Choose your country or region.

EnglishFrançaispolskiSlovenija한국의DeutschSvenskaSlovenskáMagyarországItaliaहिंदीрусскийTiếng ViệtSuomiespañolKongeriketPortuguêsภาษาไทยБългарски езикromânescČeštinaGaeilgeעִבְרִיתالعربيةPilipinoDanskMelayuIndonesiaHrvatskaفارسیNederlandTürk diliΕλλάδαRepublika e ShqipërisëአማርኛAzərbaycanEesti VabariikEuskeraБеларусьíslenskaBosnaAfrikaansIsiXhosaisiZuluCambodiaსაქართველოҚазақшаAyitiHausaКыргыз тилиGalegoCatalàCorsaKurdîLatviešuພາສາລາວlietuviųLëtzebuergeschmalaɡasʲМакедонскиMaoriМонголулсবাংলা ভাষারမြန်မာनेपालीپښتوChicheŵaCрпскиSesothoසිංහලKiswahiliТоҷикӣاردوУкраїнаO'zbekગુજરાતીಕನ್ನಡkannaḍaதமிழ் மொழி繁体中文
Home > Products > Integrated Circuits (ICs) > Embedded - Microprocessors > MPC8378EVRAJFA
Image may be representation.
See specs for product details.

MPC8378EVRAJFA

In Stock 559 pcs Reference Price(In US Dollars)
5+
$68.4164
Manufacturer Part Number:
MPC8378EVRAJFA
Manufacturer / Brand
Freescale Semiconductor
Part of Description:
POWERQUICC 32 BIT POWER ARCH SOC
Datasheets:
Lead Free Status / RoHS Status:
RoHS Compliant
Stock Condition:
New original, 559 pcs Stock Available.
ECAD Model:
Ship From:
Hong Kong
Shipment Way:
DHL/Fedex/TNT/UPS

Inquiry Online

Please complete all required fields with your contact information.Click "SUBMIT REQUEST" we will contact you shortly by email. Or Email us: Info@IC-Components.com
Part Number
Manufacturer
Require Quantity
Target Price(USD)
Company Name
Contact Name
E-mail
Phone
Message
Please enter Verify Code and click "Submit"
Part Number MPC8378EVRAJFA
Manufacturer / Brand Freescale Semiconductor
Stock Quantity 559 pcs Stock
Category Integrated Circuits (ICs) > Embedded - Microprocessors
Description POWERQUICC 32 BIT POWER ARCH SOC
Lead Free Status / RoHS Status: RoHS Compliant
Voltage - I/O 1.8V, 2.5V, 3.3V
USB USB 2.0 + PHY (1)
Supplier Device Package 689-TEPBGA II (31x31)
Speed 533MHz
Series MPC83xx
Security Features Cryptography, Random Number Generator
SATA -
RAM Controllers DDR, DDR2
Package / Case 689-BBGA Exposed Pad
Package Bulk
Operating Temperature 0°C ~ 125°C (TA)
Number of Cores/Bus Width 1 Core, 32-Bit
Mounting Type Surface Mount
Graphics Acceleration No
Ethernet 10/100/1000Mbps (2)
Display & Interface Controllers -
Core Processor PowerPC e300c4s
Co-Processors/DSP Security; SEC 3.0
Additional Interfaces DUART, I²C, MMC/SD, PCI, SPI

Packaging & ESD

Industry-standard static shielding packaging is used for electronic components.Anti-static, light-transparent materials allow easy identification of ICs and PCB assemblies.
The packaging structure provides electrostatic protection based on Faraday cage principles.This helps protect sensitive components from static discharge during handling and transportation.


All products are packed in ESD-safe anti-static packaging. Outer packaging labels include part number, brand, and quantity for clear identification. Goods are inspected prior to shipment to ensure proper condition and authenticity.

ESD protection is maintained throughout packing, handling, and global transportation. Secure packaging provides reliable sealing and resistance during transit. Additional cushioning materials are applied when required to protect sensitive components.

QC(Part Testing by IC Components)Quality Warranty

We can offer worldwide express delivery service, such as DHLor FedEx or TNT or UPS or other forwarder for shipment.

Global Shipment by DHL/FedEx/TNT/UPS

Shipping Fees reference DHL/FedEx
1). You can offer your express delivery account for shipment, ifyou haven’t any express account for shipment, we can offer our account inadvance.
2). Use our account for shipment, Shipment charges(Reference DHL/FedEx, Different Countries has different price.)
Shipment charges： (Reference DHL and FedEX)
Weight(KG): 0.00kg-1.00kg Price(USD$) : USD$60.00
Weight(KG): 1.00kg-2.00kg Price(USD$) : USD$80.00
* The price of cost is reference with DHL/FedEx. The detail charges, please contact us. Different country the express charges are different.



We accept the payment terms: Telegraphic Transfer(T/T), Credit Card, PayPal and Western Union.

PayPal:

PayPal Bank Information:
Company Name : IC COMPONENTS LTD
Paypal ID: Info@IC-Components.com

BANK TRANSFAR (Telegraphic Transfer)

Payment For Telegraphic Transfers:
Company Name : IC COMPONENTS LTD Beneficiary Account Number : 549-100669-701
Beneficiary Bank name : Bank of Communications (Hong Kong) Ltd Beneficiary Bank Code : 382 (for local payment)
Beneficiary Bank SWIFT : COMMHKHK
Beneficiary Bank Address : Tsuen Wan Market Street Branch 53 Market Street, Tsuen Wan N.T., Hong Kong

Any inquires or questions, please kindly contact us Email: Info@IC-Components.com


Frequently Asked Questions

Can the MPC8378EVRAJFA be used in a 3.3V I/O system without additional level shifting, and what are the risks of voltage mismatch on non-power pins?
The MPC8378EVRAJFA supports 1.8V, 2.5V, and 3.3V I/O voltage domains, so it can interface directly with a 3.3V system. However, only pins explicitly configured for 3.3V operation should be driven at that level; mixing voltage levels on shared buses without proper domain isolation may cause latch-up or signal integrity issues. Designers must ensure clock, control, and data lines are assigned to appropriate voltage rails during board layout and firmware configuration.
What is the impact of operating the MPC8378EVRAJFA above 100°C ambient temperature on long-term reliability, especially in industrial control applications?
While the MPC8378EVRAJFA is rated from 0°C to 125°C, sustained operation near 100°C increases electromigration risk in metal interconnects and reduces mean time between failures (MTBF). Thermal management such as adequate airflow or heatsinking is essential. For designs requiring >90% lifetime operation at high ambient temperatures, derating the junction temperature below 105°C through PCB thermal design is strongly recommended.
How does the SEC 3.0 co-processor affect boot sequence initialization, and what firmware steps are required to enable cryptographic acceleration securely?
The SEC 3.0 engine requires explicit firmware initialization before use, typically via the CPM (Communications Processor Module) driver stack. During boot, the SoC boots from internal ROM code, but enabling SEC 3.0 features demands loading signed drivers and configuring key storage. Failure to properly authenticate firmware components before invoking crypto operations can expose systems to rollback attacks or unauthorized execution paths.
Is the MPC8378EVRAJFA suitable for direct replacement of older MPC83xx models like MPC8349 in legacy embedded systems, and what compatibility considerations arise?
While both belong to the MPC83xx family, the MPC8378EVRAJFA includes enhanced security features (SEC 3.0) and different pinouts (689-TEPBGA II vs. 480-PBGA), making mechanical and electrical replacement non-trivial. Clocking, DDR timing, and reset circuitry may differ significantly. A full hardware re-layout and firmware porting effort is required, including verification of DDR2 controller compatibility and peripheral register mappings.
What are the implications of using the MPC8378EVRAJFA’s DUART and SPI interfaces simultaneously at maximum baud rates on system power consumption and EMI?
Operating both the dual UART and SPI interfaces at peak throughput increases dynamic current draw due to higher bus activity. Additionally, fast serial transitions can generate conducted and radiated emissions if traces lack proper termination or shielding. Layout techniques such as controlled impedance routing, ground stitching vias, and ferrite beads on I/O lines help mitigate EMI while maintaining signal integrity.
Can the MPC8378EVRAJFA support DDR3 memory, and if not, what DDR generation alternatives exist within the same series?
No, the MPC8378EVRAJFA only supports DDR and DDR2 memory technologies. It lacks native DDR3 PHY calibration logic and timing parameters. For DDR3 support, consider later-generation devices such as the MPC85xx series, which include integrated DDR3 controllers compliant with JEDEC standards.
What precautions should be taken when configuring the MMC/SD interface on the MPC8378EVRAJFA for industrial-grade removable media logging?
Industrial applications require robust error handling and wear-leveling awareness. The host controller must implement CRC checks, retry logic for card detection, and file system journaling to prevent corruption during sudden power loss. Additionally, SD cards should be selected for extended endurance (≥10K write cycles); consumer-grade cards are unsuitable for continuous logging scenarios.
Does the presence of an onboard RNG in the MPC8378EVRAJFA meet FIPS 140-2 Level 2 requirements for secure key generation, and what additional measures are needed?
The integrated true random number generator (TRNG) provides entropy sufficient for many cryptographic applications, but achieving FIPS 140-2 Level 2 compliance also requires tamper-evident packaging, secure key erasure routines, and validated software modules. The TRNG alone does not fulfill certification requirements—it must be part of a broader security architecture including HSM-like access controls and audit logging.
How does the absence of native SATA support limit the MPC8378EVRAJFA in storage-intensive edge computing nodes, and what alternative storage interfaces can be leveraged?
Without built-in SATA, external storage solutions must rely on USB 2.0 or PCIe-based bridges, which introduce latency and complexity. For high-throughput applications, designers can add a companion chip such as the Marvell 88SE9120 over PCIe to provide SATA connectivity, though this adds cost, power, and board space. Alternatively, NAND flash via eMMC or parallel NOR/NAND interfaces may suffice depending on bandwidth needs.
What are the thermal design implications of placing the MPC8378EVRAJFA near high-speed Ethernet PHYs in a compact embedded enclosure?
Both the microprocessor and PHYs dissipate significant heat, and proximity exacerbates local hot spots. The 689-TEPBGA package has an exposed pad that must connect to a solid ground plane for effective heat spreading. Thermal vias under the die should extend into inner layers or a bottom-side heatsink. In sealed enclosures, passive cooling may be insufficient—active fans or conduction to chassis may be necessary to maintain Tj < 110°C under full load.

Recent Reviews

Leave Comment
Hello, you have not logged in, please log in
User Login

Forgot password?

No account yet? Register now

Tips
Please speak legally
Your email will be hidden
Please complete all required fields ( denoted with* )
Mark
5.0

You May Also Be Interested In:


MPC8378EVRAJFA

Freescale Semiconductor

POWERQUICC 32 BIT POWER ARCH SOC

In Stock: 559

SUBMIT RFQ