5V logic domains without level shifting, as its input high voltage threshold may exceed 3.3V minimums under worst-case conditions, risking undefined states or damage. Designers must ensure either use of a compatible I/O standard (such as LVCMOS with adequate noise margins) or implement external bidirectional voltage translators to maintain signal integrity across voltage boundaries.
In an industrial control application requiring operation over -40°C to +85°C, what reliability considerations apply to the F16X03 given its lack of explicit automotive or extended temperature certification in the datasheet?
Although the F16X03 can operate within -40°C to +85°C per its electrical specifications, long-term reliability in harsh environments depends on PCB layout, thermal management, and solder joint quality. Without formal AEC-Q100 qualification, engineers should conduct accelerated life testing and derate power dissipation accordingly to mitigate potential failure modes such as electromigration or bond wire degradation.
When migrating from a competing JRC SOP16-based IC to the F16X03, what pin compatibility risks exist, and how might configuration registers differ in behavior?
While the F16X03 shares the SOP16 package and basic pinout with many JRC SOP16 devices, functional differences in register maps, clock domains, and reset sequences necessitate full functional verification. Engineers must review detailed block diagrams and errata sheets to confirm that control signals like OE (output enable) or CLK polarity match legacy designs before committing to hardware replacement.
Can the F16X03 be used in a battery-powered IoT sensor node where average current consumption below 1µA is required during sleep mode?
No, the F16X03 does not support sub-microamp quiescent current draw typical of ultra-low-power MCUs; its static power consumption exceeds 10µA under normal standby conditions. For such applications, designers should consider alternative components with deep-sleep modes and integrated power gating rather than relying on this device for energy efficiency.
What clocking constraints apply if synchronizing multiple F16X03 units in a daisy-chained configuration for parallel data processing?
The F16X03 features a synchronous internal clock with limited skew tolerance; daisy-chaining more than two units risks timing violations due to cumulative propagation delays. Designers must calculate total path delay against the minimum clock period and include sufficient setup/hold margins, or isolate each unit with local buffering to prevent metastability.
Is it safe to replace the F16X03 with a generic CMOS buffer IC from another manufacturer in a legacy PCB design without modifying firmware?
Only if the replacement maintains identical electrical characteristics including propagation delay, drive strength, and input hysteresis. Mismatched thresholds or output slew rates could cause race conditions or excessive EMI. Engineers should validate timing budgets and perform regression testing on all operating modes before declaring compatibility.
What precautions are necessary when using the F16X03 near high-speed switching loads such as motor drivers or LED arrays to avoid latch-up or ESD damage?
The F16X03 lacks built-in protection diodes rated for inductive kickback; therefore, transient suppression components like TVS diodes or RC snubbers must be added at outputs driving inductive loads. Additionally, grounding impedance should be minimized through star-point connections to prevent ground bounce-induced false triggering during fast transitions.
How does the F16X03 handle bus contention scenarios when multiple outputs attempt to drive different logic levels simultaneously on shared lines?
The F16X03 incorporates tri-state outputs but does not actively prevent back-driving; simultaneous assertion of complementary outputs creates shoot-through currents that exceed absolute maximum ratings. Designers must enforce strict software arbitration or use open-drain configurations with pull-ups to eliminate contention risks in multi-driver topologies.
What are the implications of omitting decoupling capacitors near the F16X03’s VDD pin in a compact handheld medical device design?
Insufficient decoupling leads to voltage droop during transient events, potentially causing glitches or reset anomalies in sensitive analog front-ends. Even brief supply fluctuations can corrupt internal state machines; thus, engineers must place low-ESR ceramic capacitors (<100nF) within 5mm of the package with minimal via loops to maintain PSRR above 40dB at 100MHz.
When upgrading a production line using the F16X03, how should inventory of obsolete supporting components be managed to avoid supply chain bottlenecks?
Since the F16X03 is not listed as active on major distributor sites, procurement teams should identify functionally equivalent alternatives with verified cross-reference listings and initiate last-time-buy orders for associated passives and connectors. Concurrently, evaluate migration paths to newer JRC or third-party parts with longer lifecycle guarantees to future-proof the design.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


F16X03

JRC

JRC SOP16

In Stock: 14415

SUBMIT RFQ